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Bluetooth Baseband Controller PEDL7055LA-01 Issue Date: Aug.
Top Searches for this datasheetSemiconductor ML7055LA Bluetooth Baseband Controller PEDL7055LA-01 Issue Date: Aug. 2002 Preliminary GENERAL DESCRIPTION ML7055LA CMOS digital band Bluetoothsystems. This incorporates ARM7TDMI core, features highly expandable architecture, supports interfaces variety applications. Since ML7055LA Oki's Bluetooth protocol stack software installed, when used conjunction with Bluetooth transceiver data/voice communications possible while maintaining interconnectivity with other Bluetooth systems. FEATURES Designed based Bluetooth Specification (Ver. 1.1) Bluetooth Interfaces: OKI's RF-LSI interface (ML7050LA) CONEXANT's RF-LSI interface (CX72303) BROADCOM's RF-LSI interface (BCM2002X) ARM7TDMI installed 1-Ch, 16-bit auto-reload timer 1-Ch, 18-bit auto-reload timer Interrupt controller causes) Built-in kbyte programs Built-in kbyte Selectable master clock (12/13 MHz). PCM-CVSD transcoder installed. DETACH function provides control request change from STOP mode. Installed interfaces: UART interface 921.6 kbps) General-purpose interface (programmable interrupts) interface (PCM Linear/A-law/µ-law selected) JTAG interface Power supply voltage: 2.70 input-output 1.65 1.95 internal circuit Package: 64-pin (P-TFBGA64-0707-0.65) (Dimensions: pitch: 0.65 ARM7TDMI registered trademarks Ltd., Thumb trademark Ltd., BLUETOOTH trademark owned Bluetooth SIG, Inc. licensed Electric Industry. information contained herein change without notice owing product being under development. PEDL7055LA-01 Semiconductor ML7055LA ABSOLUTE MAXIMUM RATINGS Parameter Power supply voltage Input voltage Allowable power dissipation Storage temperature Symbol Tstg Conditions Rating -0.3 +4.5 (I/O) -0.3 +2.5 (Core) -0.3 +4.5 0.62 Unit RECOMMENDED OPERATING CONDITIONS Parameter power supply voltage Core power supply voltage level input voltage level input voltage Operating temperature Symbol CoreVDD Conditions Min. 1.65 Typ. Max. 1.95 Unit ELECTRICAL CHARACTERISTICS Characteristics (VDD +85°C) Parameter level output voltage level output voltage Input leakage current Output leakage current Power supply current (during operation) Power supply current (during stand-by) Symbol Iddo Idds Conditions During operation stopped Min. Typ. Max. Unit PEDL7055LA-01 Semiconductor ML7055LA PLACEMENT AGND1 AGND0 Core SCLKN RESET RFSEL1 Core RFSEL2 XC32KP AVDD1 AVDD0 SCLKP DETACH RFSEL0 CLKOUT XC32KN SCLK SFRQ LOCK PCMIN SYNC PCMOUT PLL_ DATA RSSI_ LVDD PLL_ LPO_ TEST0 TEST2 Core Core Core Core RSSI PLL_PS PLL_LE PLL_ PLL_ SOUT TEST1 VIEW PEDL7055LA-01 Semiconductor ML7055LA DESCRIPTIONS Name Direction [*0] Internal Pull Up/Down Initial Value PLL_DATA PLL_CLK PLL_LE RSSI Pull down RSSI_CLK PLL_POW TX_POW RX_POW Placement Description ML7050 Transmit data output CX72303 Transmit data output BCM2002X Transmit data output ML7050 Receive data input CX72303 Receive data input BCM2002X Receive data input ML7050 Serial write data CX72303 Serial write data BCM2002X Transmit enable ML7050 Serial clock CX72303 Serial clock BCM2002X Serial clock ML7050 Serial road enable Negate, Assert CX72303 Serial enable Assert, Negate BCM2002X RF-LSI Synthesizer Negate, Assert ML7050 Receive field strength data input CX72303 Serial read data BCM2002X Serial read data ML7050 Receive field strength data clock CX72303 RF-LSI Receiving characteristic control BCM2002X system clock request ML7050 Local power control Assert, Negate CX72303 Power control Negate, Assert BCM2002X Select Serial Transmitmode ML7050 Transmit enable Assert, Negate CX72303 Transmit enable Negate, Assert BCM2002X Serial write data ML7050 Transmit enable Assert, Negate CX72303 Receive enable Negate, Assert BCM2002X Receive enable [*0] Input, Output, "I/O" Input/Output PEDL7055LA-01 Semiconductor ML7055LA PLL_PS PLLLOCK Pull down LPO_CLK Pull down PLL_OFF ML7050 :"L" CX72303 Power reset Assert (reset) Negate BCM2002X RF-LSI Receiving characteristic control ML7050 CX72303 BCM2002X 1MHz clock ML7050 CX72303 3.2KHzclock BCM2002X 3.2KHz clock (Pin shared with TCK) ML7050 loop comtrol open loop closed loop CX72303 Diversity Output BCM2002X Power control Note: LPO_CLK used only when TEST_L0 state. Name PCMOUT PCMIN PCMSYNC Direction Internal Pull Up/Down Pull Pull down Initial Value Placement Description data output data input sync signal kHz), Initial setting: input (can switched internal register) clock kHz/128 kHz) Initial setting: input (can switched internal register) PCMCLK Pull down Note: sync signal kHz) must guaranteed accuracy PCMSYNC configured input. UART Name SOUT Direction Internal Pull Up/Down Schmitt Initial Value Placement Description transmit serial data receive serial data transmit data ready (Pin shared with TRST) transmit ready (Pin shared with TDI) Note: pins used only when TEST_L0 state. PEDL7055LA-01 Semiconductor ML7055LA Configuration Name SCLKP SCLKN XC32KP XC32KN SCLKSEL Direction Internal Pull Up/Down Pull down Initial Value Placement Description Master clock (12/13 MHz) pins (Power level: CMOS level) Subclock pins (for oscillator) System clock frequency select Select divided internal Select subclock Master clock frequency select RF-LSI select pins 001: ML7050 (OKI) 010: CX72303 (Conexant) 101: BCM2002X (BROADCOM) Others: Unused Hardware reset (Reset Sleep (Sleep (Pin shared with TMS) serial clock serial data Master clock (12/13 MHz) output pins (Pin shared with TDO) SFRQSEL Pull down RFSEL0-2 [*1] RESET DETACH CLKOUT Schmitt Schmitt Note: DETACH CLKOUT pins used only when TEST_L0 state. [*1] RFSEL0: RFSEL1: H10; RFSEL2: Internal Pull Up/Down Initial Value Placement JTAG Name TRST Direction Description Serial data input (Pin shared with CTS) Serial data output (Pin shared with CLKOUT) Reset (Pin shared with RTS) Mode setting (Pin shared with DETACH) Serial data clock (Pin shared with LPO_CLK) Note: JTAG used only when TEST_L0 state. TEST Name TEST_L0-2 Direction Internal Pull Up/Down Pull down Initial Value Placement [*2] Test pins Description [*2] TEST_0: TEST_1: TEST_2: PEDL7055LA-01 Semiconductor ML7055LA Power, Name CoreVDD LVDD AVDD0 AVDD1 AGND0 AGND1 Direction Internal Pull Up/Down Initial Value Placement [*3] [*4] [*5] Description power supply 2.70 Power supply internal circuit 1.65 1.95 RF-I/O power suply (Same voltage RF-LSI) Digital block ground Analog block power supply 1.65 1.95 Analog block ground [*3] [*4] [*5] VDD: Core VDD: D10, J10, GND: A10, G10, PEDL7055LA-01 Semiconductor ML7055LA REFERENCE VOLTAGE SUPPLY CIRCUIT ML7055LA AVDD0 0.1µF AGND0 AVDD1 0.1µF AGND1 CoreVDD 47µF 0.1µF 0.1µF CoreVDD 47µF 0.1µF 0.1µF Capacitors should locate close pins. Feed lines should separated from pins. Example ML7055LA voltage supply circuit circuit subject change according specific board design. Please contact Electric Industry Co., Ltd. detailed information. Semiconductor BLOCK DIAGRAM Default Slave AMBA AMBA PCM/ CVSD GPIO UART BT-BB Core DETACH Arbiter Default Slave Timer System Control IRAMC ARM7 TDMI IROMC Clock AMBA Processor 176kB 24kB ML7055LA RFLSI CTL/ Timer (1ch) DETACH GPIO UART PEDL7055LA-01 Codec ML7055LA PEDL7055LA-01 Semiconductor ML7055LA DESCRIPTION INTERNAL BLOCKS CLKGEN Block Generates clock that supplied each block through SCLKP (12/13 MHz) STOP/HALT function CTL/WDT Block Control frequency division function internal main clock Control clock supplied each peripheral Control reset each peripheral STOP/HALT control Watchdog timer function (interrupt/reset) Timer Block channel 18-bit timer counter Interrupt compare function shot, interval, free-run mode Baseband Core Block Audio Codec Buffer Buffer Packet Composer Security Buffer Buffer Timing FHCNT Packet Decomposer Controller power supply control (PLL, Local frequency division ratio setting Receive clock regeneration function Synchronization detection (synchronizing within permissable error limit SyncWord) Receive clock re-timing function Controller hopping Sequence control Frequency hopping selection function computation's initial value selection function 10/10 PEDL7055LA-01 Semiconductor ML7055LA Timing Generator Bluetooth clock generation Operation interrupts depend mode (slot, scan, sniff, hold, park) Sync detection timing generation (sync window setting timing generation Transmit/Receive timing generation Multi-master timing management function Packet Composer Access code generation (SyncWord generation, appending PR*TRAILER) Packet header generation (HEC generation, scrambling, encoding) Payload generation (CRC generation, encryption, scrambling, encoding) Packet synthesis Packet Decomposer Packet decomposition (separating packet header payload) Packet header processing (FEC decoding, descrambling, error detection, header information separation) Payload processing (FEC decoding, descrambling, encryption decoding, judgement, payload separation) Security Various generation functions (initialization, link key, encryption key) Certification function Encryption function UART Block Full-duplex buffering method status reporting function Built-in 64-byte transmit/receive FIFO Modem control based Programmable serial interface 8-bit characters Generation verification parity, even parity, parity 1.5, stop bits Programmable Baud Rate Generator (1200 921.6 kbps) Error servicing parity, overrun, framing errors PCM-CVSD Transcoder Block Application side I/O: Codec Application-side format: linear bits/sample, sampling frequency)/A-law/µ-law Bluetooth-side format: CVSD/A-law/µ-law combinations above conversions supported PCMSYNC/PCMCLK switched (initial setting: input) DETACH Interface Block Generation request change (from) stop mode detection rising (falling) edge DETACH signal Generation request change from stop mode detection signal level change 11/11 PEDL7055LA-01 Semiconductor ML7055LA APPLICATION NOTES Clock Selection master clock frequency selected according external SFRQSEL. SFRQSEL SFRQSEL clock input external pins SCLKP. clock input external pins SCLKP. clock supply source selected according external SCLKSEL. SCLKSEL SCLKSEL clock that divided down from internal output that generated from external pins SCLKP. (Dividing ratios selectable range 1/16. Initial value MHz).) external pins XC32KP. Note: clock supply source CLKCNTL register CTL/WDT block once powered RESET signal input RESET pin. level pulse (more than 10usec width) must input after power supply stable. after oscillator generates stabilized master clock, enters internal reset condition 1.9msec (@SCLKP:13MHz) 2msec(@SCLKP:12MHz). Setting UART Baud Rate possible UART baud rate using Vendor Specific Commands. Available baud rate settings: (Initial value 115.2 kbps.) Setting PCM-CVSD Transcoder possible PCM-CVSD transcoders using Vendor Specific Commands. command details, contact Electric Industry Co., Ltd. possible following parameters using VCCTL command: PCMSYNC/PCMCLK mode (initial setting: input) Mute reception (initial setting: OFF) Mute transmission (initial setting: OFF) coding CVSD (initial setting)/µ-law/A-law Interface coding Linear (initial setting)/µ-law/A-law format (data width Linear sample) 8-bit (initial setting)/14-bit/16-bit Serial interface format Short frame (initial setting)/long frame Application interface mode Codec (initial setting)/APB 12/12 PEDL7055LA-01 Semiconductor ML7055LA Required processes when interface pins unused following tables show processes that should performed when interface pins used. pins that included following table should left open. Name RSSI PLLLOCK LPO_CLK Process When Used Open Open Open This shared with TCK. Comments UART Name Process When Used This shared with TDI. Comments Name PCMIN PCMSYNC PCMCLK Process When Used Open Open Open Comments Processes Other Pins TEST etc. Name TEST_L0-2 RESET DETACH Process When Used Pull Pull This shared with TMS. Comments 13/13 System Configuration Exam ML7055LA RFVDD RFVDD ML7050LA VDD_D L7055LA/M L7050LA RESET LVDD Power-on reset Semiconductor Hardware reset Microphone PCMO PCMIN PCMSYNC PCMCLK MCLK Voice input/ output peripherals Speaker PCMIN PCMO RSYNC XSYNC BCLK PLL_LE PLL_DAT PLL_CLK PLL_O PLL_PO RX_PO X_POW MSM7702-01 PLL_LE PLL_DAT PLL_CLK PLL_O PLL_PO RX_PO X_POW RSSI RSSI_CLK PLL_PS PLLLO _CLK(T CLKO UT(T SCLKN 20ppm SCLKSEL SFRQ SCLKP XC32KN RFSEL-2 RFSEL-1 RFSEL-0 XC32KP ACH(TMS) AVDD0 32KHz 32.768KHz 250ppm AVDD1 Separate, possible, wiring from board pins. RTS(T RST) CTS(T UART R1IN R2IN MAX3245 DSUB9PIN CoreVDD CoreVDD EST_L2 EST_L1 EST_L0 24C02 PEDL7055LA-01 ML7055LA Separate, possible, wiring from board pins. 14/14 L7055LA/BCM 2002X ML7055LA BCM2002X VDD_D RESET LVDD Power-on reset Semiconductor Hardware reset Microphone PCMO PCMIN PCMSYNC PCMCLK PCMIN PCMO RSYNC XSYNC BCLK MSM7702-01 Voice input/ output peripherals Speaker PLL_LE PLL_DATA PLL_CLK PLL_OFF PLL_PO RX_POW TX_PO RSSI RSSI_CLK PLL_PS PLLLOCK _CLK(TCK) FSKD SYNTH_PU TX_PU SRI_CLK PA_RAMP SRI_E RX_PU SRI_DI SRI_DO XTAL_PU SL_CTRL TX_CLK _CLK XTAL_OUT 20ppm JTAG CLKO UT(TDO) SCLKN SYS_CLK SCLKP XTAL_IN (TCK) (TMS) (TRST) (TDO (TDI) SCLKSEL SFRQSEL AGND RFSEL-2 RFSEL-1 RFSEL-0 XC32KN XC32KP DETACH(TMS) AVDD0 32KHz 32.768KHz 250ppm UART AVDD1 RTS(TRST) CTS(TDI) Separate, possible, wiring from board pins. T1IN T1OUT T2IN T2OUT T3IN R1IN R2IN MAX3245 DSUB9PIN oreVD CoreVDD TEST_L2 TEST_L1 TEST_L0 AT24C02 PEDL7055LA-01 ML7055LA capacitors shouded close pins possible. 15/15 ML7055LA/CX72303 RESET LVDD VDD_D VDD_IF RX_DATA SPI_EN_BAR SPI_DATA_IN SPI_CLK_IN TX_DATA RX_EN TX_EN SPI_DATA_OUT XTAL_B 13MHz 20ppm L7055LA RFVDD RFVDD CX72303 Power-on reset Semiconductor Hardware reset Microphone SYNC Voice input/ output peripherals Speaker RSYNC XSYNC BCLK 7702-01 XTAL_A SYNC_DETECT PLL_LE PLL_DATA PLL_CLK PLL_OFF PLL_POW RX_POW TX_POW RSSI RSSI_CLK PLL_PS PLLLOCK LPO_CLK(TCK) CLKOUT(TDO) SCLKN SCLKSEL SFRQSEL SCLKP LPXO_OP LPXO_IN SYS_CLK_OUT _CLK_OUT XC32KN RFSEL-2 RFSEL-1 RFSEL-0 XC32KP DETACH(S) 32KHz 32.768KHz 250ppm AVDD0 AGND0 AVDD1 AGND1 UART SOUT RTS(TRST) CTS(TDI) T1OUT T2OUT Separate, possible, wiring from board pins. T1IN T2IN T3IN R1OUT R2OUT R1IN R2IN AX3245 DSUB9PIN CoreVDD CoreVDD TEST_L2 TEST_L1 TEST_L0 AT24C02 PEDL7055LA-01 capacitors shouded close pins possible. ML7055LA 16/16 PEDL7055LA-01 Semiconductor ML7055LA PACKAGE DIMENSIONS (Unit: P-TFBGA64-0707-0.65 Package material Ball material Package weight Rev. No./Last Revised Epoxy resin Sn/Pb 0.10 TYP. 1/July 2002 Caution regarding installation surface mounted type packages: Surface mounted type packages very susceptible heat during reflow mounting package moisture content when storage. Therefore, please contact your Electric Industry Co., Ltd. sales representative when considering reflow experiments know product name, package name, count, package code, desired mounting conditions (reflow method, temperature, count), storage conditions, etc. 17/17 PEDL7055LA-01 Semiconductor ML7055LA REVISION HISTORY Document PEDL7055LA-01 Date Aug. 2002 Page Previous Current Edition Edition Description Preliminary edition 18/18 PEDL7055LA-01 Semiconductor ML7055LA NOTICE information contained herein change without notice owing product and/or technical improvements. Before using product, please make sure that information being referred up-to-date. outline action examples application circuits described herein have been chosen explanation standard action performance product. When planning product, please ensure that external conditions reflected actual circuit, assembly, program designs. When designing your product, please product below specified maximum ratings within specified operating ranges including, limited operating voltage, power dissipation, operating temperature. assumes responsibility liability whatsoever failure unusual unexpected operation resulting from misuse, neglect, improper installation, repair, alteration accident, improper handling, unusual physical electrical stress including, limited exposure parameters beyond specified maximum ratings operation outside specified operating range. Neither indemnity against license third party's industrial intellectual property right, etc. granted connection with product and/or information drawings contained herein. responsibility assumed infringement third party's right which result from thereof. products listed this document intended general electronics equipment commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products authorized system application that requires special enhanced quality reliability characteristics system application where failure such system application result loss damage property, death injury humans. Such applications include, limited traffic automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, life-support systems. Certain products this document need government approval before they exported particular countries. purchaser assumes responsibility determining legality export these products will take appropriate necessary steps their expense these. part contents contained herein reprinted reproduced without prior permission. Copyright 2002 Electric Industry Co., Ltd. 19/19 Other recent searchesTNY278P - TNY278P TNY278P Datasheet MAX5180 - MAX5180 MAX5180 Datasheet MAX5183 - MAX5183 MAX5183 Datasheet MAX5180 - MAX5180 MAX5180 Datasheet MAX5183 - MAX5183 MAX5183 Datasheet MAX5186 - MAX5186 MAX5186 Datasheet MAX5189 - MAX5189 MAX5189 Datasheet KTC4075 - KTC4075 KTC4075 Datasheet IM-6-38 - IM-6-38 IM-6-38 Datasheet F16267 - F16267 F16267 Datasheet DS430 - DS430 DS430 Datasheet DAI0171A - DAI0171A DAI0171A Datasheet CRO2437A-LF - CRO2437A-LF CRO2437A-LF Datasheet 2SC3356 - 2SC3356 2SC3356 Datasheet
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