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REJ03G1320-0300 Rev.3.00 2006 on-resistance RDS(on) (VGS -4.5 -0.


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RQJ0204XGDQA
REJ03G1320-0300 Rev.3.00 2006
on-resistance RDS(on) (VGS -4.5 -0.8 drive current High speed switching gate drive
Outline
RENESAS Package code: PLSP0003ZB-A (Package name: MPAK)
Source Gate Drain
Note:
Marking "XG".
Absolute Maximum Ratings
25°C)
Item Symbol Drain source voltage VDSS Gate source voltage VGSS Drain current Note1 Drain peak current ID(pulse) Body drain diode reverse drain current Channel dissipation Note2 Channel temperature Storage temperature Tstg Notes: duty cycle When using glass epoxy board (FR-4: Ratings -1.6 -4.0 -1.6 +150 Unit
Rev.3.00 2006 page
RQJ0204XGDQA
Electrical Characteristics
25°C)
Item Drain source breakdown voltage Gate source breakdown voltage Gate source leak current Drain source leak current Gate source cutoff voltage Drain source state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn delay time Rise time Turn delay time Fall time Total gate charge Gate source charge Gate drain charge Body drain diode forward voltage Notes: Pulse test Symbol V(BR)DSS V(BR)GSS V(BR)GSS IGSS IGSS IDSS VGS(off) RDS(on) RDS(on) |yfs| Ciss Coss Crss td(on) td(off) -0.4 -0.85 -1.4 -1.1 Unit Test conditions +100 -100 -0.8 -4.5 VNote3 -0.8 -2.5 VNote3 -0.8 VNote3 -0.8 -4.5 12.5 -4.5 -1.6A -1.6 Note3
Rev.3.00 2006 page
RQJ0204XGDQA
Main Characteristics
Maximum Channel Power Dissipation Curve
-100 Operation this area limited RDS(on)
Maximum Safe Operation Area
Channel Dissipation
Drain Current
-0.1
25°C Shot Pulse
-0.01 -0.01
-0.1
-100
Ambient Temperature (°C)
*When using glass epoxy board (FR-4:
Drain Source Voltage
VTypical Output -4.5
Characteristics
-3.0
Typical Transfer Characteristics
Pulse Test
Drain Current
Drain Current
-3.2 -3.4 -3.6 -3.8 -4.0
-2.8 -2.6
-2.4 -2.2
Pulse Test 25°C
-2.0
75°C 25°C -25°C
Drain Source Voltage
Gate Source Voltage
Gate Source Cutoff Voltage
Pulse Test
Gate Source Cutoff Voltage VGS(off)
Typical Transfer Characteristics
Case Temperature
-1.5 Pulse Test
Drain Current
-0.1
-0.01
75°C
-0.001
25°C -25°C
-0.5
-0.1
-0.0001
-0.5
-1.5
-2.5
Gate Source Voltage
Case Temperature (°C)
Rev.3.00 2006 page
RQJ0204XGDQA
Drain Source Saturation Voltage VDS(on) (mV)
Drain Source Saturation Voltage Gate Source Voltage Static Drain Source State Resistance Drain Current
Drain Source State Resistance RDS(on)
-900 -800 -700 -600 -500 -400 -300 -200 -100
Pulse Test 25°C
10000
Pulse Test 25°C
1000 -2.5 -4.5 -0.1 -100
-1.6 -0.5 -0.8 -0.2
Gate Source Voltage Static Drain Source State Resistance Case Temperature
Drain Current Static Drain Source State Resistance Case Temperature
Drain Source State Resistance RDS(on)
Drain Source State Resistance RDS(on)
-0.8 -0.5 -0.2 Pulse Test -2.5 -1.6
Pulse Test -4.5 -1.6 -0.8
-0.5 -0.2
Case Temperature (°C)
Case Temperature (°C)
Zero Gate Voltage Drain current Case Temperature
-1000 Pulse Test
Forward Transfer Admittance |yfs|
Pulse Test 25°C 75°C -25°C
Zero Gate Voltage Drain current
IDSS (nA)
Forward Transfer Admittance Drain Current
-100
0.01 -0.01
-0.1
-0.1
Drain Current
Case Temperature (°C)
Rev.3.00 2006 page
RQJ0204XGDQA
Dynamic Input Characteristics Switching Characteristics
Drain Source Voltage
Gate Source Voltage
1000
Switching Time (ns)
-4.5 25°C
td(off) td(on)
-1.6 25°C
-0.1
Gate Charge (nc)
Drain Current
Typical Capacitance Drain Source Voltage
1000
Input Capacitance Gate Source Voltage
Ciss, Coss, Crss (pF)
Ciss (pF)
Ciss
Coss Crss
Drain Source Voltage Reverse Drain Current Source Drain Voltage
Gate Source Voltage Body-Drain Diode Forward Voltage Case Temperature
-0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1
Reverse Drain Current
Pulse Test 25°C
Body-Drain Diode Forward Voltage VSDF
-10V
-0.4 -0.8 -1.2 -1.6 -2.0
Source Drain Voltage
Case Temperature (°C)
Rev.3.00 2006 page
RQJ0204XGDQA
Package Dimensions
Package Name MPAK JEITA Package Code SC-59A RENESAS Code PLSP0003ZB-A Previous Code MPAK(T) MPAK(T)V MASS[Typ.] 0.011g
Reference Dimension Millimeters Symbol
Section
Pattern terminal position areas
0.35 1.35 0.35 0.15 0.25
0.25 0.42 0.13 0.11 0.95
0.15 1.65 0.75 0.55 0.65 0.05 0.55 1.05
1.95
Ordering Information
Part Name RQJ0204XGDQATL-E Quantity 3000 pcs. Shipping Container reel, Emboss taping
Rev.3.00 2006 page
Sales Strategic Planning Div.
Keep safety first your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Renesas Technology Corp. puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap. Notes regarding these materials These materials intended reference assist customers selection Renesas Technology Corp. product best suited customer's application; they convey license under intellectual property rights, other rights, belonging Renesas Technology Corp. third party. Renesas Technology Corp. assumes responsibility damage, infringement third-party's rights, originating product data, diagrams, charts, programs, algorithms, circuit application examples contained these materials. information contained these materials, including product data, diagrams, charts, programs algorithms represents information products time publication these materials, subject change Renesas Technology Corp. without notice product improvements other reasons. therefore recommended that customers contact Renesas Technology Corp. authorized Renesas Technology Corp. product distributor latest product information before purchasing product listed herein. information described here contain technical inaccuracies typographical errors. Renesas Technology Corp. assumes responsibility damage, liability, other loss rising from these inaccuracies errors. Please also attention information published Renesas Technology Corp. various means, including Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). When using information contained these materials, including product data, diagrams, charts, programs, algorithms, please sure evaluate information total system before making final decision applicability information products. Renesas Technology Corp. assumes responsibility damage, liability other loss resulting from information contained herein. Renesas Technology Corp. semiconductors designed manufactured device system that used under circumstances which human life potentially stake. Please contact Renesas Technology Corp. authorized Renesas Technology Corp. product distributor when considering product contained herein specific purposes, such apparatus systems transportation, vehicular, medical, aerospace, nuclear, undersea repeater use. prior written approval Renesas Technology Corp. necessary reprint reproduce whole part these materials. these products technologies subject Japanese export control restrictions, they must exported under license from Japanese government cannot imported into country other than approved destination. diversion reexport contrary export control laws regulations Japan and/or country destination prohibited. Please contact Renesas Technology Corp. further details these materials products contained therein.
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2006. Renesas Technology Corp., rights reserved. Printed Japan.
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