Make change glassivation specified APPENDIX 99-04-15 MONNIN
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REVISIONS DESCRIPTION Make changes VIO, +IIB, -IIB, IIO, +AVOL, -AVOL, +ICC, -ICC, tests footnote three specified under TABLE DATE (YR-MO-DA) 99-03-19 APPROVED MONNIN
Make change glassivation specified APPENDIX
99-04-15
MONNIN
Replaced reference MIL-STD-973 with reference MIL-PRF-38535.
03-10-03
MONNIN
SHEET SHEET STATUS SHEETS PMIC SHEET PREPARED RICK OFFICER
STANDARD MICROCIRCUIT DRAWING
THIS DRAWING AVAILABLE DEPARTMENTS AGENCIES DEPARTMENT DEFENSE
CHECKED RAJESH PITHADIA
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil
APPROVED RAYMOND MONNIN
DRAWING APPROVAL DATE 98-10-15
MICROCIRCUIT, LINEAR, RADIATION HARDENED, POWER, PROGRAMMABLE OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
SIZE SHEET CAGE CODE
AMSC
REVISION LEVEL
67268
5962-95687
DSCC FORM 2233 DISTRIBUTION STATEMENT Approved public release; distribution unlimited.
5962-E171-03
SCOPE Scope. This drawing documents product assurance class levels consisting high reliability (device classes space application (device class choice case outlines lead finishes available reflected Part Identifying Number (PIN). When available, choice Radiation Hardness Assurance (RHA) levels reflected PIN. PIN. shown following example: 5962 95687
Federal stock class designator
designator (see 1.2.1)
Device type (see 1.2.2)
Device class designator (see 1.2.3)
Case outline (see 1.2.4)
Lead finish (see 1.2.5)
Drawing number 1.2.1 designator. Device classes marked devices meet MIL-PRF-38535 specified levels marked with appropriate designator. Device class marked devices meet MIL-PRF-38535, appendix specified levels marked with appropriate designator. dash indicates non-RHA device. 1.2.2 Device type(s). device type(s) identify circuit function follows: Device type Generic number HS-3530ARH Circuit function Radiation hardened, dielectric isolated, power programmable operational amplifier
1.2.3 Device class designator. device class designator single letter identifying product assurance level follows: Device class Device requirements documentation Vendor self-certification requirements MIL-STD-883 compliant, non-JAN class level microcircuits accordance with MIL-PRF-38535, appendix Certification qualification MIL-PRF-38535
1.2.4 Case outline(s). case outline(s) designated MIL-STD-1835 follows: Outline letter Descriptive designator MACY1-X8 CDFP3-F10 Terminals Package style Flat pack
1.2.5 Lead finish. lead finish specified MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class
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Absolute maximum ratings. Voltage between terminals Differential input voltage Voltage either input terminal. ISET (current ISET). VSET (voltage ISET) (+VS VSET Output short circuit duration Indefinite Maximum power dissipation (PD) +125°C): Case outline 0.31 Case outline 0.35 Junction temperature (TJ) +175°C Storage temperature range -65°C +150°C Lead temperature (soldering seconds). 275°C Thermal resistance, junction-to-case (JC): Case outline 70°C/W Case outline 36°C/W Thermal resistance, junction-to-ambient (JA): Case outline 160°C/W Case outline 140°C/W Recommended operating conditions. Supply voltage range (VS). Common mode input voltage (VINCM). (+VS -VS) Load resistance (RL). Ambient operating temperature range (TA). -55°C +125°C Radiation features: Maximum total dose available (dose rate rads (Si)/s) Krads (Si) APPLICABLE DOCUMENTS Government specification, standards, handbooks. following specification, standards, handbooks form part this drawing extent specified herein. Unless otherwise specified, issues these documents those listed issue Department Defense Index Specifications Standards (DoDISS) supplement thereto, cited solicitation. SPECIFICATION DEPARTMENT DEFENSE MIL-PRF-38535 Integrated Circuits, Manufacturing, General Specification for.
Stresses above absolute maximum rating cause permanent damage device. Extended operation maximum levels degrade performance affect reliability. Caution. Continuous long duration short-circuit operation degrade operating life device. These parts dose rate sensitive space environment demonstrate enhanced dose rate effects. Radiation point limits noted parameters guaranteed only conditions specified MIL-STD-883, method 1019, condition
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STANDARDS DEPARTMENT DEFENSE MIL-STD-883 MIL-STD-1835 HANDBOOKS DEPARTMENT DEFENSE MIL-HDBK-103 MIL-HDBK-780 List Standard Microcircuit Drawings. Standard Microcircuit Drawings. Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies specification, standards, handbooks available from Standardization Document Order Desk, Robbins Avenue, Building Philadelphia, 19111-5094.) Order precedence. event conflict between text this drawing references cited herein, text this drawing takes precedence. Nothing this document, however, supersedes applicable laws regulations unless specific exemption been obtained. REQUIREMENTS Item requirements. individual item requirements device classes shall accordance with MIL-PRF-38535 specified herein modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. individual item requirements device class shall accordance with MIL-PRF-38535, appendix non-JAN class level devices specified herein. 3.1.1 Microcircuit die. requirements microcircuit die, appendix this document. Design, construction, physical dimensions. design, construction, physical dimensions shall specified MIL-PRF-38535 herein device classes MIL-PRF-38535, appendix herein device class 3.2.1 Case outline(s). case outline(s) shall accordance with 1.2.4 herein. 3.2.2 Terminal connections. terminal connections shall specified figure 3.2.3 Irradiation exposure circuit. irradiation exposure circuit shall specified figure Electrical performance characteristics postirradiation parameter limits. Unless otherwise specified herein, electrical performance characteristics postirradiation parameter limits specified table shall apply over full ambient operating temperature range. Electrical test requirements. electrical test requirements shall subgroups specified table IIA. electrical tests each subgroup defined table Marking. part shall marked with listed herein. addition, manufacturer's also marked listed MIL-HDBK-103. packages where marking entire number feasible space limitations, manufacturer option marking "5962-" device. product using this option, designator shall still marked. Marking device classes shall accordance with MIL-PRF-38535. Marking device class shall accordance with MIL-PRF-38535, appendix 3.5.1 Certification/compliance mark. certification mark device classes shall "QML" required MIL-PRF-38535. compliance mark device class shall required MIL-PRF-38535, appendix
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TABLE Electrical performance characteristics. Conditions -55°C +125°C unless otherwise specified ISET M,D,P,L,R,F ISET M,D,P,L,R,F ISET M,D,P,L,R,F ISET M,D,P,L,R,F ISET M,D,P,L,R,F VOUT ISET M,D,P,L,R,F VOUT ISET M,D,P,L,R,F VOUT ISET M,D,P,L,R,F VOUT ISET M,D,P,L,R,F footnote table.
Test
Symbol
Group subgroups
Device type
Limits
Unit
Input offset voltage
Input bias current
-100
-100
Input offset current
Large signal voltage gain
+AVOL
kV/V
kV/V
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TABLE Electrical performance characteristics Continued. Conditions -55°C +125°C unless otherwise specified VOUT ISET M,D,P,L,R,F VOUT ISET M,D,P,L,R,F VOUT ISET M,D,P,L,R,F VOUT ISET M,D,P,L,R,F VOUT ISET -CMRR VOUT ISET +CMRR +1.5 VOUT -1.5 +1.5 -4.5 ISET -CMRR -1.5 VOUT +1.5 +4.5 -1.5 ISET footnotes table. 1,2,3 1,2,3 1,2,3
Test
Symbol
Group subgroups
Device type
Limits
Unit
Large signal voltage gain
-AVOL
kV/V
kV/V
Common mode rejection ratio
+CMRR
1,2,3
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TABLE Electrical performance characteristics Continued. Conditions -55°C +125°C unless otherwise specified
Test
Symbol
Group subgroups
Device type
Limits 12.5 10.5 -12.5 -10.5 -2.0
Unit
Output voltage swing
+VOUT
-VOUT
1,2,3
Output current +IOUT ISET ISET -IOUT ISET ISET Quiescent power supply current +ICC ISET IOUT M,D,P,L,R,F ISET IOUT
1,2,3 0.25
-0.25 -2.5
1,2,3
M,D,P,L,R,F ISET IOUT M,D,P,L,R,F ISET IOUT
1,2,3
M,D,P,L,R,F footnotes table.
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TABLE Electrical performance characteristics Continued. Conditions -55°C +125°C unless otherwise specified ISET IOUT M,D,P,L,R,F ISET IOUT
Test
Symbol
Group subgroups 1,2,3
Device type
Limits
Unit
Quiescent power supply current
-ICC
-150 -160 -160 -150 -160 -160
M,D,P,L,R,F ISET IOUT M,D,P,L,R,F ISET IOUT
1,2,3
M,D,P,L,R,F Power supply rejection ratio +PSRR ISET ISET +4.5 -PSRR ISET ISET -4.5 footnotes table.
1,2,3
1,2,3
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TABLE Electrical performance characteristics Continued. Conditions -55°C +125°C unless otherwise specified VOUT ISET VOUT ISET VOUT ISET VOUT ISET VOUT ISET VOUT ISET VOUT ISET VOUT ISET Rise fall time VOUT +400 ISET measured points VOUT +400 ISET measured points VOUT -400 ISET measured points VOUT -400 ISET measured points Overshoot VOUT +400 ISET VOUT -400 ISET footnotes table. 0.01 0.25 0.025 V/µs 0.01 0.25
Test
Symbol
Group subgroups
Device type
Limits
Unit
Slew rate
0.025
V/µs
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TABLE Electrical performance characteristics Continued. Conditions -55°C +125°C unless otherwise specified VPEAK ISET VPEAK ISET Quiescent power consumption Unless otherwise specified, output voltage (VOUT) source resistance (RS) load resistance (RL) Devices supplied this drawing only radiation tested parameter referencing this footnote. They meet levels irradiation, however, this device only tested level +25°C. These parts dose rate sensitive space environment demonstrate enhanced dose rate effects. Radiation point limits noted parameters guaranteed only conditions specified MIL-STD-883, method 1019, condition ISET ISET Unless otherwise specified, load capacitance (CL) gain (AVCL) load resistance (RL) tested, shall guaranteed limits specified table herein. Unless otherwise specified, load capacitance (CL) gain (AVCL) source resistance (RS) Full power bandwidth guarantee based slew rate measurement using FPBW slew rate VPEAK). Quiescent power consumption based upon quiescent supply current test maximum. load outputs. Certificate compliance. device classes certificate compliance shall required from QML-38535 listed manufacturer order supply requirements this drawing (see 6.6.1 herein). device class certificate compliance shall required from manufacturer order listed approved source supply MIL-HDBK-103 (see 6.6.2 herein). certificate compliance submitted DSCC-VA prior listing approved source supply this drawing shall affirm that manufacturer's product meets, device classes requirements MIL-PRF-38535 herein device class requirements MIL-PRF-38535, appendix herein. Certificate conformance. certificate conformance required device classes MIL-PRF-38535 device class MIL-PRF-38535, appendix shall provided with each microcircuits delivered this drawing. Notification change device class device class notification DSCC-VA change product (see herein) involving devices acquired this drawing required change defined MIL-PRF-38535, appendix Verification review device class device class DSCC, DSCC's agent, acquiring activity retain option review manufacturer's facility applicable required documentation. Offshore documentation shall made available onshore option reviewer. 3.10 Microcircuit group assignment device class Device class devices covered this drawing shall microcircuit group number (see MIL-PRF-38535, appendix VOUT IOUT ISET 1,2,3
Test
Symbol
Group subgroups
Device type
Limits
Unit
Full power bandwidth
FPBW
0.39
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Device type Case outlines Terminal number OFFSET NULL -INPUT +INPUT OFFSET NULL OUTPUT ISET
Terminal symbol OFFSET NULL -INPUT +INPUT OFFSET NULL OUTPUT ISET
connected
FIGURE Terminal connections.
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NOTE: Group inspection conducted parts assembled case outline only.
FIGURE Irradiation circuit.
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QUALITY ASSURANCE PROVISIONS Sampling inspection. device classes sampling inspection procedures shall accordance with MIL-PRF-38535 modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. device class sampling inspection procedures shall accordance with MIL-PRF-38535, appendix Screening. device classes screening shall accordance with MIL-PRF-38535, shall conducted devices prior qualification technology conformance inspection. device class screening shall accordance with method 5004 MIL-STD-883, shall conducted devices prior quality conformance inspection. 4.2.1 Additional criteria device class Burn-in test, method 1015 MIL-STD-883. Test condition test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015. +125°C, minimum. Interim final electrical test parameters shall specified table herein.
4.2.2 Additional criteria device classes burn-in test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. burn-in test circuit shall maintained under document revision level control device manufacturer's Technology Review Board (TRB) accordance with MIL-PRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015 MIL-STD-883. Interim final electrical test parameters shall specified table herein. Additional screening device class beyond requirements device class shall specified MIL-PRF-38535, appendix modified plan.
Qualification inspection device classes Qualification inspection device classes shall accordance with MIL-PRF-38535. Inspections performed shall those specified MIL-PRF-38535 herein groups inspections (see 4.4.1 through 4.4.4). Conformance inspection. Technology conformance inspection classes shall accordance with MILPRF-38535 specified plan including groups inspections specified herein. Quality conformance inspection device class shall accordance with MIL-PRF-38535, appendix specified herein. Inspections performed device class shall those specified method 5005 MIL-STD-883 herein groups inspections (see 4.4.1 through 4.4.4). 4.4.1 Group inspection. Tests shall specified table herein. Subgroups table method 5005 MIL-STD-883 shall omitted.
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TABLE IIA. Electrical test requirements. Test requirements Subgroups accordance with MIL-STD-883, method 5005, table Device class Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group test requirements (see 4.4) Group end-point electrical parameters (see 4.4) Group end-point electrical parameters (see 4.4) Group end-point electrical parameters (see 4.4) 1,4,9 1,2,3,4,5,6,9 1,2,3,4,5,6,9 1,2,3,4,5,6,9 1,4,9 1,4,9 Subgroups accordance with MIL-PRF-38535, table III) Device class 1,4,9 1,2,3,4, 4,5,6,9 1,2,3,4,5,6,9 1,2,3,4,5,6,9 1,4,9 1,4,9 Device class 1,4,9 1,2,3, 4,5,6,9 1,2,3,4,5,6,9 1,2,3, 4,5,6,9 1,4,9 1,4,9
applies subgroup class applies subgroup Delta limits specified table shall required where specified, delta limits shall computed with reference zero hour electrical parameters (see Table
Table IIB. Burn-in operating life test delta parameters. +25°C). Parameter Input offset voltage Symbol ±IIB Conditions ISET ISET Delta limits ±1.5
Input bias current
4.4.2 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.2.1 Additional criteria device class Steady-state life test conditions, method 1005 MIL-STD-883: Test condition test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005 MIL-STD-883. +125°C, minimum. Test duration: 1,000 hours, except permitted method 1005 MIL-STD-883.
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4.4.2.2 Additional criteria device classes steady-state life test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. test circuit shall maintained under document revision level control device manufacturer's accordance with MIL-PRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005 MIL-STD-883. 4.4.3 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.4 Group inspection. Group inspection required only parts intended marked radiation hardness assured (see herein). End-point electrical parameters shall specified table herein. device classes devices test vehicle shall subjected radiation hardness assured tests specified MIL-PRF-38535 level being tested. device class devices shall subjected radiation hardness assured tests specified MIL-PRF-38535, appendix level being tested. device classes must meet postirradiation end-point electrical parameter limits defined table +25°C ±5°C, after exposure, subgroups specified table herein. When specified purchase order contract, copy delta limits shall supplied.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall performed accordance with MIL-STD-883 method 1019, condition specified herein. 4.4.4.1.1 Accelerated aging test. Accelerated aging tests shall performed devices requiring level greater than rads(Si). post-anneal end-point electrical parameter limits shall specified table herein shall pre-irradiation end-point electrical parameter limit 25°C ±5°C. Testing shall performed initial qualification after design process changes which affect response device. PACKAGING Packaging requirements. requirements packaging shall accordance with MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class NOTES Intended use. Microcircuits conforming this drawing intended Government microcircuit applications (original equipment), design applications, logistics purposes. 6.1.1 Replaceability. Microcircuits covered this drawing will replace same generic device covered contractor prepared specification drawing. 6.1.2 Substitutability. Device class devices will replace device class devices.
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Configuration control SMD's. proposed changes existing SMD's will coordinated with users record individual documents. This coordination will accomplished using Form 1692, Engineering Change Proposal. Record users. Military industrial users should inform Defense Supply Center Columbus when system application requires configuration control which SMD's applicable that system. DSCC will maintain record users this list will used coordination distribution changes drawings. Users drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. Comments. Comments this drawing should directed DSCC-VA Columbus, Ohio 43216-5000, telephone (614) 692-0547. Abbreviations, symbols, definitions. abbreviations, symbols, definitions used herein defined MIL-PRF-38535 MIL-HDBK-1331. Sources supply. 6.6.1 Sources supply device classes Sources supply device classes listed QML-38535. vendors listed QML-38535 have submitted certificate compliance (see herein) DSCC-VA have agreed this drawing. 6.6.2 Approved sources supply device class Approved sources supply class listed MIL-HDBK-103. vendors listed MIL-HDBK-103 have agreed this drawing certificate compliance (see herein) been submitted accepted DSCC-VA.
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APPENDIX APPENDIX FORMS PART 5962-95687
SCOPE 10.1 Scope. This appendix establishes minimum requirements microcircuit supplied under Qualified Manufacturers List (QML) Program. microcircuit meeting requirements MIL-PRF-38535 manufacturers approved plan monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, devices using chip wire designs accordance with MIL-PRF-38534 specified herein. product assurance classes consisting military high reliability (device class space application (device Class reflected Part Identification Number (PIN). When available choice Radiation Hardness Assurance (RHA) levels reflected PIN. 10.2 PIN. shown following example: 5962 95687
Federal stock class designator
designator (see 10.2.1)
Device type (see 10.2.2)
Device class designator (see 10.2.3)
code
Details (see 10.2.4)
Drawing number 10.2.1 designator. Device classes identified shall meet MIL-PRF-38535 specified levels. dash indicates non-RHA die. 10.2.2 Device type(s). device type(s) shall identify circuit function follows: Device type 10.2.3 Device class designator. Device class Device requirements documentation Certification qualification requirements MIL-PRF-38535 Generic number HS-3530ARH Circuit function Radiation hardened, power, programmable operational amplifier
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APPENDIX APPENDIX FORMS PART 5962-95687 10.2.4. Details. details designation shall unique letter which designates die's physical dimensions, bonding location(s) related electrical function(s), interface materials, other assembly related information, each product variant supplied this appendix. 10.2.4.1 physical dimensions. type 10.2.4.2. bonding locations electrical functions. type 10.2.4.3. Interface materials. type 10.2.4.4. Assembly related information. type Figure number Figure number Figure number Figure number
10.3. Absolute maximum ratings. paragraph within body this drawing details. 10.4 Recommended operating conditions. paragraph within body this drawing details.
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APPENDIX APPENDIX FORMS PART 5962-95687 APPLICABLE DOCUMENTS. 20.1 Government specifications, standards, handbooks. Unless otherwise specified, following specification, standard, handbook issue listed that issue Department Defense Index Specifications Standards specified solicitation, form part this drawing extent specified herein. SPECIFICATION DEPARTMENT DEFENSE MIL-PRF-38535 Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT DEFENSE MIL-STD-883 HANDBOOK DEPARTMENT DEFENSE MIL-HDBK-103 List Standard Microcircuit Drawings (SMD's). (Copies specification, standard, handbook required manufacturers connection with specific acquisition functions should obtained from contracting activity directed contracting activity). 20.2. Order precedence. event conflict between text this drawing references cited herein, text this drawing shall take precedence. REQUIREMENTS 30.1 Item requirements. individual item requirements device classes shall accordance with MIL-PRF-38535 specified herein modified device manufacturer's Quality Management (QM) plan. modification plan shall effect form, function described herein. 30.2 Design, construction physical dimensions. design, construction physical dimensions shall specified MIL-PRF-38535 manufacturer's plan, device classes herein. 30.2.1 physical dimensions. physical dimensions shall specified 10.2.4.1 figure A-1. 30.2.2 bonding locations electrical functions. bonding locations electrical functions shall specified 10.2.4.2 figure A-1. 30.2.3 Interface materials. interface materials shall specified 10.2.4.3 figure A-1. 30.2.4 Assembly related information. assembly related information shall specified 10.2.4.4 figure A-1. 30.2.5 Radiation exposure circuit. radiation exposure circuit shall defined within paragraph 3.2.3 body this document. Test Method Standard Microcircuits.
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APPENDIX APPENDIX FORMS PART 5962-95687 30.3 Electrical performance characteristics post-irradiation parameter limits. Unless otherwise specified herein, electrical performance characteristics post-irradiation parameter limits specified table body this document. 30.4 Electrical test requirements. wafer probe test requirements shall include functional parametric testing sufficient make packaged capable meeting electrical performance requirements table 30.5 Marking. minimum, each unique die, loaded single multiple stack carriers, shipment customer, shall identified with wafer number, certification mark, manufacturer's identification listed 10.2 herein. certification mark shall "QML" required MIL-PRF-38535. 30.6 Certification compliance. device classes certificate compliance shall required from QML38535 listed manufacturer order supply requirements this drawing (see 60.4 herein). certificate compliance submitted DSCC-VA prior listing approved source supply this appendix shall affirm that manufacturer's product meets, device classes requirements MIL-PRF-38535 requirements herein. 30.7 Certificate conformance. certificate conformance required device classes MIL-PRF-38535 shall provided with each microcircuit delivered this drawing. QUALITY ASSURANCE PROVISIONS 40.1 Sampling inspection. device classes sampling inspection procedures shall accordance with MIL-PRF-38535 modified device manufacturer's Quality Management (QM) plan. modifications plan shall effect form, function described herein. 40.2 Screening. device classes screening shall accordance with MIL-PRF-38535, defined manufacturer's plan. minimum shall consist Wafer acceptance Class product using criteria defined within MIL-STD-883 test method 5007. 100% wafer probe (see paragraph 30.4). 100% internal visual inspection applicable class criteria defined within MIL-STD-883 test method 2010 alternate procedures allowed within MIL-STD-883 test method 5004.
40.3 Conformance inspection. 40.3.1 Group inspection. Group inspection required only parts intended identified radiation assured (see 30.5 herein). levels device classes shall specified MIL-PRF-38535. point electrical testing packaged shall specified table herein. Group tests conditions specified within paragraphs 4.4.4.1, 4.4.4.1.1. CARRIER 50.1 carrier requirements. requirements carrier shall accordance with manufacturer's plan specified purchase order acquiring activity. carrier shall provide adequate physical, mechanical electrostatic protection.
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APPENDIX APPENDIX FORMS PART 5962-95687 NOTES 60.1 Intended use. Microcircuit conforming this drawing intended microcircuits built accordance with MIL-PRF-38535 MIL-PRF-38534 government microcircuit applications (original equipment), design applications logistics purposes. 60.2 Comments. Comments this appendix should directed DSCC-VA, Columbus, Ohio, 43216-5000 telephone (614)-692-0536. 60.3 Abbreviations, symbols definitions. abbreviations, symbols, definitions used herein defined within MIL-PRF-38535 MIL-STD-1331. 60.4 Sources supply device classes Sources supply device classes listed QML-38535. vendors listed within QML-38535 have submitted certificate compliance (see 30.6 herein) DSCC-VA have agreed this drawing.
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APPENDIX APPENDIX FORMS PART 5962-95687
bonding locations electrical functions physical dimensions. size: 1720 microns 1390 microns thickness: mils Interface materials. metallization: 16.0 Backside metallization: None Glassivation. Type: Thickness: ±1.0 Substrate: Dielectric Isolation (DI) Assembly related information. Substrate potential: Insulator Special assembly instructions: None FIGURE A-1. bonding locations electrical functions.
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STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 03-10-03 Approved sources supply 5962-95687 listed below immediate acquisition information only shall added MIL-HDBK-103 QML-38535 during next revision. MIL-HDBK-103 QML-38535 will revised include addition deletion sources. vendors listed below have agreed this drawing certificate compliance been submitted accepted DSCC-VA. This bulletin superseded next dated revision MIL-HDBK-103 QML-38535.
Standard microcircuit drawing 5962F9568701QGA 5962F9568701VGA 5962F9568701VXC 5962F9568701V9A
Vendor CAGE number 34371 34371 34371 34371
Vendor similar HS2-3530ARH-8 HS2-3530ARH-Q HS9-3530ARH-Q HS0-3530ARH-Q
lead finish shown each representing hermetic package most readily available from manufacturer listed that part. desired lead finish listed contact vendor determine availability. Caution. this number item acquisition. Items acquired this number satisfy performance requirements this drawing.
Vendor CAGE number 34371
Vendor name address Intersil 2401 Palm Blvd Melbourne, 32902-0883
information contained herein disseminated convenience only Government assumes liability whatsoever inaccuracies information bulletin.
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