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REJ03G1321-0300 Rev.3.00 2006 on-resistance RDS(on) (VGS drive cu


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RQK0201QGDQA
REJ03G1321-0300 Rev.3.00 2006
on-resistance RDS(on) (VGS drive current High speed switching gate drive
Outline
RENESAS Package code: PLSP0003ZB-A (Package name: MPAK)
Source Gate Drain
Note:
Marking "QG".
Absolute Maximum Ratings
25°C)
Item Symbol Drain source voltage VDSS Gate source voltage VGSS Drain current Note1 Drain peak current ID(pulse) Body drain diode reverse drain current Channel dissipation Note2 Channel temperature Storage temperature Tstg Notes: duty cycle When using glass epoxy board (FR-4: Ratings +150 Unit
Rev.3.00 2006 page
RQK0201QGDQA
Electrical Characteristics
25°C)
Item Drain source breakdown voltage Gate source breakdown voltage Gate source leak current Drain source leak current Gate source cutoff voltage Drain source state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn delay time Rise time Turn delay time Fall time Total gate charge Gate source charge Gate drain charge Body drain diode forward voltage Notes: Pulse test Symbol V(BR)DSS V(BR)GSS IGSS IDSS VGS(off) RDS(on) RDS(on) |yfs| Ciss Coss Crss td(on) td(off) 0.85 Unit Test conditions ±100 2.4A, VNote3 2.4A, VNote3 2.4A, VNote3 5.50 Note3
Rev.3.00 2006 page
RQK0201QGDQA
Main Characteristics
Maximum Channel Power Dissipation Curve
Operation this area limited RDS(on)
Maximum Safe Operation Area
Channel Dissipation
Drain Current
25°C Shot Pulse
0.01 0.01
Ambient Temperature (°C)
*When using glass epoxy board (FR-4:
Drain Source Voltage
Typical Output Characteristics
Pulse Test 25°C
Typical Transfer Characteristics
Pulse Test
Drain Current
Drain Current
75°C 25°C -25°C
Drain Source Voltage
Gate Source Voltage
Gate Source Cutoff Voltage
Typical Transfer Characteristics
Pulse Test
Case Temperature
Gate Source Cutoff Voltage VGS(off)
Pulse Test
Drain Current
0.01 75°C 25°C 0.001 -25°C
0.0001
Gate Source Voltage
Case Temperature (°C)
Rev.3.00 2006 page
RQK0201QGDQA
Drain Source Saturation Voltage VDS(on) (mV)
Drain Source Saturation Voltage Gate Source Voltage Static Drain Source State Resistance Drain Current
Drain Source State Resistance RDS(on)
Pulse Test 25°C
1000
Pulse Test 25°C
Gate Source Voltage Static Drain Source State Resistance Case Temperature
Drain Current Static Drain Source State Resistance Case Temperature
Drain Source State Resistance RDS(on)
Drain Source State Resistance RDS(on)
Pulse Test
Pulse Test
Case Temperature (°C)
Case Temperature (°C)
Zero Gate Voltage Drain current Case Temperature
10000 Pulse Test
Forward Transfer Admittance |yfs|
Pulse Test -25°C
Zero Gate Voltage Drain current
IDSS (nA)
Forward Transfer Admittance Drain Current
1000
25°C 75°C
0.01 0.01
Drain Current
Case Temperature (°C)
Rev.3.00 2006 page
RQK0201QGDQA
Dynamic Input Characteristics
Drain Source Voltage Gate Source Voltage
1000
Switching Characteristics
25°C
Switching Time (ns)
td(off) td(on)
25°C
Gate Charge (nc)
Drain Current
Typical Capacitance Drain Source Voltage
1000 Ciss Coss Crss
Input Capacitance Gate Source Voltage
Ciss, Coss, Crss (pF)
Ciss (pF)
Drain Source Voltage Reverse Drain Current Source Drain Voltage
Gate Source Voltage Body-Drain Diode Forward Voltage Case Temperature
Reverse Drain Current
Pulse Test 25°C
Body-Drain Diode Forward Voltage VSDF
Source Drain Voltage
Case Temperature (°C)
Rev.3.00 2006 page
RQK0201QGDQA
Package Dimensions
Package Name MPAK JEITA Package Code SC-59A RENESAS Code PLSP0003ZB-A Previous Code MPAK(T) MPAK(T)V MASS[Typ.] 0.011g
Reference Dimension Millimeters Symbol
Section
Pattern terminal position areas
0.35 1.35 0.35 0.15 0.25
0.25 0.42 0.13 0.11 0.95
0.15 1.65 0.75 0.55 0.65 0.05 0.55 1.05
1.95
Ordering Information
Part Name RQK0201QGDQATL-E Quantity 3000 pcs. Shipping Container reel, Emboss taping
Rev.3.00 2006 page
Sales Strategic Planning Div.
Keep safety first your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Renesas Technology Corp. puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap. Notes regarding these materials These materials intended reference assist customers selection Renesas Technology Corp. product best suited customer's application; they convey license under intellectual property rights, other rights, belonging Renesas Technology Corp. third party. Renesas Technology Corp. assumes responsibility damage, infringement third-party's rights, originating product data, diagrams, charts, programs, algorithms, circuit application examples contained these materials. information contained these materials, including product data, diagrams, charts, programs algorithms represents information products time publication these materials, subject change Renesas Technology Corp. without notice product improvements other reasons. therefore recommended that customers contact Renesas Technology Corp. authorized Renesas Technology Corp. product distributor latest product information before purchasing product listed herein. information described here contain technical inaccuracies typographical errors. Renesas Technology Corp. assumes responsibility damage, liability, other loss rising from these inaccuracies errors. Please also attention information published Renesas Technology Corp. various means, including Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). When using information contained these materials, including product data, diagrams, charts, programs, algorithms, please sure evaluate information total system before making final decision applicability information products. Renesas Technology Corp. assumes responsibility damage, liability other loss resulting from information contained herein. Renesas Technology Corp. semiconductors designed manufactured device system that used under circumstances which human life potentially stake. Please contact Renesas Technology Corp. authorized Renesas Technology Corp. product distributor when considering product contained herein specific purposes, such apparatus systems transportation, vehicular, medical, aerospace, nuclear, undersea repeater use. prior written approval Renesas Technology Corp. necessary reprint reproduce whole part these materials. these products technologies subject Japanese export control restrictions, they must exported under license from Japanese government cannot imported into country other than approved destination. diversion reexport contrary export control laws regulations Japan and/or country destination prohibited. Please contact Renesas Technology Corp. further details these materials products contained therein.
RENESAS SALES OFFICES
Refer latest detailed information. Renesas Technology America, Inc. Holger Way, Jose, 95134-1368, U.S.A Tel: (408) 382-7500, Fax: (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> 2715-2888, Fax: <886> 2713-2999 Renesas Technology Singapore Pte. Ltd. Harbour Front Avenue, #06-10, Keppel Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 796-3115, Fax: <82> 796-2145
http://www.renesas.com
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2006. Renesas Technology Corp., rights reserved. Printed Japan.
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