Dual Non-Inverting Power Driver 3.0A Peak Current Totem Pole Outp

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Dual Non-Inverting Power Driver 3.0A Peak Current Totem Pole Outp

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UC1708 UC2708 UC3708
Dual Non-Inverting Power Driver
3.0A Peak Current Totem Pole Output Operation 25ns Rise Fall Times 25ns Propagation Delays Thermal Shutdown UnderVoltage Protection
DESCRIPTION
UC1708 family power drivers made with high-speed, high-voltage, Schottky process interface control functions high-power switching devices particularly power MOSFETs. Operating over volt supply range, these devices contain independent channels. inputs compatible with CMOS logic families, withstand input voltages high VIN. Each output source sink long power dissipation limits exceeded.
Although each output activated independently with inputs, they forced common through action either digital high signal Shutdown terminal forcing Enable terminal low. High-Speed, Power MOSFET Compatible Shutdown terminal will only force outputs low, will effect behavior rest device. Enable terminal effectively places device Efficient High Frequency Operation under-voltage lockout, reducing power consumption much 90%. During under-voltage disable (Enable terminal forced low) conditions, Cross-Conduction Current Spike outputs held self-biasing, low-voltage, state. Enable Shutdown Functions Wide Input Voltage Range Protection UC3708 UC2708 available plastic 8-pin MINI 16-pin "bat-wing" packages commercial operation over +70oC temperature range industrial temperature range -25oC +85oC respectively. operation over -55oC +125oC temperature range, UC1708 available hermetically sealed 8-pin MINI CDIP, CDIP CLCC packages. Surface mount devices also available.
BLOCK DIAGRAM
UDG-92024-1
Note: Shutdown feature available packages only.
SLUS171A MARCH 1997 REVISED AUGUST 2001
UC1708 UC2708 UC3708 ABSOLUTE MAXIMUM RATINGS (Note
Supply Voltage Output Current (Each Output, Source Sink) Steady-State 0.5A Peak Transient Ouput Voltage -0.3 (VIN 0.3)V Enable Shutdown Inputs -0.3 6.2V Inputs -0.3 (VIN 0.3)V Operating Junction Temperature (Note 150°C Storage Temperature Range. -65° 150°C Lead Temperature (Soldering, Seconds). 300°C
NOTE voltages with respect Logic pin. currents positive into, negative device terminals. NOTE Consult Unitrode Integrated Circuits databook information regarding thermal specifications limitations packages.
CONNECTION DIAGRAMS
DIL-8 (Top View) Package SOIC-16 (Top View) Package
ENABLE LOGIC SHUTDOWN INPUT
OUTPUT OUTPUT
DIL-16 (Top View) Package
CLCC-20 (Top View) Package
INPUT
Note: package logic ground. Pins N/C.
UC1708 UC2708 UC3708 ELECTRICAL CHARACTERISTICS: Unless otherwise stated, VIN=10V 35V, these specifications apply for: -55oC<TA<125oC UC1708, -25oC<TA<+85oC UC2708, 0oC<TA<70oC UC3708.TA
PARAMETER Supply Current OutputsLow Outputs High Enable Shutdown Inputs Level Shutdown Inputs High Level Input Current Input Current High Input Leakage Current High Shutdown Input Current Shutdown Input Current High Enable Input Current Enable Input Current High Enable Threshold Rising Enable Threshold Falling Output High Sat., VOUT Output Sat., VOUT Thermal Shutdown IOUT -50mA IOUT -500mA IOUT 50mA IOUT 500mA VA,B 0.4V VA,B 2.4V VA,B 35.3V VSHUTDOWN 0.4V VSHUTDOWN 2.4V VSHUTDOWN 6.2V VENABLE VENABLE 6.2V -600 -460 -200 -0.6 TEST CONDITIONS UNITS
SWITCHING CHARACTERISTICS (Figure (VIN 20V, delays measured output change.)
PARAMETER From Input Output: Rise Time Delay (TPLH) 1000pF (Note 2200pF Rise (TTLH) 1000pF (Note 2200pF Fall Time Delay (TPHL) 1000pF (Note 2200pF Fall (TTHL) 1000pF (Note 2200pF TEST CONDITIONS UNITS
NOTE These parameters, specified 1000pF, although ensured over recommended operating conditions, tested production.
UC1708 UC2708 UC3708 SWITCHING CHARACTERISTICS (Figure (VIN 20V, delays measured output change.)
From Shutdown Input Output Rise Time Delay (TPLH) 1000pF (Note 2200pF Rise (TTLH) 1000pF (Note 2200pF Fall Time Delay (TPHL) 1000pF (Note 2200pF Fall (TTHL) 1000pF (Note 2200pF Total Supply Current 200kHz, duty cycle, both channels; 200kHz, duty cycle, both channels; 2200pF
NOTE These parameters, specified 1000pF, although ensured over recommended operating conditions, tested production.
Figure Test Circuit Switching Time Waveforms
4.3V INPUT
OUTPUT
TPLH TTLH
TPHL TTHL
UDG-92026
Figure Equivalent Input Circuits
UDG-92025
Note: Shutdown feature available only Packages.
PACKAGE OPTION ADDENDUM
www.ti.com
19-May-2005
PACKAGING INFORMATION
Orderable Device 5962-0051401Q2A 5962-0051401QEA 5962-0051401QPA 5962-0051401V2A 5962-0051401VEA 5962-0051401VPA UC1708J UC1708J883B UC1708JE UC1708JE883B UC1708L883B UC2708D UC2708DW UC2708DWTR UC2708J UC2708JE UC2708N UC2708NE UC2708Q UC3708DW UC3708DWTR UC3708J UC3708JE UC3708N UC3708NE UC3708Q
Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE
Package Type LCCC CDIP CDIP LCCC CDIP CDIP CDIP CDIP CDIP CDIP LCCC SOIC SOIC
Package Drawing
Pins Package Plan 2000 2000
Lead/Ball Finish
Peak Temp
POST-PLATE Level-NC-NC-NC SNPB SNPB Call Call Call SNPB SNPB SNPB SNPB Call NIPDAU NIPDAU Call Call NIPDAU Call Call NIPDAU NIPDAU SNPB SNPB NIPDAU Call Call Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Call Level-2-220C-1 YEAR Level-2-220C-1 YEAR Call Call Level-NA-NA-NA Level-NA-NA-NA Call Level-2-220C-1 YEAR Level-2-220C-1 YEAR Level-NC-NC-NC Level-NC-NC-NC Level-NA-NA-NA Level-NA-NA-NA Call
POST-PLATE Level-NC-NC-NC
PDIP PDIP SOIC SOIC CDIP CDIP PDIP PDIP
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS) Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that
Addendum-Page
PACKAGE OPTION ADDENDUM
www.ti.com
19-May-2005
provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
MECHANICAL DATA
MCER001A JANUARY 1995 REVISED JANUARY 1997
(R-GDIP-T8)
0.400 (10,16) 0.355 (9,00)
CERAMIC DUAL-IN-LINE
0.280 (7,11) 0.245 (6,22)
0.065 (1,65) 0.045 (1,14)
0.063 (1,60) 0.015 (0,38)
0.020 (0,51)
0.310 (7,87) 0.290 (7,37)
0.200 (5,08) Seating Plane 0.130 (3,30)
0.023 (0,58) 0.015 (0,38) 0.100 (2,54) 0.014 (0,36) 0.008 (0,20)
0°-15°
4040107/C 08/96 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. This package hermetically sealed with ceramic using glass frit. Index point provided terminal identification. Falls within 1835 GDIP1-T8
POST OFFICE 655303
DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B OCTOBER 1996
(S-CQCC-N**)
TERMINAL SHOWN
LEADLESS CERAMIC CHIP CARRIER
TERMINALS
0.342 (8,69) 0.442 (11,23) 0.640 (16,26) 0.739 (18,78) 0.938 (23,83) 1.141 (28,99) 0.358 (9,09) 0.458 (11,63) 0.660 (16,76) 0.761 (19,32) 0.962 (24,43) 1.165 (29,59) 0.307 (7,80) 0.406 (10,31) 0.495 (12,58) 0.495 (12,58) 0.850 (21,6) 1.047 (26,6)
0.358 (9,09) 0.458 (11,63) 0.560 (14,22) 0.560 (14,22) 0.858 (21,8) 1.063 (27,0)
0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25)
0.020 (0,51) 0.010 (0,25)
0.055 (1,40) 0.045 (1,14)
0.045 (1,14) 0.035 (0,89)
0.028 (0,71) 0.022 (0,54) 0.050 (1,27)
0.045 (1,14) 0.035 (0,89)
4040140 10/96 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. This package hermetically sealed with metal lid. terminals gold plated. Falls within JEDEC MS-004
POST OFFICE 655303
DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI001A JANUARY 1995 REVISED JUNE 1999
(R-PDIP-T8)
0.400 (10,60) 0.355 (9,02)
PLASTIC DUAL-IN-LINE
0.260 (6,60) 0.240 (6,10)
0.070 (1,78) 0.325 (8,26) 0.300 (7,62) 0.015 (0,38) 0.200 (5,08) Seating Plane 0.125 (3,18) 0.010 (0,25) Gage Plane
0.020 (0,51)
0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.010 (0,25)
0.430 (10,92)
4040082/D 05/98 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. Falls within JEDEC MS-001
latest package information,
POST OFFICE 655303
DALLAS, TEXAS 75265
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Dual Non-Inverting Power Driver 3.0A Peak Current Totem Pole Outp

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