QUALIFIED MANUFACTURERS LIST CUSTOM HYBRID MICROCIRCUITS QUALIFIED UND
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QUALIFIED MANUFACTURERS LIST CUSTOM HYBRID MICROCIRCUITS QUALIFIED UNDER MILITARY SPECIFICATION MIL-PRF-38534 CUSTOM HYBRID MICROCIRCUITS GENERAL REQUIREMENTS
CUSTOM HYBRID MICROCIRCUITS QML-38534-29 30-Jun-99 SUPERSEDING QML-38534-28 31-Mar-99
This list been prepared Government acquisition products covered Specification MIL-PRF-38534. Listing product intended does connote endorsement product Department Defense. This list subject change without notice; revision amendment this list will issued necessary. listing product, process, material does not, way, release supplier from responsibility comply with individual item specification requirements. DEFENSE SUPPLY CENTER COLUMBUS (DSCC-V) PREPARING ACTIVITY (PA) MIL-PRF-38534, THEREFOR RESPONSIBLE QUALIFICATION. DSCC-VQ ORGANIZATIONAL ELEMENT, WITHIN WHICH PERFORMS ADMINISTRATIVE TECHNICAL FUNCTIONS NECESSARY QUALIFICATION PRODUCTS, PROCESSES MATERIAL. Mailing Address: Defense Supply Center Columbus (DSCC-VQ), P.O. 3990, Columbus, Ohio 43216-5000. order manufacturer have test data considered qualification, manufacturer must perform required qualification tests; produce qualification sample under valid authorization test with DSCC certified materials manufacturing construction techniques; comply with requirements specified MIL-PRF-38534. listing custom hybrid microcircuit materials manufacturing construction techniques QML-38534 applies only products produced MILPRF-38534 certified line(s) plant(s) specified QML. Custom hybrid microcircuits manufactured, assembled, tested accordance with MIL-PRF-38534 shall bear "certification mark" controlled hybrid Microcircuits, "compliant hybrid" certification mark non-SMD controlled hybrid microcircuits follows: product, classes, shall have certification mark "QML" small devices. Non-SMD product dated after MIL-PRF-38534D, Class shall have certification mark "CK." Non-SMD product dated after MIL-PRF-38534D, Class shall have certification mark "CH." Non-SMD product dated after MIL-PRF-38534D, Class shall have certification mark "CG." Non-SMD product dated after MIL-PRF-38534D, Class shall have certification mark "CE." Non-SMD product dated after MIL-PRF-38534D, Class shall have certification mark "CD." Non-SMD dated prior MIL-PRF-38534D, classes, shall have certification mark "CH" small devices. These certification marks abbreviations shall used, product that does meet requirements MIL-PRF-38534 except allowed 3.7.5 MIL-PRF-38534. Products manufactured, assembled, tested Class Class Class Class Class with provisions MIL-PRF-38534, with DSCC qualified materials manufacturing construction techniques, represented being compliant appropriate product assurance levels listed herein. information contained this reflects general material manufacturing techniques particular test sample(s). order protect manufacturers' proprietary processes materials, only generic process material listed. user must contact manufacturer detail information specific materials (i.e., such epoxy, getter, solder-type), process details. Processes materials, listed, considered qualified similarity those demonstrated qualification (e.g., different wire, package, sizes). Appendix MIL-PRF-38534, Class major changes paragraph, baseline qualification limits. product, represented being compliant MIL-PRF-38534, must built using qualified processes materials. user shall responsible determining qualification baseline given class level adequate demonstrate capability intended application. obtain MIL-PRF-38534 qualified hybrid microcircuits, user should specify procurement document that product manufactured MIL-PRF38534, comprised materials manufacturing construction techniques listed herein. Acquisition requirements contained paragraph MIL-PRF-38534. Microcircuit devices represented being built, tested shipped under provision MIL-PRF-38534, must built using qualified manufacturing materials construction listed this QML. Contractor acquiring activities, military program offices, other government representatives determine hybrid microcircuits meet requirements MIL-PRF-38534 controlled product: Product listed product eligibility section herein marked with "QML" "Q".
AMSC N/A. DISTRIBUTION STATEMENT Approved public release; distribution unlimited
QML-38534-29 -1FSC 5962
non-SMD controlled Product: part will listed QML. However, part will marked with plus Class Level designator". Warning! products were purchased identified MIL-PRF-38534 QML, assume they have been manufactured DSCC certified line, with qualified materials processes, that other MIL-PRF-38534 requirements were performed. determine whether controlled products accordance with MIL-PRF-38534, verify process/material qualifications, call qualifying activity (DSCC-VQ). Only DSCC-VQ Registrations listed herein. Therefore, listed manufacturers have registrations from other registrars. This Qualified Manufacturers List (QML) available from DSCC-VQ World Wide pages. pages accessed address Notes: listing expanded provided appropriate qualification testing performed passed. Therefore manufacturer accept order complaint product covered listing, shall ship compliant product until testing been successfully completed. Package seal perimeter listed largest perimeter successfully tested inches. Package lead counts listed maximum number leads covered qualification. Caution. this number item acquisition. Item acquired this number satisfy performance requirements listed SMD. Inactive design, longer available from manufacturer. Class devices devices, which meet requirements other classes with some exceptions taken. Therefore manufacturer qualified eligible produce mark product compliant class
QML-38534-29
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Aeroflex Circuit Technology (CAGE Code: 88379)
South Service Road, Plainview, 11803-4193, Company Contact: Mazzotta, Phone: 516-694-6700, Fax: 516-694-6715, E-mail: jmazzotta@aeroflex.com DSCC Contact: Jacqueline Cunningham, Phone: 614-692-0584, Fax: 614-692-6942, E-mail: Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options 9000 System: 9001 approved DSCC-VQH Technologies: Linear, Analog, Digital, Power Qualification Letters: EQ(EQC-90-616), EQ(EQC-91-896), EQ(EQC-92-001), EQ(EQC-93-019), EQ(EQC-94-032), ELS(ELSH-94-0342), ELS(ELSH-950042), ELS(ELSH-95-0395), ELS(ELSH-96-0130), ELS(ELSH-96-176), VQ(VQH-98-0001), VQ(VQH-99-0028) Class Level Information: Note Class Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: QAP21-240, QAP21-225 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thick Film Beryllia, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: QAP21-241, QAP21-337 Substrate Attach: Solder, Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors Wire Bonding: Gold, Aluminum Package Information: Notes Package Information: Metal Package, Axial Leads, Seam Weld, 7.94 Seal Perimeter, Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 3.72 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 7.01 Seal Perimeter, Leads, Gold/Solder Lead Finish; Metal Package, can, Projection Weld, Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Platform, Projection Weld, 3.93 Seal Perimeter, Leads, Gold Lead Finish; Ceramic Cofire Package, Axial Leads, Seam Weld, 7.66 Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Analog Devices Incorporated (CAGE Code: 24355)
Assembled Products Division, 7910 Triad Center Drive, Greensboro, 27409-9605, Company Contact: Elaine Trotter, Phone: 910-605-4234, Fax: 910-605-4347, E-mail: elaine.trotter@analog.com DSCC Contact: Joseph Buben Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil Quality Management (QM) Program: Periodic Inspection System: Option 9000 System: 9001 approved DSCC-VQH Technologies: AD/DA Converters, Buffer, Op-Amp, Track Hold, Voltage Reference, Signal Processor, Data Acquisition Systems, DC/DC Converters Qualification Letters: EQ(EQC-92-025), EQ(EQC-92-119), EQ(EQC-92-476), EQ(EQC-93-047), EQ(EQC-93-115), EQ(EQC-93-116), EQ(EQC-93-450), EQ(EQC-93-633), EQ(EQC-93-678), ELS(ELSH-94-172), ELS(ELSH-94-222), VQ(VQH-98-0252) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 3060 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thin Film Alumina, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: 3060 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Transformers, Inductors Wire Bonding: Gold, Aluminum Package Information: Notes Package Information: Metal Package, can, Projection Weld, 1.91 Seal Perimeter, Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Seam Weld, 7.94 Seal Perimeter, Leads, Gold/Solder Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 7.31 Seal Perimeter, Leads, Gold Lead Finish; Ceramic Package, Quad Flat Pack, Seam Weld, 7.31 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold/Solder Lead Finish
QML-38534-29
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Apex Microtechnology Corporation (CAGE Code: 60024)
5980 North Shannon Road, Tucson, 85741-5247, Company Contact: Rick Reed, Phone: 520-690-8695, Fax: 520-888-3329, E-mail: rreed@apexmicrotech.com DSCC Contact: James Eschmeyer, Phone: 614-692-0591, Fax: 614-692-6942, E-mail: james_eschmeyer@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option 9000 System: 9001 approved DSCC-VQH Technologies: Power Op-Amp Qualification Letters: EQ(EQC-91-347), EQ(EQC-92-410), EQ(EQC-92-416), EQ(EQC-93-028), EQ(EQC-93-595), ELS(ELSH-94-0354), ELS(ELSH-950070) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: Flow Substrate Fabrication: Thick Film Beryllia, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: Flow Flow Substrate Attach: Solder Element Attach: Conductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors Wire Bonding: Aluminum Package Information: Notes Package Information: Metal Package, can, Projection Weld, 2.67 Seal Perimeter, Leads, Gold/Solder Lead Finish
QML-38534-29
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Austin Semiconductor, Inc. (CAGE Code: 0EU86)
8701 Cross Park Drive, Austin, 78754-4566, Company Contact: Clem Murdzak, Phone: 512-339-1188, Fax: 512-339-6641, E-mail: clemm@austinsemiconductor.com DSCC Contact: Joseph Buben Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil Quality Management (QM) Program: Periodic Inspection System: Option Technologies: Memory Qualification Letters: VQ(VQH-99-0144) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: Substrate Fabrication: Assembly Information: Note Assembly Flows: 2/ASI-H/512K32F1/A Substrate Attach: Element Attach: Cyanyte Ester Add-on Elements: Unpackaged die, Chip Capacitors Wire Bonding: Gold Package Information: Notes Package Information: Ceramic Co-fire Package, Quad Flat Pack, Solder Seal, 1.76 Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Technology (CAGE Code: 73138)
4200 Bonita Place, Fullerton, 92635-1080, Company Contact: Chris Deleon, Phone: 714-447-2647, Fax: 714-447-2315, E-mail: DSCC Contact: Jonnie Schneider, Phone: 614-692-0585, Fax: 614-692-6942, E-mail: jonnie_schneider@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options Technologies: Voltage Regulator, Data Converters, Analog Qualification Letters: EQ(EQC-89-071), EQ(EQC-91-718), EQ(EQC-92-382), EQ(EQC-92-383), VQH-97-0081 Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 800-403-2 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: 800-403-03 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Peripheral Leads, Seam Weld, 5.86 Seal Perimeter, Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 6.87 Seal Perimeter, Leads, Gold Lead Finish; Ceramic Co-fire Package, Flatpack, Seam Weld, 1.04 Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Boeing Defense Space Group (CAGE Code: 81205)
P.O. 3999, Seattle, 98124-2499, Company Contact: Ronald Pierre, Phone: 253-773-1414, Fax: 253-773-9498, E-mail: ronald.l.stpierre@boeing.com DSCC Contact: James Eschmeyer, Phone: 614-692-0591, Fax: 614-692-6942, E-mail: james_eschmeyer@dscc.dla.mil Quality Management (QM) Program: Periodic Inspection System: Option Technologies: Custom Qualification Letters: EQ(EQM-87-2947), EQ(EQC-91-046), EQ(EQC-92-079), EQ(EQC-91-228), EQ(EQC-91-630), EQ(EQC-91-672), EQ(EQC-91-624), EQ(EQC-91-438) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: D900-10476-1-2 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thick Film Beryllia, Conductor Level(s) Assembly Information: Note Assembly Flows: D900-10476-1-2 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs Wire Bonding: Gold, Ribbon Package Information: Notes Package Information: Metal Package, Axial Leads, Seam Weld, 5.86 Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 9.16 Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified
QML-38534-29
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
C-MAC Microcircuits Limited (CAGE Code: U4388)
South Denes, Great Yarmouth, Norfolk NR30 3PX, England Company Contact: David Lawn, Phone: 0493-856122, Fax: 0493-858536, E-mail: dlawn@yarmouth.cmac.co.uk DSCC Contact: Joseph Buben Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option Technologies: 1553 Transceiver, High Voltage Drivers Qualification Letters: EQ(EQC-91-835), EQ(EQC-92-084), EQ(EQC-93-139), ELS(ELSH-96-0054), ELS(ELSH-96-0161), VQ(VQH-98-0227), VQ(VQH-990192), VQ(VQH-99-0196) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: FCES 6301:15 Substrate Fabrication: Thick Film Alumina, Conductor Level(s) Assembly Information: Note Assembly Flows: FCES 6301:15 Substrate Attach: Conductive Epoxy, Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Axial Leads, Seam Weld, Seal Perimeter, Leads, Gold/Solder Lead Finish; Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Projection Weld, 4.37 Seal Perimeter, Leads, Gold/Solder Lead Finish; Ceramic Package, Grid Array, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish; Metal Package, can, Projection Weld, 1.13 Seal Perimeter, Leads, Gold/Solder Lead Finish
QML-38534-29
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Canadian Marconi Company (CAGE Code: 90073)
Frederik Philips Boulevard, Ville Saint Laurent, Quebec, Canada Company Contact: Gino Pisano, Phone: 514-748-3000, Fax: 514-748-3100 DSCC Contact: Jacqueline Cunningham, Phone: 614-692-0584, Fax: 614-692-6942, E-mail: Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option Technologies: Voltage Regulator Qualification Letters: EQ(EQC-91-720), EQ(EQC-92-427), VQ(VQH-98-0133) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 411-146425-000 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: 411-146425-000 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Axial Leads, Seam Weld, 3.61 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Bathtub, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-10-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Cincinnati Electronics Corporation (CAGE Code: 80045)
7500 Innovation Way, Mason, 45040-9699, Company Contact: Emil Paquette, Phone: 973-573-6243, Fax: 973-573-6290, E-mail: bpaquette@cinele.com DSCC Contact: Jacqueline Cunningham, Phone: 614-692-0584, Fax: 614-692-6942, E-mail: Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option 9000 System: 9001 approved DSCC-VQH Technologies: Custom, Analog, Amplifier, Linear Qualification Letters: VQ(VQH-98-0195) Class Level Information: Note Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 637140 Substrate Fabrication: Thick Film Alumina, Conductor Level(s) Assembly Information: Note Assembly Flows: 637143 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Radial Leads, Laser Seal, Seal Perimeter, Leads, Gold Lead Finish Qualification Letters: EQ(EQC-93-113), EQC-93-197, ELS(ELSH-94-417) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 637140 Substrate Fabrication: Thick Film Alumina, Conductor Level(s) Assembly Information: Note Assembly Flows: 637143 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Axial Leads, Seam Weld, 3.48 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 3.58 Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-11-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Microelectronics (CAGE Code: 23223)
1201 Cumberland Avenue, West Lafayette, 47906-1388, Company Contact: Duane Ringeisen, Phone: 765-463-2565, Fax: 765-497-5399, E-mail: dmr@ctsmicro.com DSCC Contact: Kevin Rudd, Phone: 614-692-0594, Fax: 614-692-6942, E-mail: kevin_rudd@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option Technologies: Analog Converter Qualification Letters: EQ(EQC-92-787), EQ(EQC-93-015), ELS(ELSH-94-0054), VQ(VQH-97-0223) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: STD-THINFLM-BD1, STD-RC-HIREL Substrate Fabrication: Thin Film Alumina, Conductor Level(s), Resistors; Thick Film Alumina Nitride, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: STD-C&W-1772 Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, can, Projection Weld, 2.75 Seal Perimeter, Leads, Gold/Solder Lead Finish; Metal Package, Platform, Projection Weld, 2.35 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-12-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Datel Incorporated (CAGE Code: 50721)
Cabot Boulevard, Mansfield, 02048-1194, Company Contact: Brown, Phone: 508-339-3000, Fax: 508-339-6356, E-mail: tmbrown@datel.com DSCC Contact: Joseph Buben Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option 9000 System: 9001 approved DSCC-VQH Technologies: Digital Qualification Letters: EQ(EQC-90-626), EQ(EQC-90-677), EQ(EQC-91-029), EQ(EQC-92-446), ELS(ELSH-95-0356), VQ(VQH-97-0084), VQ(VQH-980261) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: D-4552 Substrate Fabrication: Thick Film Alumina, Conductor Level(s) Assembly Information: Note Assembly Flows: D-4552 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Chip Resistors Wire Bonding: Gold Package Information: Notes Package Information: Ceramic Package, Dual-in-line, Seam Weld, 7.24 Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-13-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Ireland LTD. (CAGE Code: S7631)
Cork Business Technology Park, Model Farm Road, Cork, Ireland Company Contact: Caroline Dynan, Phone: 353-21-341065, Fax: 353-21-341568, E-mail: cdynan@ilcddc.com DSCC Contact: Joseph Buben Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options Technologies: 1553 Bus, Data Converters Qualification Letters: EQ(EQM-94-0109), ELS(ELSH-94-0163), ELS(ELSH-94-0463), ELS(ELSH-95-0019), ELS(ELSH-95-0116), ELS(ELSH-95-0148), ELS(ELSH-95-0361), ELS(ELSH-96-0038), ELS(ELSH-96-0053), ELS(ELSH-96-0071), VQ(VQH-97-0112), VQ(VQH-98-0182), VQ(VQH-99-0149), VQ(VQH-99-0133) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: (Bohemia, NY): 41637, (Bohemia, NY): 41638 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thin Film Alumina, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: 60005 Substrate Attach: Conductive Epoxy, Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Daughter Board Wire Bonding: Gold Package Information: Notes Package Information: Ceramic Co-fire Package, Axial Leads, Seam Weld, Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Co-fire Package, Axial Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Ceramic Cofire Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Axial Leads, Seam Weld, 7.34 Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld, 5.34 Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified
QML-38534-29
-14-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Technologies Incorporated (CAGE Code: 31395)
P.O. 7700, Norcross, 30091-7700, Company Contact: Kevin Lane, Phone: 770-263-9200, Fax: 770-441-3757, E-mail: lane_kp@elmg.com DSCC Contact: Jacqueline Cunningham, Phone: 614-692-0584, Fax: 614-692-6942, E-mail: Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option Technologies: Analog, Digital Qualification Letters: ELS(ELSH-94-109), ELS(ELSH-95-171), ELS(ELSH-95-172), ELS(ELSH-95-0212), ELS(ELSH-96-0019) Class Level Information: Note Class Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 171771 Substrate Fabrication: Thin Film Alumina, Conductor Level(s); Purchased Thin Film Assembly Information: Note Assembly Flows: 171773 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Cofire Package, Flatpack, Seam Weld, 3.94 Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified
QML-38534-29
-15-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Film Microelectronics Incorporated (CAGE Code: 27851)
Turnpike Street, North Andover, 01845, Company Contact: Gregory Madden, Phone: 508-975-3385, Fax: 508-975-3506 DSCC Contact: Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: bruce_dickerson@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option Technologies: Power Qualification Letters: ELS(ELSH-95-0183), VQ(VQH-98-0177), VQ(VQH-98-0232), VQ(VQH-99-0176), VQ(VQH-99-0204) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 52-0069 Substrate Fabrication: Thin Film Alumina, Conductor Level(s) Assembly Information: Note Assembly Flows: 52-0015 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Resistors Wire Bonding: Gold, Aluminum Package Information: Notes Package Information: Metal Package, Peripheral Leads, Seam Weld, 3.58 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, can, Projection Weld, 1.65 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, can, Projection Weld, Seal Perimeter, Leads, Nickel Lead Finish
QML-38534-29
-16-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
General Microcircuits Corporation (CAGE Code: 67294)
Boston Road, Billerica, 08121-5925, Company Contact: John Gerrior, Phone: 978-663-9101, Fax: 978-63-9132, E-mail: DSCC Contact: Jonnie Schneider, Phone: 614-692-0585, Fax: 614-692-6942, E-mail: jonnie_schneider@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option Technologies: Custom Qualification Letters: EQ(EQC-89-235), EQ(EQC-93-587), VQH-97-0082 Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 10000 Substrate Fabrication: Thin Film Alumina, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: 10000 Substrate Attach: Conductive Epoxy, Nonconductive Epoxy Element Attach: Conductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Peripheral Leads, Seam Weld, 2.45 Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-17-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Hewlett-Packard Company (CAGE Code: 50434)
Optical Communications Division, West Trimble Road, Jose, 95131-1008, Company Contact: Harding, Phone: (408) 435-6707, Fax: (408) 435-6547, E-mail: ann_harding@hp.com DSCC Contact: Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: bruce_dickerson@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options Technologies: Optocoupler Qualification Letters: EQ(EQM-87-2594), EQ(EQM-88-1265), EQ(EQC-90-0754), EQ(EQC-93-271), EQ(EQC-93-591), ELS(ELSH-95-271), VQ(VQH-97047) Class Level Information: Note Class Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: Substrate Fabrication: Purchased Thick Film Assembly Information: Note Assembly Flows: ICPI-9001-3 Substrate Attach: Eutectic, Solder, Silver Glass Element Attach: Eutectic, Silver Glass Add-on Elements: Unpackaged Wire Bonding: Gold, Aluminum Package Information: Notes Package Information: Ceramic Package, Dual-in-line, Solder Seal, 1.28 Seal Perimeter, Leads, Gold/Solder Lead Finish; Ceramic Package, Leadless Chip Carrier, Solder Seal, 0.92 Seal Perimeter, Leads, Solder Lead Finish; Ceramic Package, Peripheral Leads, Solder Seal, 1.32 Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-18-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Honeywell Incorporated (CAGE Code: 58960)
21111 North Nineteenth Avenue, Phoenix, 85027-2700, Company Contact: Mark Glancy, Phone: 602-436-3135, Fax: 602-436-1310, E-mail: mark.h.glancy@cas.honeywell.com DSCC Contact: Kevin Rudd, Phone: 614-692-0594, Fax: 614-692-6942, E-mail: kevin_rudd@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option 9000 System: 9001 approved DSCC-VQH Technologies: Analog, Digital, Drive Controller Qualification Letters: EQ(EQM-87-1933), EQ(EQC-90-0768) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 51549 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: 51550 Substrate Attach: Eutectic Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-19-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Hycomp Incorporated (CAGE Code: 34707)
Cedar Hill Street, Marlborough, 01752-3035, Company Contact: Gregory Madden, Phone: 508-975-3385, Fax: 508-975-3506 DSCC Contact: Edward Raybould, Phone: 614-692-0582, Fax: 614-692-6942, E-mail: edward_raybould@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option Technologies: Analog, Voltage Reference Qualification Letters: EQ(EQC-89-421), ELS(ELSH-94-0252), ELS(ELSH-94-0253), ELS(ELSH-94-0254) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: EMA-75 Substrate Fabrication: Thin Film Alumina, Conductor Level(s); Thin Film Alumina, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: EMA-75 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold Package Information: Notes Package Information: Ceramic Package, Single-in-line, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 2.57 Seal Perimeter, Leads, Gold Lead Finish; Ceramic Package, Leadless Chip Carrier, Seam Weld, 1.62 Seal Perimeter, Leads, Solder Lead Finish
QML-38534-29
-20-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Hytek Microelectronics Incorporated (CAGE Code: OANM4)
Springs Road, Carson City, 89706-1609, Company Contact: Mrs. Kathy Cano, Phone: 702-883-0820, Fax: 702-883-0827, E-mail: kathy@hytek.com DSCC Contact: Bradley Deslich, Phone: 614-692-0593, Fax: 614-692-6942, E-mail: bradley_deslich@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option 9000 System: 9001 approved DSCC-VQH Technologies: Active Delay Line Qualification Letters: EQ(EQC-91-859), EQ(EQM-94-0023) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: RN1005-002 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thick Film Beryllia, Conductor Level(s) Assembly Information: Note Assembly Flows: RN1005-002 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors, Inductors Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Platform, Projection Weld, 2.94 Seal Perimeter, Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Seam Weld, 2.94 Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-21-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Data Device Corporation (CAGE Code: 19645)
Wilbur Place, Bohemia, 11716-2482, Company Contact: Michael Green, Phone: 516-567-5600, Fax: 516-567-7358, E-mail: greenm@ilcddc.com DSCC Contact: Joseph Buben Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil Quality Management (QM) Program: Periodic Inspection System: Options Technologies: 1553 Bus, Data Converters, Power
Engineering Line
Qualification Letters: EQ(EQC-90-657), EQ(EQC-91-606), EQ(EQC-93-625) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 41639, 41638 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thick Film Beryllia, Conductor Level(s), Resistors; Thin Film Alumina, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: 41634, 45552 Substrate Attach: Nonconductive Epoxy, Conductive Epoxy, Solder Element Attach: Nonconductive Epoxy, Conductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors, Transformers Wire Bonding: Gold, Aluminum, Copper/Tin Solder Package Information: Notes Package Information: Metal Package, Axial Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified
Manufacturing Line
Qualification Letters: EQ(EQC-90-220), EQ(EQC-91-104), EQ(EQC-91-306), EQ(EQC-91-308), EQ(EQC-91-386), EQ(EQC-91-667), EQ(EQC-93-055), EQ(EQC-93-199), EQ(EQC-93-599), ELS(ELSH-94-0327), ELS(ELSH-94-0392), ELS(ELSH-94-0399), ELS(ELSH-95-0140), ELS(ELSH-95-0266), VQ(VQH-96-0203), VQ(VQH-98-0101), VQ(VQH-99-0033) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 41637, 41638 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thin Film Alumina, Conductor Level(s) Assembly Information: Note Assembly Flows: 36070, 36071 Substrate Attach: Nonconductive Epoxy, Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Transformers Wire Bonding: Gold, Aluminum Package Information: Notes Package Information: Metal Package, Axial Leads, Seam Weld, 10.26 Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Metal Package, Platform, Projection Weld, 5.38 Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 7.58 Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Axial Leads, Seam Weld, 7.34 Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Peripheral Leads, Seam Weld, 7.34 Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Axial Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Axial Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified
QML-38534-29
-22-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Interpoint Corporation (CAGE Code: 50821)
10301 Willows Road, P.O. 97005, Redmond, 98073-9705, Company Contact: Gordon Kankelfritz, Phone: 425-882-3100, Fax: 425-882-1990, E-mail: gordon.kankelfritz@intp.com DSCC Contact: Richard Barker, Phone: 614-692-0596, Fax: 614-692-6942, E-mail: richard_barker@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option 9000 System: 9001 approved DSCC-VQH Technologies: Linear Amplifier, Signal Processor, Data Converters, DC/DC Converters, Analog, Digital, Filters Qualification Letters: EQ(EQM-87-2838), EQ(EQM-89-0439), EQ(EQC-92-174), EQ(EQC-92-300), EQ(EQC-93-056), EQ(EQC-93-031), EQ(EQC-93-196), EQ(EQC-93-221), EQ(EQC-93-280), EQ(EQC-93-550), EQC-93-624, EQ(EQM-94-043), EQ(EQM-94-0111), ELS(ELSH-94-0297), ELS(ELSH-94-0336), ELS(ELSH-94-0364), ELS(ELSH-95-0036), ELS(ELSH-95-0375), ELS(ELSH-96-0139), ELS(ELSH-96-0095), VQ(VQH-96-0214), VQ(VQH-98-0253), VQ(VQH-99-0013), VQ(VQH-99-0070) Class Level Information: Note Class Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: QA-039 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thick Film Beryllia, Conductor Level(s), Resistors; Thick Film Beryllia, Conductor Level(s) Assembly Information: Note Assembly Flows: QA-039 Substrate Attach: Solder, Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors, Inductors, Toroids Wire Bonding: Gold, Aluminum, Copper Package Information: Notes Package Information: Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Axial Leads, Seam Weld, Seal Perimeter, Leads, Gold/Solder Lead Finish; Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Projection Weld, 4.26 Seal Perimeter, Leads, Gold/Solder Lead Finish
QML-38534-29
-23-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Interpoint Taiwan Corporation (CAGE Code: 50821)
West First Street, KEPZ, Kaohsiung, Taiwan, R.O.C Company Contact: Gordon Kankelfritz, Phone: 425-882-3100, Fax: 425-882-1990, E-mail: gordon.kankelfritz@intp.com DSCC Contact: Richard Barker, Phone: 614-692-0596, Fax: 614-692-6942, E-mail: richard_barker@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option Technologies: DC-DC Converter Qualification Letters: VQ(VQH-97-0266), VQ(VQH-99-0134), VQ(VQH-99-0200) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: QA-039 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: QA-039 Substrate Attach: Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors, Inductors, Toroids Wire Bonding: Gold, Aluminum, Copper Package Information: Notes Package Information: Metal Package, Axial Leads, Projection Weld, 5.14 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-24-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Lambda Advanced Analog Incorporated (CAGE Code: 52467)
2270 Martin Avenue, Santa Clara, 95050-2781, Company Contact: James Mazzuco, Phone: 408-998-4930, Fax: 408-988-2702, E-mail: jim_mazzuco@lambdaaa.com DSCC Contact: Crothers, Phone: 614-692-0583, Fax: 614-692-6942, E-mail: ray_crothers@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option 9000 System: 9001 approved DSCC-VQH Technologies: AD/DA Converters, Sample Hold, Amplifier, DC/DC Converters Qualification Letters: EQ(EQC-93-553), EQ(EQC-93-658), ELS(ELSH-94-0173), ELS(ELSH-94-0211), ELS(ELSH-94-0212), ELS(ELSH-94-0272), ELS(ELSH-94-0482), ELS(ELSH-94-0483), VQ(VQH-98-0100), VQ(VQH-98-0231), EQ(EQC-89-065), EQ(EQC-90-652), EQ(EQC-92103), EQ(EQC-93-204), EQ(EQC-93-403) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 8002-0044 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thick Film Beryllia, Conductor Level(s), Resistors; Purchased Direct Bonded Copper Assembly Information: Note Assembly Flows: 8002-0044 Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors, Transformer Wire Bonding: Gold, Aluminum, Copper Package Information: Notes Package Information: Ceramic Package, Dual-in-line, Seam Weld, 3.69 Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld, 6.58 Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 10.1 Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Can, Projection Weld, 1.64 Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified
QML-38534-29
-25-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Lockheed Martin Electronics Missiles (CAGE Code: 04939)
5600 Sand Lake Road, Orlando, 32819-8907, Company Contact: Agosta, Phone: 407-356-3434, Fax: 407-356-6808 DSCC Contact: Jonnie Schneider, Phone: 614-692-0585, Fax: 614-692-6942, E-mail: jonnie_schneider@dscc.dla.mil Quality Management (QM) Program: Periodic Inspection System: Option Technologies: Analog, Digital Qualification Letters: EQ(EQC-91-402), EQ(EQC-91-764), EQ(EQC-92-112), EQ(EQC-92-312), EQ(EQC-92-412), VQ(VQH-99-0164) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 72301772 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: 72301772 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Chip Resistors, Inductors Wire Bonding: Gold, Aluminum Package Information: Notes Package Information: Ceramic Package, Leadless Chip Carrier, Solder Seal, Seal Perimeter, Leads, Gold Lead Finish; Ceramic Package, Dual-inline, Solder Seal, 2.88 Seal Perimeter, Leads, Gold/Solder Lead Finish; Metal Package, Platform, Projection Weld, 5.76 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Axial Leads, Seam Weld, 11.8 Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-26-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
M.S. Kennedy Corporation (CAGE Code: 51651)
8170 Thompson Road, Cicero, 13039-9393, Company Contact: Daniel Miller, Phone: 315-699-9201, Fax: 315-699-8023, E-mail: msk02@aol.com DSCC Contact: Binh Tonnu, Phone: 614-692-0586, Fax: 614-692-6942, E-mail: binh_tonnu@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options 9000 System: 9001 approved DSCC-VQH Technologies: High Power, Amplifier, H-Bridge, Custom Qualification Letters: EQ(EQC-90-451), EQ(EQC-90-507), EQ(EQC-92-417), EQ(EQC-93-141), EQ(EQC-93-242), EQ(EQC-93-346), EQ(EQC-93-488), EQ(EQC-93-554), EQ(EQC-93-682), EQ(EQC-93-687), EQ(EQM-94-084), EQ(EQM-94-093), ELS(ELSH-94-0400), ELS(ELSH-940401), ELS(ELSH-94-0402), ELS(ELSH-94-0470), ELS(ELSH-95-0020), ELS(ELSH-95-0216), ELS(ELSH-95-0304), ELS(ELSH-960073), ELS(ELSH-96-0086), VQ(VQH-96-0206), VQ(VQH-97-0046), VQ(VQH-97-0073), VQ(VQH-97-0089), VQ(VQH-97-0223), VQ(VQH-97-0228), VQ(VQH-97-0238), VQ(VQH-97-0243), VQ(VQH-98-0246), VQ(VQH-99-0145) Class Level Information: Note Class Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 2422-1563 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thick Film Alumina, Conductor Level(s); Purchased Alumina/Copper; Thick Film Beryllia, Conductor Level(s), Resistors; Thick Film Beryllia, Conductor Level(s) Assembly Information: Note Assembly Flows: 2422-1518 Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors, Inductors Wire Bonding: Gold, Aluminum Package Information: Notes Package Information: Metal Package, Can, Projection Weld, 3.14 Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Metal Package, Platform, Projection Weld, Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 6.95 Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Brazed Leads, Solder Seal, 2.06 Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Metal Package, Brazed Leads, Solder Seal, Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Leadless Chip Carrier, Solder Seal, Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified
QML-38534-29
-27-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Micro Networks Company (CAGE Code: 50507)
Clark Street, Worchester, 01606-1298, Company Contact: Abbie Hartmaier, Phone: 508-852-5400, Fax: 508-853-8296, E-mail: abbie.h@mnc.com DSCC Contact: Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: bruce_dickerson@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option Technologies: Data Converters, Track Hold Qualification Letters: EQ(EQM-88-0709), EQ(EQC-91-235), EQ(EQC-91-894), EQ(EQC-92-062), EQ(EQC-93-162), EQ(EQC-94-008), ELS(ELSH-950269) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: FC-23 Substrate Fabrication: Thin Film Alumina, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: FC-25 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold Package Information: Notes Package Information: Ceramic Package, Dual-in-line, Seam Weld, 7.48 Seal Perimeter, Leads, Gold/Solder Lead Finish; Ceramic Package, Leadless Chip Carrier, Solder Seal, 1.13 Seal Perimeter, Leads, Solder Lead Finish
QML-38534-29
-28-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Micropac Industries, Incorporated (CAGE Code: 31757)
East Walnut Street, Garland, 75040-6696, Company Contact: Shirley Large, Phone: 972-272-3571, Fax: 972-494-2281 DSCC Contact: Richard Barker, Phone: 614-692-0596, Fax: 614-692-6942, E-mail: richard_barker@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options 9000 System: 9001 approved DSCC-VQH Technologies: Custom, Power, Optocouplers
Custom Line
Qualification Letters: EQ(EQC-91-178), EQ(EQC-91-647), EQ(EQC-92-183), EQ(EQC-92-258) Class Level Information: Note Class Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 90138 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: 90138 Substrate Attach: Nonconductive Epoxy, Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Axial Leads, Seam Weld, Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified
Opto Line
Qualification Letters: EQ(EQC-90-624), EQ(EQC-91-188), EQ(EQC-91-466), EQ(EQC-92-120), ELS(ELSH-95-0057), ELS(ELSH-95-0444) Class Level Information: Note Class Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 90138 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thick Film Alumina, Conductor Level(s) Assembly Information: Note Assembly Flows: 90138 Substrate Attach: Conductive Epoxy, Nonconductive Epoxy Element Attach: Conductive Epoxy Add-on Elements: Unpackaged Wire Bonding: Gold Package Information: Notes Package Information: Ceramic Package, Dual-in-line, Solder Seal, 1.89 Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Package, Leadless Chip Carrier, Solder Seal, Seal Perimeter, Leads, Solder Lead Finish, Getter Qualified; Metal Package, (dual base), Projection Weld, 0.54 Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified
QML-38534-29
-29-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Micropac Industries, Incorporated (CAGE Code: 31757)
East Walnut Street, Garland, 75040-6696,
Power Line
Qualification Letters: EQ(EQC-90-625), EQ(EQC-91-328), EQ(EQC-91-338), EQ(EQC-92-183), EQ(EQC-92-258), ELS(ELSH-94-0496) Class Level Information: Note Class Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 90138 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thick Film Beryllia, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: 90138 Substrate Attach: Nonconductive Epoxy, Solder Element Attach: Conductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors Wire Bonding: Gold, Aluminum Package Information: Notes Package Information: Metal Package, Can, Projection Weld, 2.27 Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified
QML-38534-29
-30-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Products Corporation (CAGE Code: 19170)
7426 North Linder Avenue, Skokie, 60077-3219, Company Contact: Keith Stoddard, Phone: (847) 673-8300, Fax: (847) 673-9789, E-mail: kstoddard@mpcproducts.com DSCC Contact: James Eschmeyer, Phone: 614-692-0591, Fax: 614-692-6942, E-mail: james_eschmeyer@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option Technologies: Motor Drive, Analog Power, Custom Qualification Letters: VQ(VQH-97-0067) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 6H95903044A, Sheet Substrate Fabrication: Thick Film Beryllia, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: 6H95903044A, Sheet Substrate Attach: Conductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold, Aluminum Package Information: Notes Package Information: Metal Package, Peripheral, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
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Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Natel Engineering Company, Inc. (CAGE Code: 09059)
4550 Runway Street, Simi Valley, 93063-3493, Company Contact: Betty May, Phone: 818-734-6500, Fax: 818-734-6540, E-mail: natelqamgr@aol.com DSCC Contact: Kevin Rudd, Phone: 614-692-0594, Fax: 614-692-6942, E-mail: kevin_rudd@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option 9000 System: 9001 approved DSCC-VQH Technologies: Synchro/Digital Converters Qualification Letters: EQ(EQC-91-714), EQ(EQC-92-048), EQ(EQC-92-039), EQ(EQC-92-202), EQ(EQC-93-261), ELS(ELSH-95-0154), ELS(ELSH-950314) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: NHPS-01.001 Substrate Fabrication: Thick Film Alumina, Conductor Level(s) Assembly Information: Note Assembly Flows: NHPS-01.001 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Ceramic Posts, Daughter Board Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Axial Leads, Seam Weld, 6.56 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 5.34 Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
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Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
National Hybrid, Incorporated (CAGE Code: 57363)
2200 Smithtown Avenue, Ronkonkama, 11779-7359, Company Contact: Sartorius, Phone: 516-981-2400, Fax: 516-981-2445 DSCC Contact: Joseph Buben Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options 9000 System: 9001 approved DSCC-VQH Technologies: Linear, Data Converters, Digital, Sample Hold, Data Bus, Amplifier, Custom Qualification Letters: EQ(EQC-90-557), EQ(EQC-92-035), EQ(EQC-92-291), EQ(EQM-94-0127), ELS(ELSH-94-255), ELS(ELSH-94-274), ELS(ELSH-94359), ELS(ELSH-94-475), VQ(VQH-97-0093), VQ(VQH-97-0098) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: FL1772A7THK Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thick Film Beryllia, Conductor Level(s) Assembly Information: Note Assembly Flows: FL883500834 Substrate Attach: Conductive Epoxy, Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Inductors, Daughter Board, Chip Thermistor, Inductors Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Axial Leads, Seam Weld, 6.32 Seal Perimeter, Leads, Gold Lead Finish; Metal piece) Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish; Metal piece) Package, Peripheral Leads, Seam Weld, 5.74 Seal Perimeter, Leads, Gold/Solder Lead Finish; Ceramic Package, Side Brazed Leads, Seam Weld, 2.42 Seal Perimeter, Leads, Gold/Solder Lead Finish; Ceramic Co-fire Package, Grid Array, Seam Weld, Seal Perimeter, Leads, Gold/Solder Lead Finish; Ceramic Package, Side Brazed Leads, Solder Seal, 2.26 Seal Perimeter, Leads, Gold/Solder Lead Finish
QML-38534-29
-33-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Northrop Grumman Corporation (CAGE Code: 26916)
Electronic Sensors Systems Sector, Defensive Systems Division, Hicks Road, Rolling Meadows, 60008-1098, Company Contact: Joseph Sowka, Phone: 847-259-9600, Fax: 847-870-5746 DSCC Contact: Joseph Buben Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil Quality Management (QM) Program: Periodic Inspection System: Option Technologies: Digital, Linear Qualification Letters: ELS(ELSH-94-452) Class Level Information: Note Class Substrate Fabrication Information: Note Substrate Fabrication Flows: Custom(BVM)-Process(182) 058-006501-001 Substrate Fabrication: Thick Film Alumina, Conductor Level(s) Assembly Information: Note Assembly Flows: Custom(BVM)-Process(182) 058-006501-001 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-34-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Omnirel Corporation (CAGE Code: 69210)
Crawford Street, Leominster, 01453-2353, Company Contact: Martin Enright, Phone: 978-534-5776, Fax: 978-537-4246, E-mail: menright@omnirel.com DSCC Contact: Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: bruce_dickerson@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option Technologies: Voltage Regulator, Power Qualification Letters: EQ(EQC-91-408), EQ(EQC-91-807), EQ(EQC-91-838), EQ(EQM-94-0029), ELS(ELSH-94-0388), VQ(VQH-98-0014) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: D070002G Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thick Film Beryllia, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: D050015G Substrate Attach: Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors Wire Bonding: Gold, Aluminum Package Information: Notes Package Information: Metal Package, Peripheral Leads, Seam Weld, 2.47 Seal Perimeter, Leads, Solder Lead Finish; Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Can, Projection Weld, 2.64 Seal Perimeter, Leads, Nickel Lead Finish
QML-38534-29
-35-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Q-Bit Corporation (CAGE Code: 55027)
2575 Pacific Avenue N.E., Palm Bay, 32905-2699, Company Contact: Robert Novak, Phone: 407-727-1838, Fax: 407-727-3729, E-mail: rnovak@q-bit.com DSCC Contact: Richard Barker, Phone: 614-692-0596, Fax: 614-692-6942, E-mail: richard_barker@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options 9000 System: 9001 approved DSCC-VQH Technologies: Amplifier Qualification Letters: EQ(EQC-93-252), EQ(EQC-93-529), ELS(ELSH-94-278), ELS(ELSH-94-325), ELS(ELSH-95-0025), ELS(ELSH-96-0074) Class Level Information: Note Class Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 500011 Substrate Fabrication: Thin Film Beryllia, Conductor Level(s); Thin Film Alumina, Conductor Level(s), Resistors; Thick Film Alumina, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: 801805 Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Transformers Wire Bonding: Gold, Copper Package Information: Notes Package Information: Metal Package, Can, Projection Weld, 1.57 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Brazed Leads, Seam Weld, 1.18 Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-36-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Raytheon Company (CAGE Code: 94144)
Missile Systems Division, Centre Street, Quincy, 02169-7530, Company Contact: Joseph Gennari, Phone: 617-984-4109, Fax: 617-984-4195 DSCC Contact: Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: bruce_dickerson@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option Technologies: Amplifier Qualification Letters: EQ(EQM-87-1031), EQ(EQC-91-668), EQ(EQC-91-669), EQ(EQC-92-327), EQ(EQC-92-372) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 38756 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: 42771 Substrate Attach: Nonconductive Epoxy, Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Chip Resistors Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Axial Leads, Seam Weld, 2.76 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 6.36 Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-37-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Raytheon Systems, Inc. (CAGE Code: 96214)
P.O. 655012, Dallas, 75265-5012, Company Contact: Linda Muniz, Phone: 972-995-1096, Fax: 972-995-6206, E-mail: l-muniz1@ti.com DSCC Contact: Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: bruce_dickerson@dscc.dla.mil Quality Management (QM) Program: Periodic Inspection System: Option Technologies: Linear, Converter, Amplifier, Squib Driver, Digital, Regulator Qualification Letters: EQ(EQC-91-031), EQ(EQC-92-392), ELS(ELSH-94-0140), ELS(ELSH-95-0092), ELS(ELSH-95-421), ELS(ELSH-95-422), ELS(ELSH-95-423), ELS(ELSH-95-424), ELS(ELSH-95-425), ELS(ELSH-95-426), ELS(ELSH-95-427), ELS(ELSH-95-428), ELS(ELSH-95-434), ELS(ELSH-95-435), ELS(ELSH-96-0085), ELS(ELSH-96-0113), ELS(ELSH-96-0116), ELS(ELSH-96-0117), ELS(ELSH-96-0149), VQ(VQH-97-0111), VQ(VQH-97-0151) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: All-HYB-005 Substrate Fabrication: Purchased Thick Film Assembly Information: Note Assembly Flows: All-HYB-005 Substrate Attach: Nonconductive Epoxy, Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors Wire Bonding: Gold, Aluminum Package Information: Notes Package Information: Metal Package, Axial Leads, Seam Weld, 7.88 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Single-in-line, Seam Weld, 4.62 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Axial Leads, Projection Weld, 2.43 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 4.78 Seal Perimeter, Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish; Ceramic Package, Leadless Chip Carrier, Seam Weld, 2.76 Seal Perimeter, Leads, Gold Lead Finish; Ceramic Package, Side Brazed Leads, Solder Seal, 2.06 Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-38-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Corporation (CAGE Code: 16478)
West Seventh Avenue Freedley Street, Conshohocken, 19428-1699, Company Contact: Daniel Mieczkowski, Phone: 610-825-3750, Fax: 610-825-3530 DSCC Contact: Jonnie Schneider, Phone: 614-692-0585, Fax: 614-692-6942, E-mail: jonnie_schneider@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option 9000 System: 9001 approved DSCC-VQH Technologies: Microwave, Amplifier Qualification Letters: VQ(VQH-96-0224) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: Substrate Fabrication: Purchased Thick Film Assembly Information: Note Assembly Flows: 476038, 376189 Substrate Attach: Conductive Epoxy Element Attach: Conductive Epoxy, Eutectic, Solder Add-on Elements: Unpackaged Die, Chip Capacitors Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Can, Projection Weld, Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-39-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
REMEC Incorporated (CAGE Code: 65628)
9404 Chesapeake Drive, Diego, 92123, Company Contact: Bradford Born, Phone: 619-505-3294, Fax: 619-569-7364, E-mail: bborn@remec.com DSCC Contact: Richard Barker, Phone: 614-692-0596, Fax: 614-692-6942, E-mail: richard_barker@dscc.dla.mil Quality Management (QM) Program: Periodic Inspection System: Option 9000 System: 9001 approved DSCC-VQH Technologies: Microwave Amplifier, Microwave Filter, Microwave Custom (IMAs) Qualification Letters: ELS(ELSH-94-199), VQ(VQH-96-226), VQ(VQH-96-227), VQ(VQH-97-0180), VQ(VQH-97-0181) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: Substrate Fabrication: Purchased Thin Film; Purchased Duriod; Purchased Polyimide/PWB Copper Assembly Information: Note Assembly Flows: 001775 Substrate Attach: Conductive Epoxy, Eutectic, Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Toroids, Coils, Thermcon, Inductors Wire Bonding: Gold, Copper, Ribbon Package Information: Notes Package Information: Metal Package, Peripheral Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish; Aluminum/Stainless Steel Package, DC/Microwave Leads, Laser Weld, 12.5 Seal Perimeter, Leads; Aluminum/Stainless Steel Package, DC/Microwave Leads (DualSided, Multi-Cavity), Laser Weld, Seal Perimeter, Leads
QML-38534-29
-40-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Sipex Corporation (CAGE Code: 33256)
Hybrid Systems Division, Linnell Circle, Billerica, 01821-3985, Company Contact: Herb Shifres, Phone: 978-667-8700, Fax: 978-667-8310, E-mail: hshifres@sipex.com DSCC Contact: Edward Raybould, Phone: 614-692-0582, Fax: 614-692-6942, E-mail: edward_raybould@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options Technologies: Converter, Converter, Data Acquisition Systems, Sample Hold, Voltage Reference Qualification Letters: EQ(EQC-90-506), EQ(EQC-91-781), EQ(EQC-91-813), EQ(EQC-92-052), EQ(EQC-92-438), EQ(EQC-93-524), ELS(ELSH-94-0329), ELS(ELSH-94-477), ELS(ELSH-95-0075), ELS(ELSH-95-0215), VQ(VQH-99-0177) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 239-0232 Substrate Fabrication: Thin Film Alumina, Conductor Level(s); Purchased Thick Film Assembly Information: Note Assembly Flows: 239-0458 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold Package Information: Notes Package Information: Ceramic Package, Dual-in-line, Seam Weld, 7.48 Seal Perimeter, Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Seam Weld, 5.78 Seal Perimeter, Leads, Gold/Solder Lead Finish; Ceramic Package, Leadless Dual-in-line, Seam Weld, 4.17 Seal Perimeter, Leads, Solder Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 5.53 Seal Perimeter, Leads, Gold/Solder Lead Finish; Ceramic Package, Axial Leads, Seam Weld, 2.88 Seal Perimeter, Leads, Gold/Solder Lead Finish
QML-38534-29
-41-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Solitron Devices, Incorporated (CAGE Code: 21845)
3301 Electronics Way, West Palm Beach, 33407-4697, Company Contact: Roman, Phone: 407-848-4311, Fax: 407-863-5946, E-mail: eroman@solitrondevices.com DSCC Contact: Bradley Deslich, Phone: 614-692-0593, Fax: 614-692-6942, E-mail: bradley_deslich@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options Technologies: Linear, Power, Voltage Regulator Qualification Letters: ELS(ELSH-94-0316), ELS(ELSH-94-0433), ELS(ELSH-95-0079), ELS(ELSH-95-0210), VQ(VQH-99-0180), VQ(VQH-99-0195) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: H1043 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thick Film Beryllia, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: H1040 Substrate Attach: Eutectic, Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs Wire Bonding: Gold, Aluminum Package Information: Notes Package Information: Metal Package, Peripheral Leads, Seam Weld, 4.64 Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Can, Projection Weld, 2.86 Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified
QML-38534-29
-42-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
Teledyne Electronic Technologies (CAGE Code: 16170)
12964 Panama Street, Angeles, 90066-6534, Company Contact: Steve Thompson, Phone: 310-574-2047, Fax: 310-574-2093, E-mail: steven_e_thompson@teledyne.com DSCC Contact: James Eschmeyer, Phone: 614-692-0591, Fax: 614-692-6942, E-mail: james_eschmeyer@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Option Technologies: Data Converters, Linear, Microwave Qualification Letters: EQ(EQM-87-1898), EQ(EQC-91-897), EQ(EQM-94-0085), EQ(EQM-94-0098), EQ(EQM-94-138), ELS(ELSH-94-313) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 7700530 Exhibit 2.5, 7700530 Exhibit Substrate Fabrication: Thick Film Alumina, Conductor Level(s); Thick Film Alumina, Conductor Level(s), Resistors; Thin Film Alumina, Conductor Level(s), Resistors Assembly Information: Note Assembly Flows: 7700530 Exhibit Substrate Attach: Nonconductive Epoxy, Solder Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, Eutectic Add-on Elements: Unpackaged Die, Chip Capacitors Wire Bonding: Gold, Aluminum, Ribbon Package Information: Notes Package Information: Metal Package, Peripheral Leads, Seam Weld, 8.75 Seal Perimeter, Leads, Gold Lead Finish; Metal Package, Axial Leads, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish
QML-38534-29
-43-
Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Defense Supply Center, Columbus MIL-PRF-38534 Program Status
White Electronic Design Corporation (CAGE Code: 54230)
3601 East University Drive, Phoenix, 85043-7217, Company Contact: Marlene Maat, Phone: 602-437-1520, Fax: 602-437-9120, E-mail: maat@whitemicro.com DSCC Contact: James Eschmeyer, Phone: 614-692-0591, Fax: 614-692-6942, E-mail: james_eschmeyer@dscc.dla.mil Quality Management (QM) Program: Non-TRB Periodic Inspection System: Options 9000 System: 9001 approved DSCC-VQH Technologies: Linear (Oscillator), Digital Memory Qualification Letters: EQ(EQC-92-070), EQ(EQC-92-138), EQC-93-457, EQ(EQC-93-508), ELS(ELSH-94-0256), ELS(ELSH-95-0107), ELS(ELSH-950365), ELS(ELSH-95-0014), ELS(ELSH-96-0184), ELS(ELSH-96-0186), VQ(VQH-96-0210), VQ(VQH-96-0211), VQ(VQH-97-0016), VQ(VQH-97-0170), VQ(VQH-98-0172) Class Level Information: Note Class Class Substrate Fabrication Information: Note Substrate Fabrication Flows: 106A00006 Substrate Fabrication: Thick Film Alumina, Conductor Level(s), Resistors; Thick Film Alumina, Conductor Level(s) Assembly Information: Note Assembly Flows: 106A00006 Substrate Attach: Nonconductive Epoxy Element Attach: Conductive Epoxy, Nonconductive Epoxy Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors Wire Bonding: Gold Package Information: Notes Package Information: Metal Package, Platform, Projection Weld, 3.53 Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Cofire Package, Brazed Leads, Seam Weld, 5.36 Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Cofire Package, Axial Leads, Seam Weld, 4.58 Seal Perimeter, Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Package, Grid Array, Seam Weld, Seal Perimeter, Leads, Gold Lead Finish, Getter Qualified
QML-38534-29
-44-
Standardized Microcircuit Drawing (SMD) Approved Source Master Product Listing: Table Table Table Table PRODUCT ELIGIBILITY: manufacturers listed tables have certified that Hybrid Microcircuits built, tested, shipped using MIL-PRF-38534 CERTIFIED FLOW/QUALIFIED MATERIALS MANUFACTURING TECHNIQUES FULL COMPLIANCE with MIL-PRF-38534 requirements. Defense Supply Center, Columbus Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Approved Source Master Product Listing Sorted Standard Microcircuit Drawing
Table
Standard Microcircuit Drawing
7801301XC 7801301XA 7801301GA 7801301XA 8001301ZA 8001301ZC 8001301ZA 8001401ZC 8001401ZA 8001401ZA 8102801UA 8102801EC 8102801UC 8102801EA 8102801TA 8102801EA 8102801XA 8102801XC 8102801EC 8102802ZA 8102802PC 8102802YA 8102802PA 8102802PA 8102802PC 8102802YC 81028032A 81028032A 81028032C 8102804FC 8102805PC 8102805PA 8300201JC 8300201JA 8300201XA 8302401EC 8302401EA 8302401XA QML-38534-29
Manufacturer Similar Part Number
MSK0002H FLH0002H/883 LH0002 MSK0002H FLH0032G/883 MSK0032B MSK0032B MSK0033B MSK0033B FLH0033G/883 6N134/883B#100 66013-001 6N134/883B#100 66013-001 6N134/883B#300 6N134/883B#200 66072-001/883B 66072-001/883B 6N134/883B HCPL-5631#300 HCPL-5631 HCPL-5631#100 66056-103 HCPL-5631#200 66056-103 HCPL-5631#100 HCPL-6631 66123-001 66123-001 HCPL-6651 HCPL-5651 HCPL-5651#200 DAC87CBI DAC87CBI DAC87 6N140A/883B 6N140A/883B 6N140A
ESDS Product Class Type/Description
3(4) 3(4) 3(4) CURRENT AMPLIFIER CURRENT AMPLIFIER CURRENT AMPLIFIER CURRENT AMPLIFIER VOLT. FOLLOWER/BUFFER VOLT. FOLLOWER/BUFFER VOLT. FOLLOWER/BUFFER OPTOCOUPLER, DUAL OPTOCOUPLER, DUAL OPTOCOUPLER, DUAL OPTOCOUPLER, DUAL OPTOCOUPLER, DUAL OPTOCOUPLER, DUAL OPTOCOUPLER, DUAL OPTOCOUPLER, DUAL OPTOCOUPLER, DUAL OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, QUAD-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS CONVERTER, 12-BIT, RANGE-PROGRAMMABLE VOLTAGE OUTPUT CONVERTER, 12-BIT, RANGE-PROGRAMMABLE VOLTAGE OUTPUT CONVERTER, 12-BIT, RANGE-PROGRAMMABLE VOLTAGE OUTPUT OPTOCOUPLER, 4-CHANNEL OPTOCOUPLER, 4-CHANNEL OPTOCOUPLER, 4-CHANNEL -45-
Approved Source
Source Micropac Micropac Micropac Micropac Micropac Micropac Micropac Micropac Analog Analog Source Micropac Micropac Micropac
CAGE Code
51651 27851 51651 27851 51651 51651 51651 51651 27851 50434 31757 50434 31757 50434 50434 31757 31757 50434 50434 50434 50434 31757 50434 31757 50434 50434 31757 31757 50434 50434 50434 24355 24355
31757 31757 31757
Defense Supply Center, Columbus Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Approved Source Master Product Listing Sorted Standard Microcircuit Drawing
Table
Standard Microcircuit Drawing
8302401FC 8302401EC 8302401ZC 8302401ZA 8302401EA 8302401YA 8302401YC 8302401XA 8503001XA 8503001CA 8503001YC 8503001YA 8503001CC 85030013A 8503001YA 8503002YC 8503002YA 8503002CA 8503002XA 8503002CC 85030023A 8503002YA 8503003YA 8503003CC 8503003CA 8503003YC 8503003YA 85030033A 8503003XA 8503004CA 8503004CC 85030043A 8503004YA 8503004YA 8503004YC 8503004XA 8503005YA 8503005CC 8503005YA 85030053A 8503005CA 8503005YC 8503005YC 8503005YA 8503006YC 8503006YA 85030063A 8503006YA 8503006CC 8503006CA 8503006YC 8503006YA 8508701ZC 8508701ZA QML-38534-29
Manufacturer Similar Part Number
HCPL-6751 6N140A/883B 6N140A/883B#600 6N140A/883B#600 6N140A/883B#200 6N140A/883B#100 6N140A/883B#100 6N140A/883B#300 2700 HS2700SD/883B HS2700SD HS2700SD HS2700SD/883B HC2700SLCC/883B HC2700SD/883B HS2700SD HS2700SD HS2700UD/883B 2700U HS2700UD/883B HC2700ULCC/883B HC2700UD/883B HC2702SD/883B HS2702SD/883B HS2702SD/883B HS2702SD HS2702SD HC2702SLCC/883B 2702S HS2702UD/883B HS2702UD/883B HC2702ULCC/883B HC2702UD/883B HS2702SD HS2702SD 2702U HS2701SD HS2701SD/883B HC2701SD/883B HC2701SLCC/883B HS2701SD/883B HS2701SD 2701SD/883B 2701SD/883B 2701UD/883B 2701UD/883B HC2701ULCC/883B HC2701UD/883B HS2701UD/883B HS2701UD/883B HS2701UD HS2701UD MSK0041B MSK0041B
ESDS Product Class Type/Description
3(>4) OPTOCOUPLER, 4-CHANNEL OPTOCOUPLER, 4-CHANNEL OPTOCOUPLER, 4-CHANNEL OPTOCOUPLER, 4-CHANNEL OPTOCOUPLER, 4-CHANNEL OPTOCOUPLER, 4-CHANNEL OPTOCOUPLER, 4-CHANNEL OPTOCOUPLER, 4-CHANNEL VOLT. REFERENCE, +10.000V, PRECISION VOLT. REFERENCE, +10.000V, PRECISION VOLT. REFERENCE, +10.000V, PRECISION VOLT. REFERENCE, +10.000V, PRECISION VOLT. REFERENCE, +10.000V, PRECISION VOLT. REFERENCE, +10.000V, PRECISION VOLT. REFERENCE, +10.000V, PRECISION VOLT. REFERENCE, +10.000V, PRECISION VOLT. REFERENCE, +10.000V, PRECISION VOLT. REFERENCE, +10.000V, PRECISION VOLT. REFERENCE, +10.000V, PRECISION VOLT. REFERENCE, +10.000V, PRECISION VOLT. REFERENCE, +10.000V, PRECISION VOLT. REFERENCE, +10.000V, PRECISION VOLT. REFERENCE, ±10.000V, PRECISION VOLT. REFERENCE, ±10.000V, PRECISION VOLT. REFERENCE, ±10.000V, PRECISION VOLT. REFERENCE, ±10.000V, PRECISION VOLT. REFERENCE, ±10.000V, PRECISION VOLT. REFERENCE, ±10.000V, PRECISION VOLT. REFERENCE, ±10.000V, PRECISION VOLT. REFERENCE, ±10.000V, PRECISION VOLT. REFERENCE, ±10.000V, PRECISION VOLT. REFERENCE, ±10.000V, PRECISION VOLT. REFERENCE, ±10.000V, PRECISION VOLT. REFERENCE, ±10.000V, PRECISION VOLT. REFERENCE, ±10.000V, PRECISION VOLT. REFERENCE, ±10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION VOLT. REFERENCE, -10.000V, PRECISION AMP, POWER AMP, POWER -46-
Approved Source
Source Sipex Sipex Sipex Sipex Hycomp Hycomp Sipex Sipex Sipex Source Sipex Hycomp Hycomp Hycomp Sipex Sipex Sipex Sipex Hycomp Source Sipex Sipex Hycomp Hycomp Sipex Sipex Source Sipex Sipex Hycomp Hycomp Sipex Sipex Analog Analog Analog Analog Hycomp Hycomp Sipex Sipex Sipex Sipex
CAGE Code
50434 50434 50434 50434 50434 50434 50434 50434 33256 33256 33256 33256 34707 34707 33256 33256 33256 33256 34707 34707 34707 33256 33256 33256 33256 34707 33256 33256 34707 34707 33256 33256 33256 33256 34707 34707 33256 33256 24355 24355 24355 24355 34707 34707 33256 33256 33256 33256 51651 51651
Defense Supply Center, Columbus Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Approved Source Master Product Listing Sorted Standard Microcircuit Drawing
Table
Standard Microcircuit Drawing
8508701ZA 8508801YA 8508801YC 8508801YA 8508901YA 8508902YA 5962-8604901XA 5962-8604902TC 5962-8604902ZA 5962-8604902ZC 5962-8604902TA 5962-8604903YA 5962-8604903YC 5962-8604904UA 5962-8604904UC 5962-8604905XA 5962-8604905XC 5962-8604905YA 5962-8604906YA 5962-8604906YC 5962-8604906TA 5962-8604906TC 5962-8604907XA 5962-8604907XC 5962-8604908XA 5962-8604908XC 5962-8753501XC 5962-8753501YA 5962-8753501YC 5962-8753501XA 5962-8753502YC 5962-8753502YA 5962-8753502XC 5962-8753502XA 5962-8757901YA 5962-8757901XA 5962-8757902YA 5962-8757902XC 5962-8757902YC 5962-8757902XA 5962-8757902XA QML-38534-29
Manufacturer Similar Part Number
FLH0041G/883 MSK0021B MSK0021B FLH0021K/883 FLH0101AK/883 FLH0101K/883 BUS-63105 BUS-63106II BUS-63105II BUS-63105II BUS-63106II ARX2402 ARX2402 ARX3402 ARX3402 BUS-8553 BUS-8553 CT1487M NHI-1509 NHI-1509 NHI-1509FP NHI-1509FP FC155361 FC155361 FC155362 FC155362 BUS-65112 BUS-65117 BUS-65117 BUS-65112 ARX2452FP ARX2452FP ARX2452 ARX2452 BUS-63125 BUS-63125 BUS-63126II BUS-63125II BUS-63126II BUS-63125II BUS63125II
ESDS Product Class Type/Description
AMP, POWER AMP, POWER AMP, POWER AMP, POWER AMP, POWER AMP, POWER DRIVER-RECEIVER, SINGLE CHANNEL (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL, (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL, (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL, (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL, (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL (INTERFACES WITH MANCHESTER ENCODER-DECODER) DRIVER-RECEIVER, SINGLE CHANNEL DRIVER-RECEIVER, SINGLE CHANNEL REMOTE TERMINAL UNIT, DUAL REDUNDANT REMOTE TERMINAL UNIT, DUAL REDUNDANT REMOTE TERMINAL UNIT, DUAL REDUNDANT REMOTE TERMINAL UNIT, DUAL REDUNDANT REMOTE TERMINAL UNIT, DUAL REDUNDANT REMOTE TERMINAL UNIT, DUAL REDUNDANT REMOTE TERMINAL UNIT, DUAL REDUNDANT REMOTE TERMINAL UNIT, DUAL REDUNDANT TRANSCEIVER, DUAL CHANNEL TRANSCEIVER, DUAL CHANNEL TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER -47-
Approved Source
Source Ire. Ire. Ire. Ire. Aeroflex Aeroflex Aeroflex Aeroflex Source National Hyb. National Hyb. National Hyb. National Hyb. C-MAC C-MAC C-MAC C-MAC Aeroflex Aeroflex Aeroflex Aeroflex Source Source Ire.
CAGE Code
27851 51651 51651 27851 27851 27851
S7631 S7631 S7631 S7631 88379 88379 88379 88379 19645 19645
57363 57363 57363 57363 U4388 U4388 U4388 U4388 19645 19645 19645 19645 88379 88379 88379 88379
19645 19645 19645 19645 S7631
Defense Supply Center, Columbus Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Approved Source Master Product Listing Sorted Standard Microcircuit Drawing
Table
Standard Microcircuit Drawing
5962-8757902XC 5962-8757902YA 5962-8757902YC 5962-8757903YA 5962-8757903XA 5962-8757904XA 5962-8757904ZA 5962-8757904YA 5962-8757904UA 5962-8757905YA 5962-8757905XA 5962-8757905YC 5962-8757905XC 5962-8757906XA 5962-8757906XC 5962-8757906YA 5962-8757906YC 5962-8757907XA 5962-8757907YA 5962-8757908XA 5962-8757908YA 5962-8757909YA 5962-8757909YC 5962-8757909XC 5962-8757909XA 5962-8757910YA 5962-8757910XA 5962-8757910XC 5962-8757910YC 5962-8761701XC 5962-8761701XC 5962-8761701XA 5962-8761701XA 5962-8761701YC 5962-8761701XC 5962-8761701XA 5962-8761701YA 5962-8761702XC 5962-8761702XA 5962-8762001XC 5962-8762001XA 5962-8762002YC 5962-8762002YA 5962-8763201XA 5962-8767901EA 5962-8767901TC 5962-8767901UA 5962-8767901EA 5962-8767901UC
Manufacturer Similar Part Number
BUS63125II BUS63126II BUS63126II ARX2411 ARX2411 ARX3411 ARX3411 ARX3411 ARX3411 NHI-1500FP NHI-1500 NHI-1500FP NHI-1500 FC1553623 FC1553623 FC1553623FP FC1553623FP CT1487D CT1487D MR63125M MR63125M FC1553621FP FC1553621FP FC1553621 FC1553621 ACT4487-DF ACT4487-D ACT4487-D ACT4487-DF 0006H 51992 0006H 51992 11105-DESC 11563-DESC 11563-DESC 11105-DESC 0008H 0008H MIOP42106/883 MIOP42106/883 PA51M/883 PA51M/883 BUS-65111 66024-001 66024-001J 4N55/883B#100 4N55/883B#200 4N55/883B#100
ESDS Product Class Type/Description
TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER TRANSCEIVER, DUAL CHANNEL, LOW-POWER DRIVER-RECEIVER, DUAL CHANNEL, LOW-POWER DRIVER-RECEIVER, DUAL CHANNEL, LOW-POWER DRIVER-RECEIVER, DUAL CHANNEL, LOW-POWER DRIVER-RECEIVER, DUAL CHANNEL, LOW-POWER DRIVER-RECEIVER, DUAL CHANNEL, LOW-POWER DRIVER-RECEIVER, DUAL CHANNEL, LOW-POWER DRIVER-RECEIVER, DUAL CHANNEL, LOW-POWER DRIVER-RECEIVER, DUAL CHANNEL, LOW-POWER DRIVER-RECEIVER, DUAL CHANNEL, LOW-POWER DRIVER-RECEIVER, DUAL CHANNEL, LOW-POWER DRIVER, HIGH VOLTAGE, 1.5A DRIVER, HIGH VOLTAGE, 1.5A DRIVER, HIGH VOLTAGE, 1.5A DRIVER, HIGH VOLTAGE, 1.5A DRIVER, HIGH VOLTAGE, 1.5A DRIVER, HIGH VOLTAGE, 1.5A DRIVER, HIGH VOLTAGE, 1.5A DRIVER, HIGH VOLTAGE, 1.5A DRIVER, HIGH VOLTAGE, HIGH CURRENT, 3.0A DRIVER, HIGH VOLTAGE, HIGH CURRENT, 3.0A AMP, HIGH-POWER AMP, HIGH-POWER AMP, HIGH-POWER AMP, HIGH-POWER REMOTE TERMINAL UNIT, POWER, DUAL, REDUNDANT OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS -48-
Approved Source
Ire. Ire. Ire. Source Source Source Source Source Source National Hyb. National Hyb. National Hyb. National Hyb. C-MAC C-MAC C-MAC C-MAC Source Source Source Source C-MAC C-MAC C-MAC C-MAC Aeroflex Aeroflex Aeroflex Aeroflex Micropac Micropac C-MAC C-MAC C-MAC C-MAC Micropac Micropac Apex Apex Source Micropac Micropac
CAGE Code
S7631 S7631 S7631
57363 57363 57363 57363 U4388 U4388 U4388 U4388
U4388 U4388 U4388 U4388 88379 88379 88379 88379 51651 31757 51651 31757 U4388 U4388 U4388 U4388 51651 51651 31757 31757 60024 60024
31757 31757 50434 50434 50434
QML-38534-29
Defense Supply Center, Columbus Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Approved Source Master Product Listing Sorted Standard Microcircuit Drawing
Table
Standard Microcircuit Drawing
5962-8767901EC 5962-8767901EC 5962-87679012A 5962-8767901TA 5962-8767901TA 5962-8767902XC 5962-8767902XA 5962-8767902YA 5962-8767902PC 5962-8767902XA 5962-8767902YC 5962-8767902PC 5962-8767902PA 5962-8767902PA 5962-87679032A 5962-87679032C 5962-87679032A 5962-8767904FC 5962-8767905KUC 5962-8767905KTC 5962-8767905KEA 5962-8767905KTA 5962-8767905KUA 5962-8767905KEA 5962-8767905KTA 5962-8767905KEC 5962-8767905KEC 5962-8767906KXA 5962-8767906KPC 5962-8767906KPA 5962-8767906KYA
Manufacturer Similar Part Number
4N55/883B 66024-001 66024 4N55/883B#300 66024-001J 66126-103J 66126-103J HCPL-5531#100 66126-103 HCPL-5531#300 HCPL-5531#100 HCPL-5531 HCPL-5531#200 66126-103 HCPL-6531 66125-001 66125-001 HCPL-6551 HCPL-275K#100 66024-300T 66024-300 66024-300T HCPL-275K#100 HCPL-275K#200 HCPL-275K#300 HCPL-275K 66024-300 HCPL-553K#300 HCPL-553K HCPL-553K#200 HCPL-553K#100
ESDS Product Class Type/Description
OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE SUPPLY VOLTAGE CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE SUPPLY VOLTAGE CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE SUPPLY VOLTAGE CONNECTIONS OPTOCOUPLER, QUAD-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPERATE SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS
Approved Source
Micropac Source Micropac Micropac Micropac Micropac Micropac Micropac Micropac Micropac Micropac Micropac Micropac
CAGE Code
50434 31757
3(4) 3(4) 3(4) 3(4) 3(4) 3(4) 3(4) 3(4) 3(4) 3(4)
50434 31757 31757 31757 50434 31757 50434 50434 50434 50434 31757 50434 31757 31757 50434 50434 31757 31757 31757 50434 50434 50434 50434 31757 50434 50434 50434 50434
QML-38534-29
-49-
Defense Supply Center, Columbus Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Approved Source Master Product Listing Sorted Standard Microcircuit Drawing
Table
Standard Microcircuit Drawing
5962-8767906KPA 5962-8767906KPC 5962-8767906KXA 5962-8767906KXC 5962-8767906KYC 5962-8767907K2A 5962-8767907K2A 5962-8767908KFC 5962-8768701XA 5962-8768701YA 5962-8768701YC 5962-8768701XC 5962-8768701XC 5962-8768701XA 5962-8768702YA 5962-8768702XC 5962-8768702YC 5962-8768702XA 5962-8768702XA 5962-8768702XC 5962-8768703YA 5962-8768703XA 5962-8768703XC 5962-8768703YC 5962-8768703XA 5962-8768703XC 5962-8768801YA 5962-8768801XA 5962-8768801XC 5962-8768802XA 5962-8768802XC 5962-8768802YA 5962-8850801XC 5962-8850802XA 5962-8850802XC 5962-8850802XC 5962-8850901XC 5962-8850901XA 5962-8850902XC 5962-8850902XA 5962-8851001XA 5962-8851001XC 5962-8851002XC 5962-8851003XA 5962-8851004XA 5962-8851401XC 5962-8851401XA QML-38534-29
Manufacturer Similar Part Number
66126-300 66126-300 66126-300J 66126-300J HCPL-553K#100 HCPL-653K 66125-300 HCPL-655K HSDC8920A883B RDC14505-638C RDC14505-638C HSDC8920A883B HSDC8920A883B HSDC8920A883B RDC14505-639C RDC14505-639 RDC14505-639C RDC14505-639 HSDC8920883B HSDC8920883B RDC14505-641C RDC14505-641 RDC14505-641 RDC14505-641C RDC14505-641 RDC14505-641 MN3008 MN3008H/B MN3008H/B MN3009H/B MN3009H/B MN3009 ADC-HX/883B MNADC87H/B MNADC87H/B ADC-HZ/883B AD390SD/883B AD390SD/883B AD390TD/883B AD390TD/883B AD394SD/883B AD394SD/883B AD394TD/883B AD395S AD395T HS9403B-8 HS9403B-8
ESDS Product Class Type/Description
3(4) 3(4) 3(4) OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE SUPPLY VOLTAGE CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE SUPPLY VOLTAGE CONNECTIONS OPTOCOUPLER, QUAD-CHANNEL, WITH COMMON SUPPLY VOLTAGE GROUND CONNECTIONS RESOLVER-TO-DIGITAL CONVERTER, RESOLVER-TO-DIGITAL CONVERTER, RESOLVER-TO-DIGITAL CONVERTER, RESOLVER-TO-DIGITAL CONVERTER, RESOLVER-TO-DIGITAL CONVERTER, RESOLVER-TO-DIGITAL CONVERTER, RESOLVER-TO-DIGITAL CONVERTER, RESOLVER-TO-DIGITAL CONVERTER, RESOLVER-TO-DIGITAL CONVERTER, RESOLVER-TO-DIGITAL CONVERTER, RESOLVER-TO-DIGITAL CONVERTER, RESOLVER-TO-DIGITAL CONVERTER, RESOLVER-TO-DIGITAL CONVERTER, INPUT RESOLVER-TO-DIGITAL CONVERTER, INPUT RESOLVER-TO-DIGITAL CONVERTER, INPUT RESOLVER-TO-DIGITAL CONVERTER, INPUT RESOLVER-TO-DIGITAL CONVERTER, INPUT RESOLVER-TO-DIGITAL CONVERTER, INPUT CONVERTER, 8-BIT, OUTPUT CONVERTER, 8-BIT, OUTPUT CONVERTER, 8-BIT, OUTPUT CONVERTER, 8-BIT, OUTPUT CONVERTER, 8-BIT, OUTPUT CONVERTER, 8-BIT, OUTPUT CONVERTER, 12-BIT CONVERTER, 12-BIT CONVERTER, 12-BIT CONVERTER, 12-BIT CONVERTER, QUAD 12-BIT CONVERTER, QUAD 12-BIT CONVERTER, QUAD 12-BIT CONVERTER, QUAD 12-BIT CONVERTER, QUAD 12-BIT CONVERTER, QUAD 12-BIT CONVERTER, QUAD 12-BIT CONVERTER, QUAD 12-BIT CONVERTER, QUAD 12-BIT DATA ACQUISITION SYSTEM, 12-BIT, 8-CHANNEL DIFFERENTIAL INPUT DATA ACQUISITION SYSTEM, 12-BIT, 8-CHANNEL DIFFERENTIAL INPUT -50-
Approved Source
Micropac Micropac Micropac Micropac Micropac Ire. Ire. Ire. Ire. Ire. Ire. Source Micro Micro Micro Micro Source Datel Micro Micro Datel Analog Analog Analog Analog Analog Analog Analog Source Source Sipex Sipex
CAGE Code
31757 31757 31757 31757 50434 50434 31757 50434 19645 19645 19645 19645 S7631 S7631 19645 19645 19645 19645 S7631 S7631 19645 19645 19645 19645 S7631 S7631 50507 50507 50507 50507 50721 50507 50507 50721 24355 24355 24355 24355 24355 24355 24355
33256 33256
Defense Supply Center, Columbus Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Approved Source Master Product Listing Sorted Standard Microcircuit Drawing
Table
Standard Microcircuit Drawing
5962-8851402XC 5962-8851402XA 5962-8851402YA 5962-8851403XA 5962-8851403XC 5962-8851404XA 5962-8851404XC 5962-8851701XC 5962-8851701YA 5962-8851701YC 5962-8851701XA 5962-8851702YA 5962-8851702XA 5962-8851702YC 5962-8851702XC 5962-8854201XC 5962-8854201YA 5962-8854201XA 5962-8854201YC 5962-8857901XC 5962-8857902XC 5962-8858501XA 5962-8858501XC 5962-8858501YA 5962-8858501YC 5962-8858601YA 5962-8858601XC 5962-8858601XA 5962-8858601YC 5962-8862901XC 5962-8862901XA 5962-8865801XC 5962-8865801XA 5962-8865802XC 5962-8865802XA 5962-8865803XA 5962-8865803XC 5962-8865804XC 5962-8865804XA 5962-8869201TC 5962-8869201ZA 5962-8869201XC 5962-8869201XA 5962-8869201YA 5962-8869201TA 5962-8869201XA QML-38534-29
Manufacturer Similar Part Number
HS9403B-16 HS9403B-16 HS9403-16 HDAS-8/883 HDAS-8/883 HDAS-16/883 HDAS-16/883 DAC-02310-112 DAC-02311-112 DAC-02311-112 DAC-02310-112 DAC-02311-113 DAC-02310-113 DAC-02311-113 DAC-02310-113 ADC00300-112 ADC00302-112 ADC00300-112 ADC00302-112 HOS-050A/883B HOS-060SH/883B CT2565 CT2565 CT2565-FP CT2565-FP BUS-66301II-140 BUS-66300II-883B BUS-66300II-140 BUS-66301II-883B HS9342B HS9342B AD578SD/883B AD578SD/883B AD578TD/883B AD578TD/883B AD578ZSD/883B AD578ZSD/883B AD578ZTD/883B AD578ZTD/883B BUS61563IV-110 61563 BUS61553-110 BUS61553-140 (SEE DWG) BUS61563IV-140 BUS61553II-140
ESDS Product Class Type/Description
DATA ACQUISITION SYSTEM, 12-BIT, 16-CHANNEL SINGLEENDED INPUT DATA ACQUISITION SYSTEM, 12-BIT, 16-CHANNEL SINGLEENDED INPUT DATA ACQUISITION SYSTEM, 12-BIT, 16-CHANNEL SINGLEENDED INPUT DATA ACQUISITION SYSTEM, 12-BIT, 8-CHANNEL DIFFERENTIAL INPUT DATA ACQUISITION SYSTEM, 12-BIT, 8-CHANNEL DIFFERENTIAL INPUT DATA ACQUISITION SYSTEM, 12-BIT, 16-CHANNEL SINGLEENDED INPUT DATA ACQUISITION SYSTEM, 12-BIT, 16-CHANNEL SINGLEENDED INPUT CONVERTER, 14-BIT, DEGLITCHED, ±.012% CONVERTER, 14-BIT, DEGLITCHED, ±.012% CONVERTER, 14-BIT, DEGLITCHED, ±.012% CONVERTER, 14-BIT, DEGLITCHED, ±.012% CONVERTER, 14-BIT, DEGLITCHED, ±.006% CONVERTER, 14-BIT, DEGLITCHED, ±.006% CONVERTER, 14-BIT, DEGLITCHED, ±.006% CONVERTER, 14-BIT, DEGLITCHED, ±.006% CONVERTER, 12-BIT, TRACK/HOLD CONVERTER, 12-BIT, TRACK/HOLD CONVERTER, 12-BIT, TRACK/HOLD CONVERTER, 12-BIT, TRACK/HOLD AMP, FAST SETTLING VIDEO AMP, FAST SETTLING VIDEO CONTROLLER, DUAL REDUNDANT, CONTROLLER, DUAL REDUNDANT, CONTROLLER, DUAL REDUNDANT, CONTROLLER, DUAL REDUNDANT, INTERFACE UNIT, MICROPROCESSOR, MIL-STD1553 INTERFACE UNIT, MICROPROCESSOR, MIL-STD1553 INTERFACE UNIT, MICROPROCESSOR, MIL-STD1553 INTERFACE UNIT, MICROPROCESSOR, MIL-STD1553 CONVERTER, QUAD 12-BIT CONVERTER, QUAD 12-BIT CONVERTER, 12-BIT, HIGH-SPEED CONVERTER, 12-BIT, HIGH-SPEED CONVERTER, 12-BIT, HIGH-SPEED CONVERTER, 12-BIT, HIGH-SPEED CONVERTER, 12-BIT, HIGH-SPEED CONVERTER, 12-BIT, HIGH-SPEED CONVERTER, 12-BIT, HIGH-SPEED CONVERTER, 12-BIT, HIGH-SPEED MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT -51-
Approved Source
Sipex Sipex Source Datel Datel Datel Datel Analog Analog Aeroflex Aeroflex Aeroflex Aeroflex Sipex Sipex Analog Analog Analog Analog Analog Analog Analog Analog Source Source Ire.
CAGE Code
33256 33256
50721 50721 50721 50721 19645 19645 19645 19645 19645 19645 19645 19645 19645 19645 19645 19645 24355 24355 88379 88379 88379 88379 19645 19645 19645 19645 33256 33256 24355 24355 24355 24355 24355 24355 24355 24355 19645 19645 19645 19645 S7631
Defense Supply Center, Columbus Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Approved Source Master Product Listing Sorted Standard Microcircuit Drawing
Table
Standard Microcircuit Drawing
5962-8869201XC 5962-8869202ZA 5962-8869202YA 5962-8869202TC 5962-8869202XC 5962-8869202XA 5962-8869202TA 5962-8869202XC 5962-8869202XA 5962-8869203YA 5962-8869203ZC 5962-8869203ZA 5962-8869203XA 5962-8869203YC 5962-8869203XC 5962-8869204XC 5962-8869204XA 5962-8870101UC 5962-8870101YC 5962-8870101ZC 5962-8870101XC 5962-8870101YA 5962-8870101XA 5962-8870101UA 5962-8870102XA 5962-8876801YA 5962-8876801PC 5962-8876801YC 5962-8876801XA 5962-8876801PA 5962-8876802KYA 5962-8876802KPC 5962-8876802KPA 5962-8876802KYC 5962-8876802KXA 5962-8876901XA 5962-8876901YC 5962-8876901PA 5962-8876901YA 5962-8876901PC 5962-88769022A 5962-8876903FC 5962-8876904KXA QML-38534-29
Manufacturer Similar Part Number
BUS61553II-110 61564 (SEE DWG) BUS61564IV-110 BUS61554V-110 BUS61554V-140 BUS61564IV-140 BUS61554II-140 BUS61554II-110 BUS61565II-140 BUS61565II-604 BUS61565II-603 BUS61555II-140 BUS61565II-110 BUS61555II-110 BUS61556II-110 BUS61556II-140 MSK147B MSK146B MSK145B MSK541B OMA541SDB OMA541SKB OMA541SDZB OMA541SKCB HCPL-5201#100 HCPL-5201 HCPL-5201#100 HCPL-5201#300 HCPL-5201#200 HCPL-520K#100 HCPL-520K HCPL-520K#200 HCPL-520K#100 HCPL-520K#300 HCPL-5231#300 HCPL-5231#100 HCPL-5231#200 HCPL-5231#100 HCPL-5231 HCPL-6231 HCPL-6251 HCPL-523K#300
ESDS Product Class Type/Description
MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT, TRANSCEIVER MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT, TRANSCEIVER MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT, TRANSCEIVER MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT, TRANSCEIVER MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT, TRANSCEIVER MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT, TRANSCEIVER MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT, TRANSCEIVERLESS MULTIPLEXED TERMINAL, MIL-STD-1553, BC/RTU/MT, TRANSCEIVERLESS AMP, HIGH-POWER AMP, HIGH-POWER AMP, HIGH-POWER AMP, HIGH-POWER AMP, HIGH-POWER AMP, HIGH-POWER AMP, HIGH-POWER AMP, HIGH-POWER OPTOCOUPLER, SINGLE-CHANNEL OPTOCOUPLER, SINGLE-CHANNEL OPTOCOUPLER, SINGLE-CHANNEL OPTOCOUPLER, SINGLE-CHANNEL OPTOCOUPLER, SINGLE-CHANNEL OPTOCOUPLER, SINGLE-CHANNEL OPTOCOUPLER, SINGLE-CHANNEL OPTOCOUPLER, SINGLE-CHANNEL OPTOCOUPLER, SINGLE-CHANNEL OPTOCOUPLER, SINGLE-CHANNEL OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLT. GND. CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLT. GND. CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLT. GND. CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLT. GND. CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLT. GND. CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE SUPPLY VOLT. GND. CONNECTIONS OPTOCOUPLER, QUAD-CHANNEL, WITH COMMON SUPPLY VOLT. GND. CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLT. GND. CONNECTIONS -52-
Approved Source
Ire. Source Source Ire. Ire. Omnirel Omnirel Omnirel Omnirel
CAGE Code
S7631
3(4) 3(4)
19645 19645 19645 19645 S7631 S7631 19645 19645 19645 19645 19645 19645 19645 19645 51651 51651 51651 51651 69210 69210 69210 69210 50434 50434 50434 50434 50434 50434 50434 50434 50434 50434 50434 50434 50434 50434 50434 50434 50434 50434
Defense Supply Center, Columbus Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Approved Source Master Product Listing Sorted Standard Microcircuit Drawing
Table
Standard Microcircuit Drawing
5962-8876904KPA 5962-8876904KYC 5962-8876904KYA 5962-8876904KPC 5962-8876905K2A 5962-8876906KFC 5962-8877601XA 5962-8877601XC 5962-8944701HXA 5962-8944701HYA 5962-8944701HZA 5962-8944701HUA 5962-8944702HYC 5962-8944702HYA 5962-8944702HXA 5962-8944702HXC 5962-8944703HXA 5962-8944703HXC 5962-8944703HYA 5962-8944703HYC 5962-8944704HYC 5962-8944704HYA 5962-8944704HXC 5962-8944704HXA 5962-8944705HXA 5962-8944706HXA 5962-8944706HXC 5962-8944707HYA 5962-8944708HUA 5962-8944708HYA 5962-8944708HUC 5962-8944708HYC
Manufacturer Similar Part Number
HCPL-523K#200 HCPL-523K#100 HCPL-523K#100 HCPL-523K HCPL-623K HCPL-625K HS1068B HS1068B ARX3416 ARX3416 ARX3416 ARX3416 NHI-1501FP NHI-1501FP NHI-1501 NHI-1501 FC1553622 FC1553622 FC1553622FP FC1553622FP BUS63136II BUS63136II BUS63135II BUS63135II CT1487-DI 3416-511 3416-511 CT1487-DFI ACT4436-DI ACT4487-DFI ACT4436-DI ACT4487-DFI
ESDS Product Class Type/Description
3(4) 3(4) 3(4) 3(4) 3(4) 3(4) OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLT. GND. CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLT. GND. CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLT. GND. CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLT. GND. CONNECTIONS OPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE SUPPLY VOLT. GND. CONNECTIONS OPTOCOUPLER, QUAD-CHANNEL, WITH COMMON SUPPLY VOLT. GND. CONNECTIONS CONVERTER, 8-BIT FLASH CONVERTER, 8-BIT FLASH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH -53-
Approved Source
Sipex Sipex Source Source Source Source National Hyb. National Hyb. National Hyb. National Hyb. C-MAC C-MAC C-MAC C-MAC Source Aeroflex Aeroflex Source Aeroflex Aeroflex Aeroflex Aeroflex
CAGE Code
50434 50434 50434 50434 50434 50434 33256 33256
57363 57363 57363 57363 U4388 U4388 U4388 U4388 19645 19645 19645 19645
88379 88379
88379 88379 88379 88379
QML-38534-29
Defense Supply Center, Columbus Sourcing Qualification Unit, Hybrid Devices Team, DSCC-VQH Approved Source Master Product Listing Sorted Standard Microcircuit Drawing
Table
Standard Microcircuit Drawing
5962-8944708HXC 5962-8944708HZC 5962-8944708HZA 5962-8944708HXA 5962-8947701XA 5962-8947701YC 5962-8947701YA 5962-8947701PC 5962-8947701PA 5962-8947702KPA 5962-8947702KXA 5962-8947702KYC 5962-8947702KPC 5962-8947702KYA 5962-8949001XA 5962-8949002XA 5962-8949003XA 5962-8949004XA 5962-8949005XA 5962-8949006XA 5962-8949007XA 5962-8949008XA 5962-8949009XA 5962-8949801XA 5962-8949801YA 5962-8949801XC 5962-8949802XA 5962-8949802XC 5962-8949802YA 5962-8949803XC 5962-8949804XC 5962-8949805XA 5962-8949805YA 5962-8949805XC 5962-8949901XC 5962-8949901YC 5962-8949901YA 5962-8949901XA 5962-8949901XA
Manufacturer Similar Part Number
ACT4487-DI ACT4436-DFI ACT4436-DFI ACT4487-DI HCPL-5761#300 HCPL-5761#100 HCPL-5761#100 HCPL-5761 HCPL-5761#200 HCPL-576K#200 HCPL-576K#300 HCPL-576K#100 HCPL-576K HCPL-576K#100 OM7509SC/883B OM7501SC/883B OM7502SC/883B OM7503SC/883B OM7504SC/883B OM7505SC/883B OM7506SC/883B OM7507SC/883B OM7508SC/883B SDC-14561V-114 SDC14561 SDC-14561V-114 SDC-14561V-115 SDC-14561V-115 SDC14561 HSD1066-349H HSD1066-349V SDC-14562V-114 SDC14562 SDC-14562V-114 SDC14560-114 14560 14560 SDC14560-144 SDC14560-114
ESDS Product Class Type/Description
DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH DRIVER-RECEIVER, DUAL CHANNEL, RECEIVER IDLE NORMALLY HIGH OPTOCOUPLER, AC/DC LOGIC INTERFACE OPTOCOUPLER, AC/DC LOGIC INTERFACE OPTOCOUPLER, AC/DC LOGIC INTERFACE OPTOCOUPLER, AC/DC LOGIC INTERFACE OPTOCOUPLER, AC/DC LOGIC INTERFACE OPTOCOUPLER, AC/DC LOGIC INTERFACE OPTOCOUPLER, AC/DC LOGIC INTERFACE OPTOCOUPLER, AC/DC LOGIC INTERFACE OPTOCOUPLER, AC/DC LOGIC INTERFACE OPTOCOUPLER, AC/DC LOGIC INTERFACE VOLT. REGULATOR, FIXED, DUAL, +15V -15V OUTPUT VOLT. REGULATOR, FIXED, DUAL, OUTPUT VOLT. REGULATOR, FIXED, DUAL, -12V OUTPUT VOLT. REGULATOR, FIXED, DUAL, -15V OUTPUT VOLT. REGULATOR, FIXED, DUAL, +12V OUTPUT VOLT. REGULATOR, FIXED, DUAL, +12V -12V OUTPUT VOLT. REGULATOR, FIXED, DUAL, +12V -15V OUTPUT VOLT. REGULATOR, FIXED, DUAL, +15V OUTPUT VOLT. REGULATOR, FIXED, DUAL, +15V -12V OUTPUT SYNCHRO-TO-DIGITAL CONVERTER, MINUTES ACCURACY SYNCHRO-TO-DIGITAL CONVERTER, MINUTES ACCURACY SYNCHRO-TO-DIGITAL CONVERTER, MINUTES ACCURACY SYNCHRO-TO-DIGITAL CONVERTER, MINUTES ACCURACY SYNCHRO-TO-DIGITAL CONVERTER, MINUTES ACCURACY SYNCHRO-TO-
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