The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.    


Datasheet Search Engine   
 
Part # or Description: • 5V RS232 Driver • 2SC5066* • "Real Time Clock" • "USB connector" • "blue led" 5mm • 10 watt zener diode • 2N3055* motorola
 
Search Tip: Try entering the part number only. Include a wildcard (eg. lm317* or 1n4148*)

 

 

SPDT Switch Description Avago's AMMC-2008 monolithic PHEMT SPDT s


Datasheet Thumbnail

   

Download PDF

Top Searches for this datasheet



AMMC-2008
SPDT Switch
Description Avago's AMMC-2008 monolithic PHEMT SPDT switch with insertion loss high isolation from GHz. This MMIC designed generalpurpose applications. improved reliability moisture protection, passivated active areas. series shunt PHEMTs throw provide insertion loss isolation GHz. Features Wide frequency range: Single pole double throw switch insertion loss: (max.) High isolation: (min.) Medium input power: P-1dB: Applications Instrumentation Communications Radar Fiber optics Pulse modulation Port isolation Transfer switching High speed switching Replacement mechanical switches
Chip Size: Chip Size Tolerance: Chip Thickness: Dimensions:
(36.6 24.8 mils) (±0.4 mils) mils) (3.2 mils)
Absolute Maximum Ratings
Symbol
Vsel Tstg Tmax
Parameters/Conditions
Select Voltages Input Power Backside Temperature Storage Temperature Max. Assembly Temp max)
Units
Min.
Max.
+1.4 +140
+165 +300
Note: Operation excess these conditions result permanent damage this device.
AMMC-2008 Specifications[1]
Symbol
Isel1 Isel1 Isel2 Isel2
Parameters Test Conditions
Leakage Current Vsel1 Vsel2 Leakage Current Vsel1 Vsel2 Leakage Current Vsel2 Vsel1 Leakage Current Vsel2 Vsel1
Units
Min.
Typ.
Max.
Note: Backside temperature 25°C unless otherwise noted.
Specifications[1,2] Vsel1 -3V, Vsel2
Symbol
Parameters Test Conditions
Insertion Loss, RFin RFout throw)
Freq.
Units
Min.
Typ.
Max.
Isolation, RFin RFout (OFF throw)
16.5 16.5
RLin RLout-on RLout-off P-1dB
Input Return Loss Output Return Loss throw) Output Return Loss (OFF throw) Input Power Gain Compression Harmonic, Pout Harmonic, Pout Input Order Intercept Point, RFin1=RFin2 dBm, Control Switching Speed[3] rise time fall time
Notes: Data measured wafer form, Tchuck= 25°C. 100% on-wafer test done frequency GHz, except noted. Typical Vsel switching speed measured using Pulse Generator Model PG5000A. Measurement limited rise/fall time Pulse Generator.
AMMC-2008 Typical Performance 25°C, Vsel1 -3V, Vsel2
RETURN LOSS (dB)
S11(dB) S22(dB)
(dB) (dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure Insertion Loss.
Figure Isolation.
Figure Return Loss.
(dBm) (dBm)
(dBm) (dBm) (dBm)
-100
(dBm) (dBm) (dBm)
GAIN COMPRESSION (dB)
(dBm)
-100
(dBm)
(dBm)
Figure Gain Compression Input Power.
Figure Harmonics Input Power fo=2 GHz.
Figure Harmonics Input Power fo=12 GHz.
INTERMOD PRODUCTS (dBm) INTERMOD PRODUCTS (dBm)
-100
(dBm) (dBm) (dBm)
(dBm) (dBm) (dBm)
-100
(dBm)
(dBm)
Figure Intermodulation Products GHz.
Figure Intermodulation Products f=12 GHz.
AMMC-2008 Typical Scattering Parameters (Tchuck 25°C, Vsel1 Vsel2 Out1: (terminated 50-ohms), Out2:
Freq.
-16.23 -16.65 -16.83 -17.01 -17.23 -17.38 -17.47 -17.66 -17.96 -18.17 -18.41 -18.84 -18.72 -19.23 -19.04 -19.14 -19.49 -19.62 -19.95 -20.35 -20.25 -20.49 -20.88 -21.54 -21.60 -21.64 -21.32 -21.58 -22.10 -22.02 -22.09 -21.66 -21.85 -22.36 -21.91 -21.19 -20.74 -20.81 -20.63 -19.95 -19.16 -19.26 -19.29 -19.00 -18.09 -17.09 -17.08 -16.94 -16.32 -15.74
0.154 0.147 0.144 0.141 0.138 0.135 0.134 0.131 0.127 0.123 0.120 0.114 0.116 0.109 0.112 0.110 0.106 0.105 0.101 0.096 0.097 0.095 0.090 0.084 0.083 0.083 0.086 0.083 0.079 0.079 0.079 0.083 0.081 0.076 0.080 0.087 0.092 0.091 0.093 0.101 0.110 0.109 0.108 0.112 0.125 0.140 0.140 0.142 0.153 0.163
Phase
-100 -108 -113 -120 -127 -131 -139 -146 -156 -162 -168 -174
-1.66 -1.71 -1.73 -1.74 -1.74 -1.72 -1.69 -1.66 -1.62 -1.59 -1.60 -1.66 -1.57 -1.59 -1.50 -1.46 -1.50 -1.56 -1.56 -1.48 -1.47 -1.49 -1.51 -1.57 -1.57 -1.55 -1.59 -1.55 -1.58 -1.58 -1.63 -1.75 -1.64 -1.58 -1.60 -1.66 -1.67 -1.67 -1.69 -1.69 -1.75 -1.67 -1.63 -1.58 -1.97 -2.01 -1.81 -1.62 -1.71 -1.81
0.826 0.821 0.820 0.819 0.818 0.821 0.823 0.826 0.830 0.833 0.832 0.826 0.835 0.833 0.842 0.845 0.841 0.836 0.835 0.843 0.844 0.842 0.840 0.835 0.834 0.837 0.832 0.837 0.833 0.833 0.829 0.818 0.828 0.834 0.832 0.826 0.825 0.825 0.823 0.823 0.818 0.825 0.828 0.833 0.797 0.793 0.812 0.830 0.821 0.812
Phase
-101 -104 -107 -110 -113 -117 -119 -121 -124 -129 -134
-1.64 -1.71 -1.72 -1.72 -1.73 -1.70 -1.68 -1.65 -1.65 -1.60 -1.62 -1.63 -1.57 -1.60 -1.54 -1.51 -1.52 -1.47 -1.52 -1.54 -1.51 -1.53 -1.54 -1.58 -1.56 -1.51 -1.51 -1.54 -1.58 -1.61 -1.55 -1.53 -1.62 -1.64 -1.64 -1.63 -1.64 -1.63 -1.63 -1.65 -1.68 -1.75 -1.78 -1.75 -1.75 -1.89 -1.96 -2.00 -1.96 -1.87
0.828 0.821 0.821 0.820 0.819 0.822 0.824 0.827 0.827 0.831 0.830 0.829 0.834 0.832 0.837 0.841 0.840 0.845 0.839 0.838 0.840 0.838 0.837 0.833 0.836 0.840 0.841 0.837 0.833 0.831 0.836 0.839 0.830 0.828 0.828 0.829 0.828 0.829 0.829 0.827 0.824 0.817 0.815 0.818 0.817 0.805 0.798 0.795 0.798 0.807
Phase
-101 -104 -107 -110 -113 -116 -119 -123 -125 -127 -131
-16.34 -16.72 -16.91 -17.03 -17.09 -17.34 -17.21 -17.23 -17.44 -17.46 -17.34 -17.71 -17.60 -17.66 -17.53 -17.31 -17.48 -17.21 -17.22 -17.16 -17.16 -17.11 -16.98 -16.96 -16.96 -16.88 -16.92 -16.82 -16.83 -16.81 -16.83 -16.84 -16.82 -16.83 -16.75 -16.74 -16.67 -16.78 -16.68 -16.80 -16.84 -17.08 -17.13 -17.32 -17.20 -17.04 -17.23 -17.59 -17.23 -16.86
0.152 0.146 0.143 0.141 0.140 0.136 0.138 0.138 0.134 0.134 0.136 0.130 0.132 0.131 0.133 0.136 0.134 0.138 0.138 0.139 0.139 0.139 0.142 0.142 0.142 0.143 0.143 0.144 0.144 0.144 0.144 0.144 0.144 0.144 0.145 0.146 0.147 0.145 0.147 0.145 0.144 0.140 0.139 0.136 0.138 0.141 0.138 0.132 0.138 0.144
Phase
-104 -109 -113 -118 -122 -126 -131 -135 -140 -144 -149 -155 -160 -166 -168 -174
Note: Data obtained from on-wafer measurements.
AMMC-2008 Typical Scattering Parameters (Tchuck 25°C, Vsel1 Vsel2 -3V) Out1: Out2: (terminated 50-ohms)
Freq.
-15.47 -15.80 -16.20 -16.77 -17.21 -17.29 -17.22 -17.78 -18.23 -17.84 -17.76 -18.94 -20.14 -19.90 -18.88 -18.46 -18.70 -19.74 -21.80 -25.02 -23.45 -21.47 -21.65 -22.59 -22.63 -23.52 -27.01 -28.96 -24.73 -23.06 -23.94 -25.49 -25.94 -28.94 -40.23 -27.64 -21.32 -20.15 -22.12 -24.36 -21.84 -21.32 -24.37 -24.69 -19.69 -17.83 -19.34 -20.09 -19.24 -19.75
0.168 0.162 0.155 0.145 0.138 0.137 0.138 0.129 0.123 0.128 0.129 0.113 0.098 0.101 0.114 0.119 0.116 0.103 0.081 0.056 0.067 0.084 0.083 0.074 0.074 0.067 0.045 0.036 0.058 0.070 0.064 0.053 0.050 0.036 0.010 0.041 0.086 0.098 0.078 0.061 0.081 0.086 0.060 0.058 0.104 0.128 0.108 0.099 0.109 0.103
Phase
-106 -115 -132 -138 -108 -108 -137 -161 -167 -114 -148
-53.97 -49.29 -45.20 -42.97 -41.36 -39.87 -38.16 -38.42 -37.60 -37.25 -36.70 -36.35 -36.41 -36.38 -35.72 -35.61 -35.90 -36.35 -37.22 -37.44 -37.49 -37.20 -38.25 -38.34 -38.35 -37.89 -36.88 -36.46 -35.27 -35.16 -34.51 -33.58 -32.38 -31.34 -31.18 -30.30 -29.79 -28.94 -28.77 -28.03 -27.57 -26.55 -26.08 -25.07 -26.09 -25.55 -23.64 -22.36 -22.70 -22.76
0.002 0.003 0.005 0.007 0.009 0.010 0.012 0.012 0.013 0.014 0.015 0.015 0.015 0.015 0.016 0.017 0.016 0.015 0.014 0.013 0.013 0.014 0.012 0.012 0.012 0.013 0.014 0.015 0.017 0.017 0.019 0.021 0.024 0.027 0.028 0.031 0.032 0.036 0.036 0.040 0.042 0.047 0.050 0.056 0.050 0.053 0.066 0.076 0.073 0.073
Phase
-54.90 -49.25 -45.17 -43.04 -41.65 -39.74 -38.21 -38.37 -37.43 -36.97 -36.70 -36.50 -36.33 -36.31 -35.32 -35.49 -35.62 -36.51 -37.14 -37.33 -37.13 -37.01 -38.04 -38.34 -38.11 -37.42 -36.76 -36.14 -35.25 -35.00 -34.27 -33.56 -32.74 -31.68 -31.04 -30.18 -29.50 -29.27 -28.93 -28.05 -27.62 -26.98 -26.38 -25.67 -25.23 -25.02 -24.44 -24.04 -23.62 -23.00
0.002 0.003 0.006 0.007 0.008 0.010 0.012 0.012 0.013 0.014 0.015 0.015 0.015 0.015 0.017 0.017 0.017 0.015 0.014 0.014 0.014 0.014 0.013 0.012 0.012 0.013 0.015 0.016 0.017 0.018 0.019 0.021 0.023 0.026 0.028 0.031 0.034 0.034 0.036 0.040 0.042 0.045 0.048 0.052 0.055 0.056 0.060 0.063 0.066 0.071
Phase
-4.66 -4.63 -4.58 -4.52 -4.44 -4.36 -4.29 -4.22 -4.15 -4.09 -4.04 -4.00 -3.97 -3.96 -3.94 -3.95 -3.95 -3.96 -3.99 -4.01 -4.03 -4.07 -4.11 -4.17 -4.17 -4.22 -4.26 -4.27 -4.31 -4.33 -4.37 -4.38 -4.43 -4.45 -4.49 -4.52 -4.52 -4.58 -4.58 -4.57 -4.61 -4.62 -4.64 -4.70 -4.68 -4.65 -4.67 -4.68 -4.70 -4.66
0.585 0.587 0.590 0.594 0.600 0.605 0.610 0.615 0.620 0.624 0.628 0.631 0.633 0.634 0.635 0.635 0.635 0.634 0.632 0.630 0.629 0.626 0.623 0.619 0.619 0.615 0.613 0.612 0.609 0.607 0.605 0.604 0.601 0.599 0.596 0.594 0.594 0.590 0.590 0.591 0.588 0.588 0.586 0.582 0.583 0.586 0.584 0.583 0.582 0.585
Phase
Note: Data obtained from on-wafer measurements.
Input
Output
Output
Operation Input Output ports AC-coupled. DC-coupled, voltages Input Output ports must 0.25 volts guaranteed switch performance. Assembly Techniques chip should attached directly ground plane using either fluxless AuSn solder preform electrically conductive epoxy[1]. conductive epoxy, amount should just enough provide thin fillet around bottom perimeter die. ground plane should free residue that jeopardize electrical mechanical attachment. Caution should taken exceed Absolute Maximum Rating assembly temperature time.
Vsel
Figure AMMC-2008 Schematic.
Vsel
Recommended Operation Conditions
Vsel1
-0.4 -3.5 -2.5 -0.4 -3.5 -2.5
Vsel2
-3.5 -2.5 -0.4 -0.4 -3.5 -2.5
Out1
Out2
Thermosonic wedge bonding preferred method wire attachment bond pads. connections should kept short possible minimize inductance. Gold mesh[2] doublebonding with gold wire recommended. Mesh attached using round tracking tool tool force approximately grams with ultrasonic power roughly duration guided wedge ultrasonic power level used wire. recommended wire bond stage temperature chip thick should handled with care.
Output
Vsel Input Vsel
Output
Figure Biasing Diagram.
This MMIC exposed bridges surface. Handle edges with custom collet pick with vacuum center.)
This MMIC also static sensitive handling precautions should taken. more information, Avago Application Note "GaAs MMIC ESD, Attach Bonding Guidelines." Notes: Ablebond 84-1 silver epoxy recommended. Buckbee-Mears Corporation, Paul, 800-262-3824
RF_I
RF_01
RF_02
Vsel2
Vsel1
Figure Chip Bias/RF Bond Locations. (dimensions micrometers)
Ordering Information AMMC-2008-W10 devices tray AMMC-2008-W50 devices tray
RFIN
RF_1 RF_01 RFOUT1 VSEL2 VSEL1 RF_02 RFOUT2
Chip Capacitor
Figure Chip Assembly Diagram.
product information complete list distributors, please site:
www.avagotech.com
Avago, Avago Technologies, logo trademarks Avago Technologies, Limited United States other countries. Data subject change. Copyright 2006 Avago Technologies, Limited. rights reserved. Obsoletes 5989-3211EN 5989-3928EN August 2006

Other recent searches


ST24C08 - ST24C08   ST24C08 Datasheet
ST25C08 - ST25C08   ST25C08 Datasheet
ST24W08 - ST24W08   ST24W08 Datasheet
ST25W08 - ST25W08   ST25W08 Datasheet
ST24x08 - ST24x08   ST24x08 Datasheet
ST25x08 - ST25x08   ST25x08 Datasheet
SP-1KL - SP-1KL   SP-1KL Datasheet
MBA-18LH - MBA-18LH   MBA-18LH Datasheet
HMC460LC5 - HMC460LC5   HMC460LC5 Datasheet
FAN8001D - FAN8001D   FAN8001D Datasheet
BGA304A - BGA304A   BGA304A Datasheet
2SB1391 - 2SB1391   2SB1391 Datasheet

 

Privacy Policy | Disclaimer
© 2012 Datasheet Archive