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Recommended footprint 1.27 (.050) (inch) ;;;;;;;;;;;;;;


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Handling Cautions (1600 series)
Recommended footprint
1.27 (.050)
(inch)
;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;; by=0.01µF ;;;;;;;;;;;;;; ;;;;;;;;;;;;;;
5.08 (.200)
8.08 (.318)
Soldering order avoid product damage during soldering, reflow condition, please follow either below conditions (b). Temperature 260°C (max) Duration seconds (max) Temperature 230°C (max) Duration seconds (max) Shock Basically, 1600 series have height resistance design against shock (guaranteed times drops from hight hard wooden board, half sinusoidal waves 29,400m/s2, times directions). case unexpected drop, please remeasure product characteristics. Cleaning Basically, 1600 series applicable ultrasonic wave cleanings. However, some case, during ultrasonic wave cleanings, internal design damage. Please check condition carefully beforehand. Marking resistance against solvents markings withstand minutes soaking Alcohol. conditions severe than above mentioned, please check carefully beforehand. Others 1600 series C-MOS applied products. careful handlings (same with C-MOS needed avoid electrostatic problems. Incorrect connection cause trouble. Please make sure connect correctly below. terminal terminal
Examples soldering conditions
(Infra-red reflow soldering)
less
245°C
Temperature(°C)
(.118)
1-5°C/s
1-9°C/s
1-9°C/s 200s
Time
Taping Dimensions (1600 Series)
Tape
(mm)
Reel
(mm)
PULL DIRECTION
2±0.1
1.75±0.1
4±0.1
11.5±0.1
24±0.3
14.4
Detail Hollowed Part
120° 25.5
12.0±0.1
9.85
Location
1,000 pieces/reel boxed shipped with taping method shown above
*Note Packaging method shown above only large orders. small orders, samples, packaging form differs according requested quantity.

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