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Operation Speed 2.5Gb/s, Built D-FF (Re-timing Bypass mode: Selectable
Top Searches for this datasheet2.5Gb/s GaAs Laser Driver with Re-Timing Function Operation Speed 2.5Gb/s, Built D-FF (Re-timing Bypass mode: Selectable) Peak Modulation Current with load: 70mA (Min.) Bias Current: 70mA (Min.) Peak Bias Current Adjustment Compatible Input Single -5.2V Power Supply Duty Ratio Adjustment Output Shutdown Switch FMM3175VI DESCRIPTION FMM3175VI 2.5Gb/s(OC-48) laser driver with re-timing function. D-FF built re-timing bypass mode selectable using selector(SEL) signal. peak modulation currents 70mA (Min.) with load, bias current available 70mA (Min.) FMM3175VI also duty control circuit output shutdown switch. ABSOLUTE MAXIMUM RATINGS (VDD 0V,Ta=25°C) Parameter Supply Voltage Input Voltage Power Supply Current Peak Current Control Voltage Bias Current Control Voltage Storage Temperature Symbol Tstg Ratings -7.0 -2.0 +1.5 -2.0 +2.1 Unit ELECTRICAL CHARACTERISTICS (Unless otherwise specified, Tc=25°C, VSS=-5.2V, RL=25) Parameter Maximum Data Rate Modulation Current Modulation Current when Shutdown Bias Current Bias Current when Shutdown Power Supply Current Rise Time Fall Time Duty Control Range Setup Time Hold Time Mark Density Monitor Output IPsd IBsd Duty Symbol Test Conditions -4.1V, -5.2V, VIP: Adjusted 70mA, VIB=-5.2V, HDI="H" -3.4V, -5.2V, -1.7V -3.4V, -5.2V, -0.9V -5.2V, -5.2V IP=70mA 2.5Gb/s, IP=70mA, SEL="H" SEL="H" (Re-timing mode) Min. Limit Typ. Max. Unit Gb/s Rmk=1k Mark Density Cmk=1nF -1.85 -1.0 -0.80 100% -0.98 -0.50 -0.40 Duty=100 -0.10 -0.0 Edition Febraury 2001 FMM3175VI RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Input Level High Input Level Peak Current Control Voltage Bias Current Control Voltage Duty Control Voltage Case Temperature Symbol Vdut 2.5Gb/s GaAs Laser Driver with Re-Timing Function Test Conditions Min. -5.46 -1.05 -2.00 -1.80 Limit Typ. Max. -5.20 -4.94 -0.90 -0.80 -1.70 -1.55 +1.1 +1.8 -0.80 Unit FMM3175VI Block Diagram Vdut IPMON IBMON Bias Current Driver HDIN Peak Current Driver IBOUT D-FF Buffer XOUT HCKI Mark Ratio Det. 2.5Gb/s GaAs Laser Driver with Re-Timing Function OPERATION MODE FMM3175VI "SEL" signal determines operation mode between re-timing bypass modes. truth table follows: Operation mode Re-timing (D-FF: active) Bypass(D-FF: bypassed) SHUTDOWN CONTROL Output Current Disable Enable FUNCTION (Re-timing mode) HDI(HDIN) H(L) L(H) Positive Edge, HCKI Negative Edge, Q/XQ: Hold Previous State XOUT FUNCTION (Bypass mode) HDI(HDIN) H(L) L(H) HCKI XOUT FMM3175VI 2.5Gb/s GaAs Laser Driver with Re-Timing Function Test Circuit VDUT HDIN HCKI IBMON IBOUT XOUT IPMON Pulse Pattern Generator Select Oscilloscope 20dB Shutdown Signal 0~1k Rmk: Cmk: 1000pF Other Capacitor: 0.068µF Vtt: Termination Voltage Output Duty Control Characteristics Duty -1.5 -1.4 -1.3 Vdut -1.2 -1.1 Peak Current Control Characteristics Peak Current IP(mA) -5.4 -5.2V -5.2V 25°C 85°C -5.0 -4.6 -4.2 -3.8 Peak Current Control Voltage VIP(V) 2.5Gb/s GaAs Laser Driver with Re-Timing Function FMM3175VI Assignment IBMON IPMON IBOUT XOUT FMM3175VI Description Name VDUT Description Bias Current Control Voltage Output Duty Control Voltage Data Input (True) Data Input (Invert) Clock Input Operation Mode Selection Output Current Shutdown Input Supply Voltage Name IPMON XOUT IBOUT IBMON Description Modulation Current Monitor (VSS:-5.2V) Modulation Current Control Voltage Modulation Current Output (Invert) Modulation Current Output (True) Bias Current Output Mark Density Monitor Output (Invert) Mark Density Monitor Output (True) Bias Current Monitor (VSS: -5.2V) View HDIN HCKI VDUT HDIN HCKI Ground Ground\ Heat Sink(Back Side) Ground Output Waveform V:1.0V/div. H:100ps/div. 2.5Gb/s -5.2V, 25°C Bias Current Bias Current Control Voltage Bias Current IB(mA) -5.4 -5.0 -4.6 -4.2 -3.8 -3.4 -3.0 -5.2V -5.2V 25°C 85°C Bias Current Control Voltage VIB(V) FMM3175VI "VI" PACKAGE 0.18 2.5Gb/s GaAs Laser Driver with Re-Timing Function Case Style "VI" UNIT: (0.45) (0.25) (0.9) Heat Sink 2.8) (3.1) (3.6) (3.9) (2.0) Ground (0.4) 0.65 4.55 0.15 0.13 (3.2) (3.3) Unit: further information please contact: FUJITSU COMPOUND SEMICONDUCTOR, INC. Americas R.O.W. 2355 Zanker Jose, 95131-1138, U.S.A. Phone: (408) 232-9500 FAX: (408) 428-9111 CAUTION Fujitsu Compound Semiconductor Products contain gallium arsenide (GaAs) which hazardous human body environment. safety, observe following procedures: www.fcsi.fujitsu.com this product into mouth. FUJITSU QUANTUM DEVICES EUROPE LTD. Network House Norreys Drive Maidenhead, Berkshire United Kingdom TEL: 1628 504800 FAX: 1628 504888 alter form this product into gas, powder, liquid through burning, crushing, chemical processing these by-products dangerous human body inhaled, ingested, swallowed. Observe government laws company regulations when discarding this product. This product must discarded accordance with methods specified applicable hazardous waste procedures. FUJITSU QUANTUM DEVICES SINGAPORE LTD. Hong Kong Branch 1101, Ocean Centre, Canton Tsim Tsui, Kowloon, Hong Kong TEL: +852-23770226 FAX: +852-23763269 FUJITSU QUANTUM DEVICES LIMITED Business Development Division 11th Floor, Hachioji Daiichi-Seimei Bldg. 3-20-6 Myojin-cho Hachioji-city, Tokyo 192-0046, Japan TEL: +81-426-43-5885 FAX: +81-426-43-5582 Fujitsu Limited reserves right change products specifications without notice. information does convey license under rights Fujitsu Limited others. 2001 FUJITSU COMPOUND SEMICONDUCTOR, INC. Printed U.S.A. 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