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MSPA83S-68KX DESCRIPTION (PC-100 128MB 144Pin SDRAM SO-DIMM)
Top Searches for this datasheetKingmax Memory Module MSPA83S 68KX MSPA83S-68KX DESCRIPTION (PC-100 128MB 144Pin SDRAM SO-DIMM) MSPA83S-68KX Synchronous Dynamic high density memory module. MSPA83S-68KX consists eight CMOS with banks Synchronous DRAMs TinyBGA package EEPROM 8-Pin TSSOP package 144-Pin glass-epoxy substrate. 0.1uF decoupling capacitor mounted printed circuit board parallel each SDRAM. MSPA83S-68KX Small Outline Dual in-line Memory Module intended mounting into 144-Pin edge connector sockets. Synchronous design allows precise cycle control with system clock. transactions possible every clock cycle. Range operating frequencies programmable latencies allows same device useful variety high bandwidth high performance memory system application. FEATURES Performance range 100MHz Freq.( CL=3&2 Burst mode operation Auto self refresh capability (4096 Cycles 64ms LVTTL compatible inputs outputs Single 3.3V 0.3V power supply cycle with address programs Latency Access from column address Burst length Full page Data scramble Sequential Interleave inputs sampled positive going edge system clock Signal 3.3V 0.3V power supply Serial presence detect with EEPROM Height 1181 singal sided component Kingmax Memory Module MSPA83S 68KX CONFIGURATIONS (Front side/back side) Front DQM0 DQM1 DQ10 DQ11 DQ12 Front DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ39 DQM4 DQM5 DQ40 DQ41 DQ42 DQ43 DQ44 Front DQ13 DQ14 DQ15 CLK0 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 Back DQ45 DQ46 DQ47 CKE0 CKE1 *A12 *A13 CLK1 DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 Back DQ22 DQ23 A10/AP DQM2 DQM3 DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 **SDA Back DQ54 DQ55 DQM6 DQM7 DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 **SCL NAMES Name DQ63 CLK0 CLK1 DQM0 Function Address input (Multiplexed) Select bank Data input/output Clock input Chip select input address strobe Column address strobe Write enable Power supply (3.3V) Ground Serial data Serial clock connection CKE0 CKE1 Clock enable input These pins used this module. These pins should system which does support SPD. CONFIGURATION DESCRIPTION Name System clock Chip select Input Function Active positive going edge sample inputs. Disables enables device operation masking enabling inputs except CLK, DQM. Masks system clock freeze operation from next clock ycle. should enabled least cycle prior command. Disable input buffers power down standby. should enabled 1CLK+tSS prior valid command. Row/column addresses multiplexed same pins. address RA11, Column address Selects bank activated during address latch time. Selects bank read/write during column address latch time Latches addresses positive going edge with low. Enables access precharge. Latches column addresses positive going edge with low. Enables column access. Enables write operation precharge. Latches data starting from CAS, active. Makes data output Hi-Z, tSHZ after clock masks output. Blocks data input when active. (Byte masking) Data inputs/outputs multiplexed same pins. Power ground input buffers core logic. Clock enable DQM0 VDD/VSS Address Bank select address address strobe Column address strobe Write enable Data input/output mask Data input/output Power supply/ground Kingmax Memory Module MSPA83S 68KX FUNCTIONAL BLOCK DIAGRAM PCLK0 DQM0 DQ0~7 DQ0~7 PCLK1 DQM4 DQ0~7 PCLK3 DQ32~39 DQM1 DQ7~15 DQ0~7 DQM5 DQ0~7 DQ40~47 DQM2 DQ16~23 DQ0~7 DQM6 DQ0~7 DQ48~55 DQM3 DQ24~31 DQ0~7 DQM7 DQ0~7 DQ56~63 CKE0 SDRAM SDRAM SDRAM SDRAM SDRAM CLK0 PCLK1 PCLK0 Every DQpin SDRAMs Serial 0.1uF Capacitors each SDRAM SDRAMs Kingmax Memory Module MSPA83S 68KX ABSOLUTE MAXIMUM RATINGS Parameter Voltage relative Voltage supply relative Storage temperature Power dissipation Short circuit current Symbol VIN, VOUT VDD, VDDQ TSTG Value -1.0 -1.0 +125 Unit Note Permanent device damage occur "ABSOLUTE MAXIMUM RATINGS" exceeded. Functional operation should restricted recommended operating condition. Exposure higher than recommended voltage extended periods time could affect device reliability. OPERATING CONDITIONS CHARACTERISTICS Recommended operating conditions (Voltage referenced 70°C) Parameter Supply voltage Input high voltage Input voltage Output high voltage Output voltage Input leakage current (Inputs) Input leakage current (I/O pins) Symbol -0.5 VDDQ+0.3 Unit -2mA Note Notes (max) 5.6V AC.The overshoot voltage duration 3ns. (min) -2.0V undershoot voltage duration 3ns. input VDDQ. Input leakage currents include Hi-Z output leakage bi-directional buffers with Tri-State outputs. Dout disabled, VOUT VDDQ. CAPACITANCE (VDD 3.3V, 23°C, 1MHz, VREF 1.4V Symbol CIN1 CIN2 CIN3 CIN4 CIN5 CIN6 COUT Unit Parameter Input capacitance A11, BA1) Input capacitance (RAS, CAS, Input capacitance (CKE0) Input capacitance (CLK0) Input capacitance (CS0 Input capacitance (DQM0 DQM7) Data input/output capacitance (DQ0 DQ63) Kingmax Memory Module MSPA83S 68KX CHARACTERISTICS (Recommended operating condition unless otherwise noted, 70°C) PARAMETER/CONDITION OPERATING CURRENT: Active Mode; Burst READ WRITE; (MIN); latency 10ns SYMBOL IDD1 1,020 UNITS STANDBY CURRENT: Power-Down Mode; 10ns; LOW; banks idle IDD2 IDD3 STANDBY CURRENT: Active Mode; S0#, HIGH; 10ns; HIGH; banks active after tRCD met; accesses progress OPERATING CURRENT: Burst Mode; Continuous burst; READ WRITE; 10ns; banks active; latency AUTO REFRESH CURRENT: HIGH; S0#, HIGH; 10ns (MIN); IDD4 IDD5 IDD6 IDD7 1,020 1,920 15.625µs; SELF REFRESH CURRENT: 0.2V Notes Measured with outputs open. Refresh period 64ms. Kingmax Memory Module MSPA83S 68KX OPERATING TEST CONDITIONS Parameter input levels (Vih/Vil) Input timing measurement reference level Input rise fall time Output timing measurement reference level Output load condition (VDD 3.3V 0.3V, 70°C) Value 2.4/0.4 tr/tf Fig. Unit 3.3V 1.4V 1200 Output 50pF (DC) 2.4V, -2mA (DC) 0.4V, Output 50pF (Fig. output load circuit (Fig. output load circuit OPERATING PARAMETER Parameter active active delay delay precharge time active time cycle time Last data precharge Last data col. address delay Last data burst stop Col. address col. address delay Number valid output data operating conditions unless otherwise noted) Symbol tRRD (min) tRCD (min) tRP(min) tRAS(min) tRAS(max) tRC(min) tRDL(min) tCDL(min) tBDL(min) tCCD (min) latency=3 latency=2 Version -08A Unit Note Notes minimum number clock cycles determined dividing minimum time required with clock cycle time, then rounding next higher integer. Minimum delay required complete write. parts allow every cycle column address change. case precharge interrupt, auto precharge burst stop. Kingmax Memory Module MSPA83S 68KX CHARACTERISTICS operating conditions unless otherwise noted) REFER INDIVIDUAL COMPONENT, WHOLE MODULE. Parameter latency=3 latency=2 valid output delay latency=3 latency=2 Output data hold time high pulse width pulse width Input setup time Input hold time output Low-Z output Hi-Z latency=3 latency=2 Notes Parameters depend programmed latency. clock rising time longer than 1ns, (tr/2-0.5)ns added parameter. Assumed input rise fall time 1ns. longer than 1ns, transient time compensat should considered, i.e., [(tr tf)/2-1]ns should added parameter latency=3 latency=2 tSLZ tSHZ tSAC Symbol cycle time -08A 1000 Unit Note Kingmax Memory Module MSPA83S 68KX Address BURST DEFINITION Mode Register (Mx) Reserved* Mode Latency Burst Length Burst Length Starting Column Order Accesses Within Burst Address: Type Sequential Type Interleaved 0-1-2-3 1-2-3-0 2-3-0-1 3-0-1-2 0-1-2-3 1-0-3-2 2-3-0-1 3-2-1-0 0-1-2-3-4-5-6-7 1-0-3-2-5-4-7-6 2-3-0-1-6-7-4-5 3-2-1-0-7-6-5-4 4-5-6-7-0-1-2-3 5-4-7-6-1-0-3-2 6-7-4-5-2-3-0-1 7-6-5-4-3-2-1-0 *Should program M11, ensure compatibility with future devices. Burst Length Reserved Reserved Reserved Full Page Reserved Reserved Reserved Reserved Burst Type Sequential Interleaved Latency Reserved Reserved Reserved Reserved Reserved 0-1-2-3-4-5-6-7 1-2-3-4-5-6-7-0 2-3-4-5-6-7-0-1 3-4-5-6-7-0-1-2 4-5-6-7-0-1-2-3 5-6-7-0-1-2-3-4 6-7-0-1-2-3-4-5 7-0-1-2-3-4-5-6 Cn+1, Cn+2 Full A0-A9 Cn+3, Cn+4. Page (location 0-1,023) .Cn-1, (1,024) NOTE: supported M6-M0 Defined Operating Mode Standard Operation other states reserved Write Burst Mode Programmed Burst Length Single Location Access MODE REGISTER DEFINITION burst length two, A1-A9 select block burst; selects starting column within block. burst length four, A2-A9 select block four burst; A0-A1 select starting column within block. burst length eight, A3-A9 select block eight burst; A0-A2 select starting column within block. full-page burst, full selected A0-A9 select starting column. Whenever boundary block reached within given sequence above, following access wraps within block. burst length one, A0-A9 select unique column accessed, Mode Register ignored. Kingmax Memory Module MSPA83S 68KX SIMPLIFIED TRUTH TABLE Command Register Mode register Auto refresh Refresh Entry Self refresh Exit CKEn-1 CKEn BA0,1 A10/AP A11, Note code address Column address Column address Bank active addr. Read column address Write column address Burst stop Precharge Bank selection banks Clock suspend active power down Entry Exit Entry Precharge power down mode Exit operation command Auto precharge disable Auto precharge enable Auto precharge disable Auto precharge enable (V=Valid, X=Dont care, H=Logic high, L=Logic low) Notes Code Operand code Program keys. MRS) issued only banks precharge state. command issued after clock cycles MRS. Auto refresh functions same refresh DRAM automatical precharge without precharge command meant "Auto". Auto/self refresh issued only banks precha state. Bank select addresses. both "Low" read, write, active precharge, bank selected. both "Low" "High" read, write, active precharge, bank selected. both "High" "Low" read, write, active precharge, bank selected. both "High" read, write, active precharge, bank selected. A10/AP "High" precharge, ignored banks selected. During burst read write with auto precharge, read/ write command issued. Another bank read/write command issued after burst. active associated bank issued after burst. Burst stop command valid every burst length. sampled positive going edge masks data-in very (Write latency makes Hi-Z state data-out cycles after. (Read latency Kingmax Memory Module MSPA83S 68KX PACKAGE DIMENSIONS Units Inches (Millimeters) 2.66 (67.60) 2.50 (63.60) 0.078 (2.00 Min) 0.16 0.039 (4.00 0.10) 1.181 (30.00) 0.13 (3.30) 0.91 (23.20) (4.60) 0.083 (2.10) 1.29 (32.80) 0.18 0.10 (2.50) 0.15 (3.70) 0.140 (3.55 Max) (4.00 Min) (5.08 Min) 0.157 0.200 0.16 0.0039 (4.00 0.10) 0.06 0.0039 (1.50 0.1) (2.55 Min) 0.10 0.79 .(20 0.24 (6.0) 0.07 (1.80) 0.024 0.001 (0.60 0.05) 0.015 (0.38 Max) 0.03 (0.80 5mil 0.04 0.0039 (1.00 0.10) Detail Detail Tolerances ±.006(.15) unless otherwise specified used device 16Mx8 SDRAM, Tiny Other recent searchesTS2576 - TS2576 TS2576 Datasheet TL074CNS - TL074CNS TL074CNS Datasheet TL074ACN - TL074ACN TL074ACN Datasheet TC4426A - TC4426A TC4426A Datasheet TC4427A - TC4427A TC4427A Datasheet TC4428A - TC4428A TC4428A Datasheet RURP640CC - RURP640CC RURP640CC Datasheet RURP650CC - RURP650CC RURP650CC Datasheet RURP660CC - RURP660CC RURP660CC Datasheet RG179B - RG179B RG179B Datasheet LTC1043 - LTC1043 LTC1043 Datasheet KK74HC163A - KK74HC163A KK74HC163A Datasheet
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