SHIELD 100MS epoxy encapsulated electromagnetic/ electrostatic in

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SHIELD 100MS epoxy encapsulated electromagnetic/ electrostatic in

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100MS
SHIELD
100MS epoxy encapsulated electromagnetic/ electrostatic interference (EMI) shield with circuits where sensitivity critical. designed attenuate converting electromagnetic field energy into heat that absorbed shield shunting electrostatic fields common. 100MS used applications either confine exclude EMI. cavity designed 28.45mm 28.45mm 7.24mm, 20-pin hybrid packages. shields cover base plate separate halves maintain electrical isolation between adjacent rows pins module encloses. Because spacing between shield halves epoxy flow holes, 100MS provides partial, adequate reluctance path electromagnetic flux. 100MS well suited with isolation modules such Burr-Brown 3656, 722, 724. over module tabs aligned into slots base plate. Bend four wide shield soldering tabs protruding from cover make contact with bare metal base plate. Solder these four tabs insure integrity their connection base plate. 100MS module contains mounted secured printed circuit board (PCB) soldering narrow solder tabs appropriate common. solder closest input side module should soldered input common. other should soldered output common. Figure illustrates assembly 100MS.
Cover
ASSEMBLY INSTRUCTIONS
Assemble base plate module pushing pins module through beveled holes base plate until base plate bottom module contact with each other. Place cover
Epoxy Encapsulant
Shield Solder Solder
Shield Solder
Module (reference only)
Half Cover Shield
Half Cover Shield
Base Plate Shield VISO Connection Input Common VISO Isolation Voltage Connection Output Common
Base Plate
FIGURE Cross-Sectional Side View 100MS.
International Airport Industrial Park Mailing Address: 11400 Tel: (520) 746-1111 Twx: 910-952-1111 Cable: BBRCORP
FIGURE Assembly Diagram.
Tucson, 85734 Street Address: 6730 Tucson Blvd. Tucson, 85706 Telex: 066-6491 FAX: (520) 889-1510 Immediate Product Info: (800) 548-6132
1979 Burr-Brown Corporation
PDS-421A
Printed U.S.A. October, 1993
SBFS013
SPECIFICATIONS
ELECTRICAL
Specifications apply between solder tabs. 100MS PARAMETER Isolation Voltage Rated Continuous, Rated Continuous, Test Capacitance Resistance Leakage Current CONDITIONS 3500 2000 8000 1010 0.23 UNITS Vrms
Seconds
120V, 60Hz
NOTE: Temperature changes (T/t) greater than minute below long term storage above 100°C recommended.
PACKAGE INFORMATION(1)
MODEL 100MS PACKAGE Shield PACKAGE DRAWING NUMBER
NOTE: detailed drawing dimension table, please data sheet, Appendix Burr-Brown Data Book.
APPLICATIONS INFORMATION
MULTIPLE DEVICE ORIENTATION typical application 100MS shown Figure Using multiple devices within 30mm each other cause them interact forming beat frequency interference outputs. 100MS reduce this interference much factor 200:1 depending distance between devices their relative orientation. Minimum results when gaps both shields paralleled Figure
3656 19.6k C(1) Power C(1) Supply Common VOUT1 100k
C(1) Thermocouple +VCC
100k
Shield
3656 19.6k
100MS
VOUT2
Power C(1) C(1) Supply Common
Shield
100MS
Optimum Layout.
C(1) Thermocouple NOTE: 0.47µF. +VCC
FIGURE Optimum Layout. Orientation minimum EMI.
FIGURE Isolated Data Acquisition Input Circuitry. Orientation Minimum EMI.
information provided herein believed reliable; however, BURR-BROWN assumes responsibility inaccuracies omissions. BURR-BROWN assumes responsibility this information, such information shall entirely user's risk. Prices specifications subject change without notice. patent rights licenses circuits described herein implied granted third party. BURR-BROWN does authorize warrant BURR-BROWN product life support devices and/or systems.
100MS
PACKAGE OPTION ADDENDUM
www.ti.com
9-Dec-2004
PACKAGING INFORMATION
Orderable Device 0100MS
Status ACTIVE
Package Type PDIP
Package Drawing
Pins Package Plan None
Lead/Ball Finish Call
Peak Temp Level-NA-NA-NA
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan currently available please check latest availability information additional product content details. None: available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Green (RoHS Sb/Br): defines "Green" mean "Pb-Free" addition, uses package materials that contain halogens, including bromine (Br) antimony (Sb) above 0.1% total product weight.
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDECindustry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
IMPORTANT NOTICE Texas Instruments Incorporated subsidiaries (TI) reserve right make corrections, modifications, enhancements, improvements, other changes products services time discontinue product service without notice. Customers should obtain latest relevant information before placing orders should verify that such information current complete. products sold subject TI's terms conditions sale supplied time order acknowledgment. warrants performance hardware products specifications applicable time sale accordance with TI's standard warranty. Testing other quality control techniques used extent deems necessary support this warranty. Except where mandated government requirements, testing parameters each product necessarily performed. assumes liability applications assistance customer product design. Customers responsible their products applications using components. minimize risks associated with customer products applications, customers should provide adequate design operating safeguards. does warrant represent that license, either express implied, granted under patent right, copyright, mask work right, other intellectual property right relating combination, machine, process which products services used. Information published regarding third-party products services does constitute license from such products services warranty endorsement thereof. such information require license from third party under patents other intellectual property third party, license from under patents other intellectual property Reproduction information data books data sheets permissible only reproduction without alteration accompanied associated warranties, conditions, limitations, notices. Reproduction this information with alteration unfair deceptive business practice. responsible liable such altered documentation. Resale products services with statements different from beyond parameters stated that product service voids express implied warranties associated product service unfair deceptive business practice. responsible liable such statements. Following URLs where obtain information other Texas Instruments products application solutions: Products Amplifiers Data Converters Interface Logic Power Mgmt Microcontrollers amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video Imaging Wireless Mailing Address: Texas Instruments Post Office 655303 Dallas, Texas 75265 Copyright 2004, Texas Instruments Incorporated www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless

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