Filter INTRODUCTION Used filtering specific frequency, filte

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Filter INTRODUCTION Used filtering specific frequency, filte

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INTRODUCTION
Used filtering specific frequency, filter divided into three classes(low pass filter, band pass filter, high pass filter). Now, produce pass band pass filters Busan factory. filter fabricated with high permittivity multi-layer ceramic, conductors embedded ceramic silver. small size high performance filter with insertion loss passband together with good out-of-passband characteristics. applicable codeless phones, wireless Bluetooth applications.
FEATURE APPLICATION
Feature Extremely ultra-small(453232252520) Internal shielding incorporated Excellent spurious characteristics Relatively easy control attenuation poles High allowable input power(500mW) Application Suitable variety application frequency range US-PCS, DCS1800, W-Lan,Bluetooth, etc.
Filter
STRUCTURE
Filter
APPEARANCE DIMENSION
TYPE (Colored Bar)
CODE
DIMENSION
0.95
0.15
0.15
0.45 0.85 0.25+/-0.15 1.35+/-0.2 +0.1/-0.2
0.45 0.45
0.15 1.6+/- 0.15 1.6+/- 0.15 0.15
0.15 0.25 0.15 0.25 0.15 +0.1/-0.15 0.15 +0.1/-0.15
0.15 1.25
TYPE
DIMENSION CODE
2.00±0.15
1.25±0.1
0.95±0.10 1.6+0.1/-0.15 0.20±0.15 0.3+0.1/-0.15 0.3+0.1/-0.2 0.3+0.1/-0.2
Filter
TYPE
Directional Input Mark
DIMENSION CODE
2.00 ±0.15
1.25 ±0.1
0.95 ±0.10
0.25 ±0.20
0.25 ±0.20
0.30 ±0.20
0.20 ±0.20
0.30 ±0.20
0.35 ±0.20
0.65 ±0.20
PART TYPE Divided reference dimension
PART LCB23B1890C1 LCL21F2450B1 LCB22K5787A1 LCB22K5487B1 LCB21M5487A1 LCB22K5250A1 LCB21M4884A1 LCB21B2450Q1 LCB22B2450L1 LCB31B2450D1 LCB22B2450B1 LCB32B2450A2 TYPE
Filter
PART NUMBERING
2450
Abbreviation Filter Type Filter Dimension Material Center Frequency Serial Design Order
TYPE FILTER CODE DESCRIPTION CODE Band Pass Filter High Pass Filter Pass Filter Band Reject Filter
DIMENSION CODE DIMENSION
MATERIAL CODE DESCRIPTION CODE Material Filter Material Filter Ferrite Material Filter
Filter
CENTER FREQUENCY CODE 2450 1890 DESCRIPTION CODE 2450 1890
SERIAL CODE DESCRIPTION CODE
A,B,C,.Q.
single capital letter expresses series name individual specification.
DESIGN ORDER CODE DESCRIPTION CODE
1,2,3,.
figure expresses identification series design type.
Filter
PACKAGING
EMBOSSED PLASTIC TAPE
2.0±0.05 1.75±0.1 4.0±0.1
+0.1
TYPE
QUANTITY
TYPE THICKNESS BODY[MM] 0.95 STANDARD QUANTITY[PCS] 3000 3000
8.0±0.3
TAPE Material EMBOSSED TAPE
3.5±0.05
Embossed
unit 1.45±0.1 2.3±0.1 1.15±0.1 (Chip thickness) 0.95±0.1
Filter
REEL DIMENSION
unit 178±2 60±5.0 13±0.5 21±0.8 2±0.5 10.0±1.5 0.8±0.2
Filter
RELIABILITY TEST DATA
ITEM
Operating Temperature Range Storage Temperature Range
CONDITION
SPECIFICATION
Thermal Shock (Temperature Cycle Test)
Repeat cycles under following conditions. min. (Dwell time min)
Satisfy Electrical Characteristics.
Humidity Resistance Test
Precondition hour. stand temperature +70±3, 9095% relative humidity hours. Finally allow room ambient hours before taking final measurements. Solder sample PCB. Exposure 125±3 hours. hours exposure room temperature humidity, prior measurement.
Satisfy Electrical Characteristics.
High Temperature Test
Satisfy Electrical Characteristics.
Temperature Test
Solder sample PCB. Exposure hours. hours exposure room temperature humidity, prior measurement.
Satisfy Electrical Characteristics.
Temperature Characteristics
Solder sample PCB. Exposure Each Temperature -40, -20, Satisfy Electrical Characteristics. minutes.
Solderability
After preheated second termination being dipped flux sufficiently, specimen shall soldered evenly immersed solder seconds. continuously.
Resistance Soldering Heat (Dipping)
Immerse chip eutectic solder solution 5±0.5s (flow soldering batch) after Satisfy Electrical Characteristics. preheating second 150. Then apparent damage. room temperature measure.
Resistance Soldering Heat (Reflow)
Preheat Temperature 150±10 Preheat Period 60sec. MIN. Peak Temperature 230±5 Satisfy Electrical Characteristics. Peak Temp. Period sec. apparent damage. Specimens soldered twice with above condition. then kept room condition hours before measurements.
Filter
ITEM CONDITION
Solder specimens onto test shown below. Apply pushing force 0.5mm/Sec until electrode pads pealed ceramic broken.
SPECIFICATION
Board Adhesion (Push strength)
Specimen Pushing Direction In-Out
9.8N Minimum
Mechanical Shock.
Subject samples three one-half sine shock pulse (3000 milliseconds) each direction (for total) along each three mutually perpendicular axes total shocks. Solder sample PCB. Vibrate apply 20~2000Hz, acceleration, 1.5mm amplitude hours each three (X,Y,Z) axis (total hours).
Satisfy Electrical Characteristics. apparent damage.
Vibration Test
Satisfy Electrical Characteristics. apparent damage.
Drop Test
Solder sample PCB. Drop sample from height concrete ground times.
Satisfy Electrical Characteristics. apparent damage.
Appearance
failure cause problems actual application.
Filter
APPLICATION MANUAL
STAGE
Circuit Design
PRECAUTION
Verification operating environment, electrical rating Performance malfunction medical equipment, spacecraft, nuclear reactors, etc. cause serious harm human life have severe social ramifications. such, inductors used such equipment require higher safety and/or reliability considerations should clearly differentiated from components used general purpose applications.
TECHNICAL CONSIDERATION
Design
Pattern configurations (Design Land-patterns) When LC-filters mounted PCB, amount solder used (size fillet) directly affect LC-filters performance. Therefore, following items must carefully considered design solder land patterns: (1)The amount solder applied affect ability chips withstand mechanical stresses which lead breaking cracking. Therefore, when designing land-patterns necessary consider appropriate size configuration solder pads which turn determines amount solder necessary form fillets. (2)When more than part jointly soldered onto same land pad, must designed that each component's soldering point separated solder-resist.
Excess solder affect ability chips withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns. Examples good solder application
recommended
Mixed mounting leaded components Component placement close chassis HandSoldering leaded components near mounted components
lead wire component
Recommended
Solder-resist
Chassis Solder (for grounding)
Solder-resist
lead wire component
Soldering iron
Solder-resist
Filter
STAGE
Soldering
PRECAUTION
Selection Flux Since flux have significant effect performance LC-filters, necessary verify following conditions prior use; (1)Flux used should with less than equal 0.1wt%(Chlorine conversion method) halogenated content. Flux having strong acidity content should applied. (2)When soldering LC-filters board, amount flux applied should controlled optimum level. (3)When using water-soluble flux, special care should taken properly clean boards.
TECHNICAL CONSIDERATION
1-1. When much halogenated substance (Chlorine, etc.) content used activate flux, highly acidic flux used, excessive amount residue after soldering lead corrosion terminal electrodes degradation insulation resistance surface LC-filter. 1-2. Flux used increase solderability flow soldering, much applied, large amount flux emitted detrimentally affect solderability. minimize amount flux applied, recommended flux-bubbling system. 1-3. Since residue water-soluble flux easily dissolved water content air, residue surface LC-filter high humidity conditions cause degradation insulation resistance therefore affect reliability components. Cleaning methods capability machines used should also considered carefully when selecting water soluble flux. 1-1. Preheating when soldering Heating Chip LC-filter components should preheated within soldering. Cooling temperature difference between components cleaning process should greater than 100. Chip LC-filters susceptible thermal shock when exposed rapid concentrated heating rapid cooling. Therefore, soldering process must conducted with great care prevent malfunction components excessive thermal shock. Recommended conditions soldering [Reflow soldering] Temperature Profile
Temperature(
Soldering Temperature, time, amount solder, etc. specified accordance with following recommended conditions.
Preheating
Over 1min.
Over 1min.
Gradual cooling
Within sec.
TIME(sec.)
Filter
STAGE
Soldering
PRECAUTION
TECHNICAL CONSIDERATION
Caution ideal condition have solder mass (fillet) controlled thickness LC-filter, shown below:
1/2T1/3T
LC-filter Solder
board
Because excessive dwell times detrimentally affect solderability, soldering duration should kept close recommended times possible. Cleaning Cleaning conditions When cleaning board after LC-filters mounted, select appropriate cleaning solution according type flux used purpose cleaning(e.g. remove soldering flux other materials from production process.) Cleaning conditions should determined after verifying, through test run, that cleaning process does affect LC-filter's characteristics. inappropriate solutions cause foreign substances such flux residue adhere LC-filter, resulting degradation LC-filter's electrical properties (especially insulation resistance). Inappropriate cleaning conditions (insufficient excessive cleaning) detrimentally affect performance LC-filters. (1)Excessive cleaning case ultrasonic cleaning, much power output cause excessive vibration board which lead cracking LC-filter soldered portion, decrease terminal electrodes' strength. Thus following conditions should carefully checked; Ultrasonic output Below Ultrasonic frequency Below Ultrasonic washing period min. less
Post cleaning processes
Application resin coatings, molding, etc. components. With some type resins decomposition chemical reaction vapor remain inside resin during hardening period while left under normal storage conditions resulting deterioration LC-filter's performance. When resin's hardening temperature higher than LC-filter's operating temperature, stresses generated excess heat lead LC-filter damage destruction. Stress caused resin's temperature generated expansion contraction damage LC-filters such resins, molding materials etc. recommended.
Filter
STAGE
Storage conditions Storage
PRECAUTION
TECHNICAL CONSIDERATION
parts stocked high temperature humidity environment, problems such reduced solderability caused oxidation terminal electrodes deterioration taping/packaging materials take place. this reason, components should used within months from time delivery. exceeding above period, please check solderability before using LC-filters
maintain solderability terminal electrodes keep packaging material good condition, care must taken control temperature humidity storage area. Humidity should especially kept possible. Recommended conditions Ambient temperature Below Humidity Below ambient temperature must kept below Even under ideal storage conditions LC-filter electrode solderability decreases time passes, LC-filters should used within months from time delivery. packaging material should kept where chlorine sulfur exists air.
Filter
NOTICE
REPORT BEFORE CHANGE
required change specifications, materials manufacturing methods this specified filters, shall inform written statement with quality reliability data before changes occur.
PACKAGING
Package includes label with below item outgoing inspection data customer's request. Part No.& Quantity Name logo manufacturer
RESTRICTION ENVIRONMENTAL DESTRUCTIVE MATERIAL
filters specified this specification under stated materials. chemical composite, asbestos. PBBS PBBOs PBDO PBDE
USAGE MATERIALS DESTRUCTIVE OZONOSPHERE
filters specified this specification under stated materials manufacturing stages. Freon Haron 1-1-1 HCFC

Filter INTRODUCTION Used filtering specific frequency, filte

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