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Sink/Source Regulator Front Side Memory Termination Ideal both Fr
Top Searches for this datasheetPRELIMINARY CM3109 Sink/Source Regulator Front Side Memory Termination Ideal both Front Side memory applications Sinks sources Over current protection Over temperature protection Shutdown functionality Integrated power MOSFETs. Excellent accuracy (0.5% load regulation) Minimum external components SOIC PSOP packages Product Description CM3109 sinking sourcing regulator specifically designed series-parallel termination high speed chip buses well memory systems. source sink current with high accuracy output voltage selectable VDDQSEL FSBSEL pins. VDDQSEL controls whether CM3109 memory mode with VDDQ/2, mode. mode, FSBSEL controls whether 1.225V 1.45V. This allows same chip used different circuits motherboards that support both Northwood Prescott processors. CM3109 requires external components GMCH Enable signal Intel chipset corresponding signals other chip sets when powering boards which support Suspend (STR) functionality, CM3109 provides shutdown (SD#) pin. When low, will tri-state mode, causing output high impedance. this mode, CM3109 power saved significantly reducing quiescent current. CM3109 provides over current over temperature protection. These features protect chip from excessive heating high current high temperature. CM3109 available both 8-pin SOIC PSOP packages. Applications Front Side termination Memory Termination. Active Termination Buses. Graphics Card Memory Termination. Simplified Electric Schematic 2003 California Micro Devices Corp. rights reserved. 09/10/03 McCarthy BLVD, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com PACKAGE/PIN DIAGRAM PRELIMINARY CM3109 DESCRIPTIONS SYMBOL VDDQ VSENSE FSBSEL VDDQSEL DESCRIPTION Input Voltage VDDQ Output 1.225V/1.45V VDDQ/2 (note1) Shutdown Feedback Input Select Input Output Voltage 1.225V/1.45V Ground Select Input DDR/FSB Output Power Control Blocks Table1. Output Selection Truth Table. VDDQSEL OPEN OPEN FSBSEL Don't Care VDDQSEL/2(note1) 1.225V 1.45V Note Note1: Assume VDDQ VDDQSEL tide together application. STANDARD PART ORDERING INFORMATION Pins Package SOIC PSOP Ordering Part Number CM3109-00SN CM3109-00SB Part Marking CM3109-00SN CM3109-00SB 2003 California Micro Devices Corp. rights reserved. 09/10/03 McCarthy BLVD, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com Specifications Absolute Maximum Ratings Parameter Rating Operating Supply Voltage VDDQ Input Voltage Voltages Output Other Pins Protection (HBM) 2000 Storage Temperature Range +150 Operating Temperature Range Ambient Junction +150 Note2 Power Dissipation Internally Limited Unit PRELIMINARY CM3109 Note devices must derated based thermal resistance elevated temperature. CM3109-xxSN must derated 151°C/W. Standard Operating Conditions Parameter Range VDDQ, VDDQSEL Ambient OperatingTemperature COUT Unit Symbol VDDQ Parameter Input Voltage Range VDDQ Input Voltage Range Quiescent Current Output Voltage Electrical Operating Characteristics Conditions IVTT IVTT VDDQ 2.5V VDDQSEL 2.5V VDDQSEL "0", FSBSEL VDDQSEL "0", FSBSEL IVTT VDDQ 3.3V VDDQSEL "0", FSBSEL VDDQSEL "0", FSBSEL IVTT IVTT Logic Level Logic Level Logic Level Logic Level 1.225 1.425 1.425 1.25 1.225 1.45 1.225 1.45 6.25 UNIT 1.275 1.25 1.475 1.25 1.475 LOAD ILim VFSBSEL TDISABLE THYST Load Regulation Current Limit Output Selection Logic (FSBSEL) Shutdown Logic Shutdown temperature Thermal hysteresis Note Operating characteristics over Standard Operating Conditions unless otherwise specified. 2003 California Micro Devices Corp. rights reserved. 09/10/03 McCarthy BLVD, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com Performance Information PRELIMINARY CM3109 Typical Characteristics (nominal conditions unless specified otherwise) Output Voltage with Supply (VDDQSEL=2.5V) Load Regulation (Sink) Reference Voltage with Supply (VDDQSEL 2.5V) Load Regulation (Source) 2003 California Micro Devices Corp. rights reserved. 09/10/03 McCarthy BLVD, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com Performance Information (cont'd) PRELIMINARY CM3109 Typical Characteristics (nominal conditions unless specified otherwise) Over Current Limit (Source) Over Current Limit (Sink) Output Voltage with Supply Voltage (VDDQSEL=0V, FSBSEL=0 Output Voltage with Supply Voltage (VDDQSEL=0V, FSBSEL=2.5V) Supply Current with Supply Voltage 2003 California Micro Devices Corp. rights reserved. 09/10/03 McCarthy BLVD, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com Performance Information (cont'd) PRELIMINARY CM3109 Typical Transient Characteristics (nominal conditions unless specified otherwise) Load Transient 1.5A Sink) Line Transient 1.5A Source) 2003 California Micro Devices Corp. rights reserved. 09/10/03 McCarthy BLVD, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com Typical Thermal Characteristics overall junction ambient thermal resistance (JA) device power dissipation (PD) consists primarily paths series. first path junction case (JC) which defined package style, second path case ambient (CA) thermal resistance which dependent board layout. final operating junction temperature conditions estimated following thermal equation: TJUNC TAMB TAMB (JA) When CM3109-00SN (SOIC) mounted double sided printed circuit board with square inches copper allocated "heat spreading," resulting 151°C/W. Based over temperature limit 150°C with ambient 85°C, available power this package will (150°C 85°C) 151°C/W 0.43W. CM3109-00SB (PSOP) 40°C/W, available power this package will (150°C -85°C) 40°C/W 1.625W. Memory Application Since output voltage 1.25V, device either source current from VDDQ sink current Ground, power dissipated device time 1.25V times current load. This means maximum average current either direction) 0.344A CM3109-00SN 1.3A CM3109-00SB. maximum instantaneous current specified this condition should exceeded time CM3109-00SN CM3109-00SB, respectively. highly unlikely most usage memory that this might occur, because means memory outputs either high (SOIC) (PSOP) time. ambient temperature 40°C instead 85°C, which typically maximum most memory applications, power dissipated 0.73W CM3109-00SN 2.75W CM3109-00SB. maximum average current increases from 0.42A 0.58A 2003 California Micro Devices Corp. rights reserved. PRELIMINARY CM3109 CM3109-00SN maximum instantaneous current should exceeded time. CM3109-00SB, maximum current increases from 1.3A 2.2A. Thus, maximum continuous current time. Duty Cycle Ambient Temperature (2A) Duty Cycle Output Current (70C) 09/10/03 McCarthy BLVD, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com Typical (cont') Thermal Characteristics PRELIMINARY CM3109 Note that there vias either side allow heat dissipate into ground power planes inner layers PCB. Vias placed underneath chip, this cause blockage solder. ground power planes should least copper vias. also helps dissipation spread chip positioned away from edge PCB, near other heat dissipating devices. good thermal link from rest will ensure thermal link from CM3109 package ambient, around 40°C/W. CM3109-00SB heat spreader attached underneath PSOP-8 package order heat transferred much easier from package PCB. heat spreader copper dimensions just smaller than package itself. positioning matching layer connect spreader during manufacturing, heat will transferred between pads. drawing below shows recommended layout. layer copper connects heat spreader Filled between layer copper ground plane Ground layer Solder mask opening heat slug soldering (not shown other soldering locations) 2003 California Micro Devices Corp. rights reserved. 09/10/03 McCarthy BLVD, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com Application Information Front Side PRELIMINARY CM3109 above diagram shows CM3109 connected Intel GMCH Front Side GMCHVCCP. Enable signal GMCH_EN used shut down output CM3109 save power during shutdown periods. VDDQSEL input ensures that CM3109 Front Side mode, BOOTSEL from GMCH ensures right Microprocessor voltage applied. 2003 California Micro Devices Corp. rights reserved. 09/10/03 McCarthy BLVD, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com PRELIMINARY CM3109 SOIC-8 PSOP-8 Package Dimensions 2003 California Micro Devices Corp. rights reserved. 09/10/03 McCarthy BLVD, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com Other recent searchesVSMB1940X01 - VSMB1940X01 VSMB1940X01 Datasheet TPS3307 - TPS3307 TPS3307 Datasheet PL4003CA - PL4003CA PL4003CA Datasheet PACDN006 - PACDN006 PACDN006 Datasheet NJU26040 - NJU26040 NJU26040 Datasheet HV-190 - HV-190 HV-190 Datasheet AN2361 - AN2361 AN2361 Datasheet AN2041 - AN2041 AN2041 Datasheet AN2107 - AN2107 AN2107 Datasheet AN2203 - AN2203 AN2203 Datasheet AN2260 - AN2260 AN2260 Datasheet AN2267 - AN2267 AN2267 Datasheet AN2267a - AN2267a AN2267a Datasheet AAL2U - AAL2U AAL2U Datasheet
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