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REVISIONS DESCRIPTION Make changes tT1, TDP, VPAUX, tT2, tests switch footnotes specified under table DATE (YR-MO-DA) 00-08-21 APPROVED MONNIN
Make changes specified under ICCS, tT1, tests specified table
00-09-20
MONNIN
Make correction description specified figure
01-12-14
MONNIN
Make changes table added footnote table
03-06-19
MONNIN
SHEET SHEET STATUS SHEETS PMIC SHEET PREPARED RICK OFFICER
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THIS DRAWING AVAILABLE DEPARTMENTS AGENCIES DEPARTMENT DEFENSE
CHECKED RAJESH PITHADIA
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil
APPROVED RAYMOND MONNIN
DRAWING APPROVAL DATE 00-07-26
MICROCIRCUIT, DIGITAL-LINEAR, RADIATION HARDENED, COMPLEMENTARY SWITCH DRIVER, MONOLITHIC SILICON
AMSC
REVISION LEVEL
SIZE SHEET
CAGE CODE
67268
5962-00521
DSCC FORM 2233 DISTRIBUTION STATEMENT Approved public release; distribution unlimited.
5962-E446-03
SCOPE Scope. This drawing documents three product assurance class levels consisting high reliability (device classes space application (device class appropriate satellite similar applications (device class choice case outlines lead finishes available reflected Part Identifying Number (PIN). When available, choice Radiation Hardness Assurance (RHA) levels reflected PIN. device class user encouraged review manufacturer's Quality Management (QM) plan part their evaluation these parts their acceptability intended application. PIN. shown following example: 5962 Federal stock class designator designator (see 1.2.1) Drawing number 1.2.1 designator. Device classes marked devices meet MIL-PRF-38535 specified levels marked with appropriate designator. Device class marked devices meet MIL-PRF-38535, appendix specified levels marked with appropriate designator. dash indicates non-RHA device. 1.2.2 Device type(s). device type(s) identify circuit function follows: Device type Generic number IS-1715ARH Circuit function Radiation hardened, complementary switch field effect transistor (FET) driver 00521 Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5)
1.2.3 Device class designator. device class designator single letter identifying product assurance level follows: Device class Device requirements documentation Vendor self-certification requirements MIL-STD-883 compliant, non-JAN class level microcircuits accordance with MIL-PRF-38535, appendix Certification qualification MIL-PRF-38535 Certification qualification MIL-PRF-38535 with performance specified device manufacturers approved quality management plan.
1.2.4 Case outline(s). case outline(s) designated MIL-STD-1835 follows: Outline letter Descriptive designator CDFP4-F16 Terminals Package style Flat pack
1.2.5 Lead finish. lead finish specified MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class
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Absolute maximum ratings. Supply voltage range (VCC) input voltage range (VIN) Junction temperature (TJ) +175°C Storage temperature range -65°C +150°C Lead temperature (soldering, seconds) +265°C Thermal resistance, junction-to-case (JC) 18°C/W Thermal resistance, junction-to-ambient (JA) 90°C/W Recommended operating conditions. Supply voltage range (VCC) Ambient operating temperature range (TA) -55°C +125°C Radiation features effective number upsets MeV/(cm /mg) Maximum total dose available (dose rate rads(Si) Device classes Rads Device class Rads Dose rate latch-up None APPLICABLE DOCUMENTS Government specification, standards, handbooks. following specification, standards, handbooks form part this drawing extent specified herein. Unless otherwise specified, issues these documents those listed issue Department Defense Index Specifications Standards (DoDISS) supplement thereto, cited solicitation. SPECIFICATION DEPARTMENT DEFENSE MIL-PRF-38535 Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT DEFENSE MIL-STD-883 MIL-STD-1835 Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines.
Stresses above absolute maximum rating cause permanent damage device. Extended operation maximum levels degrade performance affect reliability. These parts dose rate sensitive space environment demonstrate enhanced dose rate effects. Radiation point limits noted parameters guaranteed only conditions specified MIL-STD-883, method 1019, condition Guaranteed design process tested.
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HANDBOOKS DEPARTMENT DEFENSE MIL-HDBK-103 MIL-HDBK-780 List Standard Microcircuit Drawings. Standard Microcircuit Drawings.
(Unless otherwise indicated, copies specification, standards, handbooks available from Standardization Document Order Desk, Robbins Avenue, Building Philadelphia, 19111-5094.) Order precedence. event conflict between text this drawing references cited herein, text this drawing takes precedence. Nothing this document, however, supersedes applicable laws regulations unless specific exemption been obtained. REQUIREMENTS Item requirements. individual item requirements device classes shall accordance with MIL-PRF-38535 specified herein modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. individual item requirements device class shall accordance with MIL-PRF-38535, appendix non-JAN class level devices specified herein. 3.1.1 Microcircuit die. requirements microcircuit die, appendix this document. Design, construction, physical dimensions. design, construction, physical dimensions shall specified MIL-PRF-38535 herein device classes MIL-PRF-38535, appendix herein device class 3.2.1 Case outline. case outline shall accordance with 1.2.4 herein. 3.2.2 Terminal connections. terminal connections shall specified figure 3.2.3 Radiation exposure circuit. radiation exposure circuit shall specified figure Electrical performance characteristics post irradiation parameter limits. Unless otherwise specified herein, electrical performance characteristics post irradiation parameter limits specified table shall apply over full ambient operating temperature range. Electrical test requirements. electrical test requirements shall subgroups specified table IIA. electrical tests each subgroup defined table Marking. part shall marked with listed herein. addition, manufacturer's also marked listed MIL-HDBK-103. packages where marking entire number feasible space limitations, manufacturer option marking "5962-" device. product using this option, designator shall still marked. Marking device classes shall accordance with MIL-PRF-38535. Marking device class shall accordance with MIL-PRF-38535, appendix 3.5.1 Certification/compliance mark. certification mark device classes shall "QML" required MIL-PRF-38535. compliance mark device class shall required MIL-PRF-38535, appendix Certificate compliance. device classes certificate compliance shall required from QML-38535 listed manufacturer order supply requirements this drawing (see 6.6.1 herein). device class certificate compliance shall required from manufacturer order listed approved source supply MILHDBK-103 (see 6.6.2 herein). certificate compliance submitted DSCC-VA prior listing approved source supply this drawing shall affirm that manufacturer's product meets, device classes requirements MIL-PRF-38535 herein device class requirements MIL-PRF-38535, appendix herein.
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TABLE Electrical performance characteristics. Conditions -55°C +125°C ENBL unless otherwise specified OVERALL section Operating voltage range M,D,P,L,R,F Input current, nominal M,D,P,L,R,F Input current, sleep mode ICCS ENBLE M,D,P,L,R,F Under voltage, rising threshold M,D,P,L,R,F Under voltage, falling threshold UVM,D,P,L,R,F Under voltage delta M,D,P,L,R,F Power driver (PWR) section turn-on output, VPPWR ENBL IOUT M,D,P,L,R,F output low, saturation VPWR INPUT IOUT M,D,P,L,R,F INPUT IOUT M,D,P,L,R,F 1,2,3 1,2,3 1,2,3 1,2,3 1,2,3 1,2,3 1,2,3 1,2,3 1,2,3
Test
Symbol
Group subgroups
Device type
Limits
Unit
footnotes table.
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TABLE Electrical performance characteristics Continued. Conditions -55°C +125°C ENBL unless otherwise specified Power driver (PWR) section continued. output high, saturation VPWR INPUT IOUT M,D,P,L,R,F INPUT IOUT -100 M,D,P,L,R,F Rise time 2200 M,D,P,L,R,F Fall time 2200 M,D,P,L,R,F input delay, INPUT rising edge, M,D,P,L,R,F INPUT rising edge, M,D,P,L,R,F propagation delay INPUT falling edge points M,D,P,L,R,F 9,10,11 1300 9,10,11 1300 9,10,11 9,10,11 9,10,11 1,2,3 1,2,3
Test
Symbol
Group subgroups
Device type
Limits
Unit
footnotes table.
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TABLE Electrical performance characteristics Continued. Conditions -55°C +125°C ENBL unless otherwise specified Auxiliary (AUX) section. turn-on output, VPAUX ENBL IOUT M,D,P,L,R,F output low, saturation VAUX INPUT IOUT M,D,P,L,R,F INPUT IOUT M,D,P,L,R,F output low, saturation VAUX INPUT IOUT M,D,P,L,R,F INPUT IOUT -100 M,D,P,L,R,F Rise time 2200 M,D,P,L,R,F Fall time 2200 M,D,P,L,R,F input delay, INPUT rising edge, M,D,P,L,R,F INPUT rising edge, M,D,P,L,R,F propagation delay INPUT falling edge points 9,10,11 9,10,11 9,10,11 9,10,11 9,10,11 1,2,3 1,2,3 1,2,3 1,2,3 1,2,3
Test
Symbol
Group subgroups
Device type
Limits
Unit
M,D,P,L,R,F
footnotes table.
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TABLE Electrical performance characteristics Continued. Conditions -55°C +125°C ENBL unless otherwise specified ENABLE section Input threshold voltage M,D,P,L,R,F Input current high ENABLE M,D,P,L,R,F Input current ENABLE M,D,P,L,R,F input section Current limit T1CL input M,D,P,L,R,F Nominal voltage T1NV M,D,P,L,R,F Minimum delay T1DM M,D,P,L,R,F input section Current limit T2CL input M,D,P,L,R,F Nominal voltage T2NV M,D,P,L,R,F Minimum delay T2DM M,D,P,L,R,F 1,2,3 1,2,3 9,10,11 -5.5 -5.5 -2.1 -2.1 1,2,3 1,2,3 9,10,11 -5.5 -5.5 -1.6 -1.6 1,2,3 1,2,3 1,2,3
Test
Symbol
Group subgroups
Device type
Limits
Unit
footnotes table.
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TABLE Electrical performance characteristics Continued. Conditions -55°C +125°C ENBL unless otherwise specified INPUT section Input threshold voltage M,D,P,L,R,F Input current high INPUT M,D,P,L,R,F Input current INPUT M,D,P,L,R,F 1,2,3 1,2,3 1,2,3
Test
Symbol
Group subgroups
Device type
Limits
Unit
Devices supplied this drawing have been characterized through levels irradiation (classes levels class However, this device (classes only tested level class only tested level. Post irradiation values identical unless otherwise specified Table When performing post irradiation electrical measurements level, +25°C (see herein). These parts dose rate sensitive space environment demonstrate enhanced dose rate effects. Radiation point limits noted parameters guaranteed only conditions specified MIL-STD-883, method 1019, condition delay defined time between transition point (PWR) transition point (AUX) with capacitive load either output. Propagation delays measured from point input signal point output signal's transition with load outputs.
Certificate conformance. certificate conformance required device classes MIL-PRF-38535 device class MIL-PRF-38535, appendix shall provided with each microcircuits delivered this drawing. Notification change device class device class notification DSCC-VA change product (see herein) involving devices acquired this drawing required change defined MIL-PRF-38535, appendix Verification review device class device class DSCC, DSCC's agent, acquiring activity retain option review manufacturer's facility applicable required documentation. Offshore documentation shall made available onshore option reviewer. 3.10 Microcircuit group assignment device class Device class devices covered this drawing shall microcircuit group number (see MIL-PRF-38535, appendix
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Device type Case outline Terminal number
Terminal symbol INPUT ENABLE
FIGURE Terminal connections.
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Symbol
Description connection Chip positive supply Output. switches immediately (neglecting propagation delay) INPUT's falling edge delayed after rising edge value resistance capable sinking sourcing peak gate drive current. During sleep mode, active low. Chip negative supply. Chip negative supply. Output. switches immediately (neglecting propagation delay) INPUT's rising edge delayed after falling edge before switching value resistance capable sinking sourcing peak gate drive current. During sleep mode, active low. connection connection connection Chip supply Input. resistor ground programs time delay between switch turn-off turn-on. Chip negative supply. Chip negative supply. Input. INPUT switches logic levels allowable range from allowing direct connection most common controller outputs. rising edge immediately switches output, initiates timing delay, before switching output. Similarly, INPUT falling edge immediately turns output initiates timing delay, before switching output. Input. resistor ground programs time delay between switch turn-off turn-on. Input. ENABLE input switches logic levels, allowable range from VCC. ENABLE input will place device into sleep mode when logic low. current into during sleep mode typically
INPUT
ENABLE
FIGURE Terminal connections Continued.
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NOTES:
FIGURE Radiation exposure circuit.
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QUALITY ASSURANCE PROVISIONS Sampling inspection. device classes sampling inspection procedures shall accordance with MIL-PRF-38535 modified device manufacturer's Quality Management (QM) plan, including screening (4.2), qualification (4.3), conformance inspection (4.4). modification plan shall affect form, fit, function described herein. device class sampling inspection procedures shall accordance with MIL-PRF-38535 device manufacturer's plan, including screening, qualification, conformance inspection. performance envelope reliability information shall specified manufacturer's plan. device class sampling inspection procedures shall accordance with MIL-PRF-38535, appendix Screening. device classes screening shall accordance with MIL-PRF-38535, shall conducted devices prior qualification technology conformance inspection. device class screening shall accordance with method 5004 MIL-STD-883, shall conducted devices prior quality conformance inspection. device class screening shall accordance with device manufacturer's Quality Management (QM) plan, shall conducted devices prior qualification technology conformance inspection. 4.2.1 Additional criteria device class Burn-in test, method 1015 MIL-STD-883. Test condition test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015. +125°C, minimum. Interim final electrical test parameters shall specified table herein.
4.2.2 Additional criteria device classes burn-in test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. burn-in test circuit shall maintained under document revision level control device manufacturer's Technology Review Board (TRB) accordance with MIL-PRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015 MIL-STD-883. device classes interim final electrical test parameters shall specified table herein. Additional screening device class beyond requirements device class shall specified MIL-PRF-38535, appendix
Qualification inspection device classes Qualification inspection device classes shall accordance with MIL-PRF-38535. Qualification inspection device class shall accordance with device manufacturer's Quality Management (QM) plan. Inspections performed shall those specified MIL-PRF-38535 herein groups inspections (see 4.4.1 through 4.4.4). Conformance inspection. Technology conformance inspection classes shall accordance with MILPRF-38535 specified plan including groups inspections specified herein. Quality conformance inspection device class shall accordance with MIL-PRF-38535, appendix specified herein. Inspections performed device class shall those specified method 5005 MIL-STD-883 herein groups inspections (see 4.4.1 through 4.4.4).
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TABLE IIA. Electrical test requirements. Test requirements Subgroups accordance with MIL-STD-883, method 5005, table Device class Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group test requirements (see 4.4) Group end-point electrical parameters (see 4.4) Group end-point electrical parameters (see 4.4) Group end-point electrical parameters (see 4.4) -1,2,3,9,10,11 1,2,3,9,10,11 1,2,3,9,10,11 1,2,3,9, 10,11 1,2,3,9,10,11 1,2,3,9,10,11 Device class 1,2,3,9, 10,11 1,2,3,9,10,11 1,2,3,9, 10,11 Subgroups accordance with MIL-PRF-38535, table III) Device class Device class specified plan
applies subgroup applies subgroups deltas. Delta limits (see table IIB) shall required delta values shall computed with reference zero hour electrical parameters (see table
TABLE IIB. Burn-in delta parameters (+25°C). Parameters Input current, nominal Input current, Symbol Delta limits ±100 ±1.0
4.4.1 Group inspection. Tests shall specified table herein.
Subgroups table method 5005 MIL-STD-883 shall omitted. 4.4.2 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.2.1 Additional criteria device class Steady-state life test conditions, method 1005 MIL-STD-883: Test condition test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005 MIL-STD-883. +125°C, minimum. Test duration: 1,000 hours, except permitted method 1005 MIL-STD-883.
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4.4.2.2 Additional criteria device classes steady-state life test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF38535. test circuit shall maintained under document revision level control device manufacturer's accordance with MIL-PRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005 MIL-STD-883. 4.4.3 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.4 Group inspection. Group inspection required only parts intended marked radiation hardness assured (see herein). levels device classes shall specified MIL-PRF-38535. End-point electrical parameters shall specified table herein. device class requirements shall accordance with Class Radiation Requirements MIL-PRF-38535. end-point electrical parameters device class shall specified Table Group subgroups, modified plan. 4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall performed accordance with MIL-STD-883 method 1019, condition specified herein. device class total dose requirements shall accordance with class radiation requirements MIL-PRF-38535. 4.4.4.1.1 Accelerated aging test. Accelerated aging tests shall performed devices requiring level greater than rads(Si). post-anneal end-point electrical parameter limits shall specified table herein shall pre-irradiation end-point electrical parameter limit 25°C ±5°C. Testing shall performed initial qualification after design process changes which affect response device. 4.4.4.2 Dose rate induced latchup testing. Dose rate induced latchup testing shall performed accordance with test method 1020 MIL-STD-883 specified herein (see herein). Tests shall performed devices, SEC, approved test structures technology qualification after design process changes which effect capability process. 4.4.4.3 Single event phenomena (SEP). When specified purchase order contract testing shall required class devices (see herein). testing shall performed technology process Standard Evaluation Circuit (SEC) alternate test vehicle approved qualifying activity initial qualification after design process changes which affect upset latchup characteristics. recommended test conditions follows: beam angle incidence shall between normal surface normal, inclusive (i.e. angle 60°). shadowing beam fixturing package related effects allowed. fluence shall errors ions/cm flux shall between ions/cm cross-section shall verified flux independent measuring cross-section flux rates which differ least order magnitude. particle range shall micron silicon. test temperature shall +25°C maximum rated operating temperature ±10°C. Bias conditions shall defined manufacturer latchup measurements. Test four devices with zero failures.
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PACKAGING Packaging requirements. requirements packaging shall accordance with MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class NOTES Intended use. Microcircuits conforming this drawing intended Government microcircuit applications (original equipment), design applications, logistics purposes. 6.1.1 Replaceability. Microcircuits covered this drawing will replace same generic device covered contractor prepared specification drawing. 6.1.2 Substitutability. Device class devices will replace device class devices. Configuration control SMD's. proposed changes existing SMD's will coordinated with users record individual documents. This coordination will accomplished using Form 1692, Engineering Change Proposal. Record users. Military industrial users should inform Defense Supply Center Columbus when system application requires configuration control which SMD's applicable that system. DSCC will maintain record users this list will used coordination distribution changes drawings. Users drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. Comments. Comments this drawing should directed DSCC-VA Columbus, Ohio 43216-5000, telephone (614) 692-0547. Abbreviations, symbols, definitions. abbreviations, symbols, definitions used herein defined MIL-PRF-38535 MIL-HDBK-1331. Sources supply. 6.6.1 Sources supply device classes Sources supply device classes listed QML-38535. vendors listed QML-38535 have submitted certificate compliance (see herein) DSCC-VA have agreed this drawing. 6.6.2 Approved sources supply device class Approved sources supply class listed MIL-HDBK-103. vendors listed MIL-HDBK-103 have agreed this drawing certificate compliance (see herein) been submitted accepted DSCC-VA.
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APPENDIX APPENDIX FORMS PART 5062-00521 SCOPE 10.1 Scope. This appendix establishes minimum requirements microcircuit supplied under Qualified Manufacturers List (QML) Program. microcircuit meeting requirements MIL-PRF-38535 manufacturers approved plan monolithic microcircuits, multi-chip modules (MCMs), hybrids, electronic modules, devices using chip wire designs accordance with MIL-PRF-38534 specified herein. product assurance classes consisting military high reliability (device class space application (device Class reflected Part Identification Number (PIN). When available choice Radiation Hardiness Assurance (RHA) levels reflected PIN. 10.2 PIN. shown following example: 5962 Federal stock class designator designator (see 10.2.1) Drawing number 10.2.1 designator. Device classes identified shall meet MIL-PRF-38535 specified levels. dash indicates non-RHA die. 10.2.2 Device type(s). device type(s) shall identify circuit function follows: Device type 10.2.3 Device class designator. Device class Device requirements documentation Certification qualification requirements MIL-PRF-38535 Generic number IS-1715ARH Circuit function Radiation hardened complementary switch field effect transistor (FET) driver 00521 Device type (see 10.2.2) Device class designator (see 10.2.3) code Details (see 10.2.4)
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APPENDIX APPENDIX FORMS PART 5962-00521 10.2.4. Details. details designation shall unique letter which designates die's physical dimensions, bonding location(s) related electrical function(s), interface materials, other assembly related information, each product variant supplied this appendix. 10.2.4.1 physical dimensions. type 10.2.4.2. bonding locations electrical functions. type 10.2.4.3. Interface materials. type 10.2.4.4. Assembly related information. type Figure number Figure number Figure number Figure number
10.3. Absolute maximum ratings. paragraph within body this drawing details. 10.4 Recommended operating conditions. paragraph within body this drawing details.
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APPENDIX APPENDIX FORMS PART 5962-00521 APPLICABLE DOCUMENTS. 20.1 Government specifications, standards, handbooks. Unless otherwise specified, following specification, standard, handbook issue listed that issue Department Defense Index Specifications Standards specified solicitation, form part this drawing extent specified herein. SPECIFICATION DEPARTMENT DEFENSE MIL-PRF-38535 Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT DEFENSE MIL-STD-883 HANDBOOK DEPARTMENT DEFENSE MIL-HDBK-103 List Standard Microcircuit Drawings. (Copies specification, standard, handbook required manufacturers connection with specific acquisition functions should obtained from contracting activity directed contracting activity). 20.2. Order precedence. event conflict between text this drawing references cited herein, text this drawing shall take precedence. REQUIREMENTS 30.1 Item requirements. individual item requirements device classes shall accordance with MIL-PRF-38535 specified herein modified device manufacturer's Quality Management (QM) plan. modification plan shall effect form, function described herein. 30.2 Design, construction physical dimensions. design, construction physical dimensions shall specified MIL-PRF-38535 manufacturer's plan, device classes herein. 30.2.1 physical dimensions. physical dimensions shall specified 10.2.4.1 figure A-1. 30.2.2 bonding locations electrical functions. bonding locations electrical functions shall specified 10.2.4.2 figure A-1. 30.2.3 Interface materials. interface materials shall specified 10.2.4.3 figure A-1. 30.2.4 Assembly related information. assembly related information shall specified 10.2.4.4 figure A-1. 30.2.5 Radiation exposure circuit. radiation exposure circuit shall defined within paragraph 3.2.3 body this document. Test Method Standard Microcircuits.
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APPENDIX APPENDIX FORMS PART 5962-00521 30.3 Electrical performance characteristics post irradiation parameter limits. Unless otherwise specified herein, electrical performance characteristics post irradiation parameter limits specified table body this document. 30.4 Electrical test requirements. wafer probe test requirements shall include functional parametric testing sufficient make packaged capable meeting electrical performance requirements table 30.5 Marking. minimum, each unique die, loaded single multiple stack carriers, shipment customer, shall identified with wafer number, certification mark, manufacturer's identification listed 10.2 herein. certification mark shall "QML" required MIL-PRF-38535. 30.6 Certification compliance. device classes certificate compliance shall required from QML38535 listed manufacturer order supply requirements this drawing (see 60.4 herein). certificate compliance submitted DSCC-VA prior listing approved source supply this appendix shall affirm that manufacturer's product meets, device classes requirements MIL-PRF-38535 requirements herein. 30.7 Certificate conformance. certificate conformance required device classes MIL-PRF-38535 shall provided with each microcircuit delivered this drawing. QUALITY ASSURANCE PROVISIONS 40.1 Sampling inspection. device classes sampling inspection procedures shall accordance with MIL-PRF-38535 modified device manufacturer's Quality Management (QM) plan. modifications plan shall effect form, function described herein. 40.2 Screening. device classes screening shall accordance with MIL-PRF-38535, defined manufacturer's plan. minimum shall consist Wafer acceptance Class product using criteria defined within MIL-STD-883 test method 5007. 100% wafer probe (see paragraph 30.4). 100% internal visual inspection applicable class criteria defined within MIL-STD-883 test method 2010 alternate procedures allowed within MIL-STD-883 test method 5004.
40.3 Conformance inspection. 40.3.1 Group inspection. Group inspection required only parts intended identified radiation assured (see 30.5 herein). levels device classes shall specified MIL-PRF-38535. point electrical testing packaged shall specified table herein. Group tests conditions specified within paragraphs 4.4.4.1, 4.4.4.1.1, 4.4.4.2, 4.4.4.3. CARRIER 50.1 carrier requirements. requirements carrier shall accordance with manufacturer's plan specified purchase order acquiring activity. carrier shall provide adequate physical, mechanical electrostatic protection.
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5962-00521
SHEET
APPENDIX APPENDIX FORMS PART 5962-00521 NOTES 60.1 Intended use. Microcircuit conforming this drawing intended microcircuits built accordance with MIL-PRF-38535 MIL-PRF-38534 government microcircuit applications (original equipment), design applications logistics purposes. 60.2 Comments. Comments this appendix should directed DSCC-VA, Columbus, Ohio, 43216-5000 telephone (614) 692-0536. 60.3 Abbreviations, symbols definitions. abbreviations, symbols, definitions used herein defined within MIL-PRF-38535 MIL-STD-1331. 60.4 Sources supply device classes Sources supply device classes listed QML-38535. vendors listed within QML-38535 have submitted certificate compliance (see 30.6 herein) DSCC-VA have agreed this drawing.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00521
SHEET
APPENDIX APPENDIX FORMS PART 5962-00521
bonding locations electrical functions physical dimensions. size: mils mils thickness: mils Interface materials. metallization: 16.9 Backside metallization: NONE (Silicon) Glassivation. Type: Phosphorus silicon glass (PSG) Thickness: ±1.0 Substrate: Single crystal silicon Assembly related information. Substrate potential: Unbiased (DI) Special assembly instructions: (1.) double size pads double bonded. (2.) pads bonded power noise considerations. (These lead-frame connected packaged devices.) FIGURE A-1. bonding locations electrical functions.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00521
SHEET
STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 03-06-19 Approved sources supply 5962-00521 listed below immediate acquisition information only shall added MIL-HDBK-103 QML-38535 during next revision. MIL-HDBK-103 QML-38535 will revised include addition deletion sources. vendors listed below have agreed this drawing certificate compliance been submitted accepted DSCC-VA. This bulletin superseded next dated revision MIL-HDBK-103 QML-38535.
Standard microcircuit drawing 5962F0052101QXC 5962R0052101TXC 5962F0052101VXC 5962F0052101V9A
Vendor CAGE number 34371 34371 34371 34371
Vendor similar IS9-1715ARH-8 IS9-1715ARH-T IS9-1715ARH-Q IS0-1715ARH-Q
lead finish shown each representing hermetic package most readily available from manufacturer listed that part. desired lead finish listed contact vendor determine availability. Caution. this number item acquisition. Items acquired this number satisfy performance requirements this drawing.
Vendor CAGE number 34371
Vendor name address Intersil 2401 Palm Blvd Melbourne, 32902-0883
information contained herein disseminated convenience only Government assumes liability whatsoever inaccuracies information bulletin.

Make changes specified under ICCS, tT1, tests specified table 00-

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