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PREPARED BY Marcia B. Kelleher CHECKED BY Monica L. Poelking

STANDARD MICROCIRCUIT DRAWING

REVISIONS LTR A B C DESCRIPTION Changes in accordance with NOR 5962-R273-97. -bjm Changes in accordance with NOR 5962-R432-97. - rc Update boilerplate to MIL-PRF-38535 requirements. Editorial changes throughout. - jak DATE (YR-MO-DA) 97-04-04 97-08-08 03-09-22 APPROVED Monica L. Poelking Raymond Monnin Thomas M. Hess
PREPARED BY Marcia B. Kelleher CHECKED BY Monica L. Poelking
STANDARD MICROCIRCUIT DRAWING
THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N / A
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil
APPROVED BY Monica L. Poelking DRAWING APPROVAL DATE 95-12-28 REVISION LEVEL C
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, HEX INVERTER, MONOLITHIC SILICON
SIZE CAGE CODE
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DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release distribution is unlimited.
5962-E429-03
1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 R 96653 01 V X C
Device type (see 1.2.2)
Device class designator (see 1.2.3)
Case outline (see 1.2.4)
Lead finish (see 1.2.5)
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 02 Generic number 4069UB 4069UBN Circuit function Radiation hardened, CMOS, hex inverter Radiation hardened, CMOS, hex inverter with neutron irradiated die.
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class M Device requirements documentation Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter C X Descriptive designator CDIP2-T14 CDFP3-F14 Terminals 14 14 Package style Dual-in-line Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.
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Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Unless otherwise noted, all voltages are referenced to VSS. The limits for the parameters specified herein shall apply over the full specified VDD range and case temperature range of -55°C to +125°C unless otherwise noted. If device power exceeds package dissipation capability, provide heat sinking or derate linearly (the derating is based on JA) at the following rate: Case outline C.................................................... 13.5 mW / °C Case outline X.................................................... 8.6 mW / °C Guaranteed by design or process but not tested.
STANDARD MICROCIRCUIT DRAWING
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2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 MIL-STD-1835 HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 MIL-HDBK-780 List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines.
STANDARD MICROCIRCUIT DRAWING
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STANDARD MICROCIRCUIT DRAWING
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Test Supply current
Symbol IDD
Device type All
Limits Min Max 0.25 7.5 0.5 15.0 0.5 30.0 0.5 50.0 2.5 0.5 0.53 0.36 0.64 1.4 0.9 1.6 3.5 2.4 4.2 -0.53 -0.36 -0.64 -1.8 -1.15 -2.0 -1.4 -0.9 -2.6 -3.5 -2.4 -4.2
Unit µA
See footnotes at end of table.
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Test Output voltage, high
Symbol VOH
Device type All
Unit V
Negative threshold voltage Negative threshold voltage, delta Positive threshold voltage Positive threshold voltage, delta Input capacitance Functional tests
VNTH VPTH
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Test Propagation delay time
Symbol tPHL, tPLH 4 /
Device type All
Limits Min Max 110 149 149 60 50 200 270 100 80
Unit ns
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Device type Case outlines Terminal number 1 2 3 4 5 6 7 8 9 10 11 12 13 14
All C and X Terminal symbol
FIGURE 1. Terminal connections.
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4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535, including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. b. c. Tests shall be as specified in table IIA herein. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V, subgroups 7 and 8 shall include verifying the functionality of the device. Subgroup 4 (CIN measurement) shall be measured only for initial qualification and after process or design changes which may affect capacitance. CIN shall be measured between the designated terminal and GND at a frequency of 1 MHz. Tests shall be sufficient to validate the limits defined in table I herein.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
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TABLE IIA. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) 1, 7, 9 1, 2, 3, 7, 8, 9, 10, 11 1 / 1, 2, 3, 4, 7, 8, 9, 10, 11 1, 2, 3, 7, 8, 9, 10, 11 1, 7, 9 1, 7, 9 Subgroups (in accordance with MIL-PRF-38535, table III) Device class Q 1, 7, 9 1, 2, 3, 7, 8, 9, 10, 11 1 / 1, 2, 3, 4, 7, 8, 9, 10, 11 1, 2, 3, 7, 8, 9, 10, 11 1, 7, 9 1, 7, 9 Device class V 1, 7, 9 1, 2, 3, 7, 8, 9, 10, 11 2 / 3 / 1, 2, 3, 4, 7, 8, 9, 10, 11 1, 2, 3, 7, 8, 9, 10, 11 3 / 1, 7, 9 1, 7, 9
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4.4.4.5 Single event phenomena (SEP). SEP testing shall be required on class V devices (see 1.4 herein). SEP testing shall be performed on a technology process on the Standard Evaluation Circuit (SEC) or alternate SEP test vehicle as approved by the qualifying activity at initial qualification and after any design or process changes which may affect the upset or latchup characteristics. The recommended test conditions for SEP are as follows: a. The ion beam angle of incidence shall be between normal to the die surface and 60° to the normal, inclusive (i.e. 0° angle 60°). No shadowing of the ion beam due to fixturing or package related effects is allowed. The fluence shall be 100 errors or 10 ions / cm .
STANDARD MICROCIRCUIT DRAWING
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STANDARD MICROCIRCUIT DRAWING
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APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-96653 A.1 SCOPE A.1.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QM plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device Class V) are reflected in the Part or Identification Number (PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN. A.1.2 PIN. The PIN shall be as shown in the following example: 5962 R 96653 01 V 9 A
Federal Stock class designator
RHA designator (see A.1.2.1)
Device type (see A.1.2.2)
Device class designator (see A.1.2.3)
Die code
Die Details (see A.1.2.4)
Drawing Number A.1.2.1 RHA designator. Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels. A dash (-) indicates a non-RHA die. A.1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows: Device type 01 02 Generic number 4069UB 4069UBN Circuit function Radiation hardened, CMOS, hex inverter Radiation hardened, CMOS, hex inverter, neutron irradiated die
A.1.2.3 Device class designator. Device class Q or V Device requirements documentation Certification and qualification to the die requirements of MIL-PRF-38535.
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STANDARD MICROCIRCUIT DRAWING
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STANDARD MICROCIRCUIT DRAWING
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STANDARD MICROCIRCUIT DRAWING
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o DIE BONDING PAD LOCATIONS AND ELECTRICAL FUNCTIONS
NOTE: Pad numbers reflect terminal numbers when placed in case outlines C, X (see figure 1).
FIGURE A-1
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APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-96653
FIGURE A-1 - Continued.
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STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 03-09-22 Approved sources of supply for SMD 5962-96653 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535.
Standard microcircuit drawing PIN 1 / 5962R9665301VCC 5962R9665301VXC 5962R9665301V9A 5962R9665302V9A 5962R9665302VCC 5962R9665302VXC
Vendor CAGE number 34371 34371 3 / 3 / 3 / 3 /
Vendor similar PIN 2 / CD4069UBDMSR CD4069UBKMSR CD4069UBHSR CD4069UBHNSR CD4069UBDNSR CD4069UBKNSR
1 / The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed, contact the vendor to determine its availability. 2 / Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3 / No longer available from an approved source of supply. Vendor CAGE number 34371 Vendor name and address Intersil Corporation 2401 Palm Bay Blvd. P.O. Box 883 Melbourne, FL 32902-0883
The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.