2-35 GaAs MMIC Traveling Wave Amplifier Chip Size: Chip Size Tole

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2-35 GaAs MMIC Traveling Wave Amplifier Chip Size: Chip Size Tole

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AMMC-5026
2-35 GaAs MMIC Traveling Wave Amplifier
Chip Size: Chip Size Tolerance: Chip Thickness: Dimensions:
3050 (119 mils) (±0.4 mils) mils) (2.9 mils)
Description AMMC-5026 broadband PHEMT GaAs MMIC Traveling Wave Amplifier (TWA) designed medium output power high gain over full frequency range. design employs 6-section cascode connected structure provide flat gain medium power well uniform group delay. improved reliability moisture protection, passivated active areas.
Features Frequency range: Gain: 10.5 Gain flatness: ±0.8 Return loss: Input Output: Output power (P-1dB): Noise figure (6-19 GHz): Applications Broadband gain block Broadband driver amplifier Gb/s Fiber Optics
Absolute Maximum Ratings
Symbol
Tstg Tmax
Parameters/Conditions
Positive Drain Voltage Total Drain Current First Gate Voltage First Gate Current Second Gate Voltage Second Gate Current Input Power Channel Temperature Operating Backside Temperature Storage Temperature Max. Assembly Temp max)
Units
Min.
Max.
+150 +165 +300 +3.5
Notes: Operation excess these conditions result permanent damage this device.
AMMC-5026 Specifications/Physical Properties[1]
Symbol
Idss Idsoff (Vg1) ch-b
Parameters Test Conditions
Saturated Drain Current (Vdd =open circuit) First Gate Pinch-off Voltage (Vdd =0.1 Idss, =open circuit) Second Gate Self-bias Voltage (Vdd =150 =open circuit) First Gate Pinch-off Current (Vdd=7 Vg1=3.5 Vg2=open circuit) Thermal Resistance[2] (Backside temperature, 25°C)
Units
°C/W
Min.
Typ.
-1.2
Max.
Notes: Backside temperature 25°C unless otherwise noted. Channel-to-backside Thermal Resistance (ch-b) 38°C/W Tchannel (Tc) 150°C measured using liquid crystal method. Thermal Resistance backside temperature (Tb) 25°C calculated from measured data.
Specifications[3,4] (Vdd Symbol
|S21|
Parameters Test Conditions
Small-signal Gain Small-signal Gain Flatness Input Return Loss Output Return Loss
Units
Min.
Typ.
10.5 ±0.75
Max.
12.5 ±1.5
|S21| RLin RLout |S12| P-1dB Psat OIP3
-17.5
Isolation Output Power Gain Compression Saturated Output Power Output Order Intercept Point, RFin1 RFin2 dBm, GHz, Noise Figure Second Harmonic (Pin GHz) Third Harmonic (Pin GHz)
Notes: Data measured wafer form, Tchuck 25°C. 100% wafer test done frequency 26.5, GHz, except noted.
AMMC-5026 Typical Performance (Tchuck 25°C, Open,
RETURN LOSS (dB)
FREQUENCY (GHz) FREQUENCY (GHz)
S11(dB) S22(dB)
P1dB, P3dB (dBm)
P1dB P3dB
GAIN (dB)
FREQUENCY (GHz)
Figure Gain.
Figure Input Output Return Loss.
Figure Output Power P1dB P3dB.
NOISE FIGURE (dB)
(pS)
(dBm)
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Group Delay.
Figure Noise Figure.
Figure Output Order Intercept Point.
AMMC-5026 Typical Performance (Tchuck 25°C, Open,
S11(dB) S22(dB)
P1dB P3dB
RETURN LOSS (dB)
P1dB, P3dB (dBm)
GAIN (dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Gain.
Figure Input Output Return Loss.
Figure Output Power P1dB P3dB.
NOISE FIGURE (dB)
(pS)
OIP3 (dBm)
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Group Delay.
Figure Noise Figure.
Figure Output Order Intercept Point.
25°C -40°C 85°C
(dB)
(dB)
S21(dB) 25°C S21(dB) -40°C S21(dB) 80°C
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Gain Temperature.
Figure Noise Figure Temperature.
AMMC-5026 Typical Scattering Parameters[1] (Tchuck 25°C,
Freq.
10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 19.0 20.0 21.0 22.0 23.0 24.0 25.0 26.0 27.0 28.0 29.0 30.0 31.0 32.0 33.0 34.0 35.0 36.0 37.0 38.0 39.0 40.0
-24.93 -26.84 -25.16 -23.72 -22.99 -22.58 -21.97 -21.29 -20.67 -20.29 -20.47 -21.49 -23.65 -28.02 -39.49 -31.18 -24.21 -20.93 -18.20 -17.48 -17.43 -17.77 -18.27 -18.66 -18.56 -18.60 -19.07 -19.79 -18.63 -15.62 -13.40 -12.69 -14.73 -26.00 -14.82 -10.01 -9.81 -6.40 -4.23
0.06 0.05 0.06 0.07 0.07 0.07 0.08 0.09 0.09 0.10 0.09 0.08 0.07 0.04 0.01 0.03 0.06 0.09 0.12 0.13 0.13 0.13 0.12 0.12 0.12 0.12 0.11 0.10 0.12 0.17 0.21 0.23 0.18 0.05 0.18 0.32 0.32 0.48 0.61
-131 -119 -161 -116 -161 -157
9.89 9.50 9.14 8.90 8.81 8.87 9.04 9.24 9.42 9.53 9.56 9.52 9.46 9.40 9.36 9.41 9.52 9.68 9.79 9.94 10.02 10.07 10.06 10.04 10.08 10.20 10.46 10.75 10.99 11.07 10.93 10.79 10.78 10.83 10.24 8.79 6.12 -0.65 -7.76
3.12 2.98 2.87 2.79 2.76 2.78 2.83 2.90 2.96 2.99 3.01 2.99 2.97 2.95 2.94 2.95 2.99 3.05 3.09 3.14 3.17 3.19 3.18 3.18 3.19 3.24 3.33 3.45 3.54 3.58 3.52 3.46 3.46 3.48 3.25 2.75 2.02 0.93 0.41
-117 -137 -157 -177 -127 -158 -109
-52.04 -48.40 -45.19 -43.10 -41.31 -40.00 -38.94 -38.13 -37.33 -36.65 -36.03 -35.34 -34.61 -33.89 -32.96 -32.22 -31.57 -30.96 -30.60 -30.17 -29.90 -29.74 -29.50 -29.24 -28.85 -28.34 -27.70 -27.23 -26.80 -26.67 -26.82 -26.97 -26.96 -26.76 -27.23 -28.38 -30.66 -36.71 -42.85
0.0025 0.0038 0.0055 0.0070 0.0086 0.0100 0.0113 0.0124 0.0136 0.0147 0.0158 0.0171 0.0186 0.0202 0.0225 0.0245 0.0264 0.0283 0.0295 0.0310 0.0320 0.0326 0.0335 0.0345 0.0361 0.0383 0.0412 0.0435 0.0457 0.0464 0.0456 0.0448 0.0449 0.0459 0.0435 0.0381 0.0293 0.0146 0.0072
-109 -131 -154 -174 -104 -125 -147 -168 -125 -169
-17.16 -15.78 -14.87 -14.55 -14.82 -15.68 -17.22 -19.41 -21.84 -22.43 -20.48 -18.32 -16.78 -15.83 -15.57 -15.93 -16.86 -18.63 -21.67 -27.56 -32.88 -24.55 -19.79 -17.19 -15.72 -15.10 -15.28 -16.61 -19.73 -24.26 -21.06 -17.40 -15.99 -17.25 -18.78 -16.58 -18.73 -13.68 -10.52
0.14 0.16 0.18 0.19 0.18 0.16 0.14 0.11 0.08 0.08 0.09 0.12 0.14 0.16 0.17 0.16 0.14 0.12 0.08 0.04 0.02 0.06 0.10 0.14 0.16 0.18 0.17 0.15 0.10 0.06 0.09 0.13 0.16 0.14 0.12 0.15 0.12 0.21 0.30
-126 -154 -110 -145 -172
Note: Data obtained from on-wafer measurements.
AMMC-5026 Typical Scattering Parameters[1] (Tchuck 25°C,
Freq.
10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 19.0 20.0 21.0 22.0 23.0 24.0 25.0 26.0 27.0 28.0 29.0 30.0 31.0 32.0 33.0 34.0 35.0 36.0 37.0 38.0 39.0 40.0
-24.88 -26.86 -25.30 -23.94 -23.17 -22.72 -22.09 -21.42 -20.79 -20.42 -20.68 -21.76 -24.04 -28.68 -40.72 -30.52 -24.07 -21.00 -18.37 -17.78 -17.89 -18.34 -18.89 -19.20 -19.05 -19.12 -19.87 -20.78 -19.42 -16.18 -13.92 -13.31 -15.52 -23.72 -14.68 -10.47 -9.72 -6.77 -4.70
0.06 0.05 0.05 0.06 0.07 0.07 0.08 0.08 0.09 0.10 0.09 0.08 0.06 0.04 0.01 0.03 0.06 0.09 0.12 0.13 0.13 0.12 0.11 0.11 0.11 0.11 0.10 0.09 0.11 0.16 0.20 0.22 0.17 0.07 0.18 0.30 0.33 0.46 0.58
-151 -123 -166 -123 -166 -169
9.59 9.20 8.85 8.59 8.49 8.54 8.70 8.89 9.07 9.17 9.20 9.15 9.08 9.01 8.97 9.00 9.11 9.26 9.35 9.49 9.57 9.60 9.57 9.53 9.55 9.65 9.88 10.14 10.33 10.37 10.21 10.03 9.95 9.82 9.06 7.43 4.27 -2.02 -8.14
3.02 2.88 2.77 2.69 2.66 2.67 2.72 2.78 2.84 2.87 2.88 2.87 2.84 2.82 2.81 2.82 2.85 2.90 2.93 2.98 3.01 3.02 3.01 3.00 3.00 3.04 3.12 3.21 3.29 3.30 3.24 3.17 3.14 3.10 2.84 2.35 1.64 0.79 0.39
-119 -139 -159 -180 -103 -133 -164 -108
-51.70 -47.74 -45.04 -42.85 -41.11 -39.74 -38.56 -37.72 -37.02 -36.31 -35.60 -34.94 -34.20 -33.47 -32.62 -31.87 -31.28 -30.66 -30.26 -29.87 -29.53 -29.42 -29.17 -28.95 -28.57 -28.09 -27.47 -27.05 -26.69 -26.60 -26.76 -26.92 -26.97 -27.01 -27.64 -29.02 -31.77 -37.46 -42.97
0.0026 0.0041 0.0056 0.0072 0.0088 0.0103 0.0118 0.0130 0.0141 0.0153 0.0166 0.0179 0.0195 0.0212 0.0234 0.0255 0.0273 0.0293 0.0307 0.0321 0.0334 0.0338 0.0348 0.0357 0.0373 0.0394 0.0423 0.0444 0.0463 0.0468 0.0459 0.0451 0.0448 0.0446 0.0415 0.0354 0.0258 0.0134 0.0071
-109 -131 -153 -175 -103 -124 -146 -168 -124 -167
-17.27 -15.97 -15.10 -14.79 -15.05 -15.89 -17.37 -19.46 -21.68 -22.16 -20.38 -18.33 -16.84 -15.91 -15.67 -16.02 -16.95 -18.70 -21.76 -27.81 -34.56 -24.90 -19.97 -17.32 -15.83 -15.23 -15.44 -16.82 -20.01 -24.45 -21.24 -17.71 -16.44 -17.71 -18.68 -16.97 -18.00 -13.26 -10.51
0.14 0.16 0.18 0.18 0.18 0.16 0.14 0.11 0.08 0.08 0.10 0.12 0.14 0.16 0.16 0.16 0.14 0.12 0.08 0.04 0.02 0.06 0.10 0.14 0.16 0.17 0.17 0.14 0.10 0.06 0.09 0.13 0.15 0.13 0.12 0.14 0.13 0.22 0.30
-123 -152 -179 -108 -143 -171
Note: Data obtained from on-wafer measurements.
Biasing Operation AMMC-5026 biased with single positive drain supply (Vd) negative gate supply (Vg1). recommended bias conditions HMMC-5026 best overall performance. Open circuit default setting biasing. Figure shows typical bonding configuration operations. this case, auxiliary drain capacitors (>0.5 used frequency (below GHz) performance. Input output ports coupled; therefore, decoupling capacitors required there paths. auxiliary gate drain contacts used frequency performance extension below GHz. When used, these contacts must coupled only. attempt apply bias these pads.) Ground connections made with plated through-holes backside device.
Assembly Techniques chip should attached directly ground plane using either fluxless AuSn solder preform electrically conductive epoxy[1]. conductive epoxy, amount should just enough provide thin fillet around bottom perimeter die. ground plane should free residue that jeopardize electrical mechanical attachment. Caution should taken exceed Absolute Maximum Rating assembly temperature time. Thermosonic wedge bonding preferred method wire attachment bond pads. connections should kept short possible minimize inductance. Gold mesh[2] double-bonding with gold wire recommended. Mesh attached using round tracking tool tool force approximately grams with ultrasonic power roughly duration guided wedge ultrasonic power
level used wire. recommended wire bond stage temperature chip thick should handled with care. This MMIC exposed bridges surface. Handle edges with custom collet pick with vacuum center.) This MMIC also static sensitive handling precautions should taken. more information, Avago Application Note "GaAs MMIC ESD, Attach Bonding Guidelines." Notes: Ablebond 84-1 silver epoxy recommended. Buckbee-Mears Corporation, Paul, 800-262-3824.
Output
Input
Figure AMMC-5026 Schematic.
Output Pad) (Vd) (±10 (Aux
2964
(Aux Vg2)
Input Pad) 3050
2323 (Vg1)
2563 (Aux Vg1)
2951
Figure AMMC-5026 Bonding Locations. (dimensions micrometers)
dia.Gold Wire Bond Feedthru Capacitor Inductor (1.0 Gold Wire Bond with length mils) Gold Plated Shim nom.
HMMC-5026
Notes: dimensions microns. Rectangular Dim:
Input Output Thin Film Circuit with Blocking Capacitor
nom. dia. Gold Bond Wire (Length important)
Bonding Island
dia.Gold Wire Bond Feedthru
Figure AMMC-5026 Assembly Diagram.
Ordering Information AMMC-5026-W10 devices tray AMMC-5026-W50 devices tray
product information complete list distributors, please site:
www.avagotech.com
Avago, Avago Technologies, logo trademarks Avago Technologies, Limited United States other countries. Data subject change. Copyright 2006 Avago Technologies, Limited. rights reserved. Obsoletes 5989-3212EN 5989-3929EN September 2006

2-35 GaAs MMIC Traveling Wave Amplifier Chip Size: Chip Size Tole

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