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REJ03G0389-0200 Rev.2.00 2006 on-resistance leakage current High
Top Searches for this datasheetH5N1506P REJ03G0389-0200 Rev.2.00 2006 on-resistance leakage current High speed switching Outline RENESAS Package code: PRSS0004ZE-A (Package name: TO-3P) Gate Drain (Flange) Source Absolute Maximum Ratings 25°C) Item Drain Source voltage Gate Source voltage Drain current Drain peak current Body-Drain diode reverse Drain current Body-Drain diode reverse Drain peak current Avalanche current Avalanche energy Channel dissipation Channel case thermal impedance Channel temperature Storage temperature Notes: duty cycle Value 25°C STch 25°C, 150°C Symbol VDSS VGSS (pulse) Note1 (pulse) Note3 EARNote3 Note2 ch-c Tstg Note1 Ratings 0.833 +150 Unit °C/W Rev.2.00 2006 page H5N1506P Electrical Characteristics 25°C) Item Drain Source breakdown voltage Zero Gate voltage Drain current Gate Source leak current Gate Source cutoff voltage Forward transfer admittance Static Drain Source state resistance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total Gate charge Gate Source charge Gate Drain charge Body-Drain diode forward voltage Body-Drain diode reverse recovery time Body-Drain diode reverse recovery charge Notes: Pulse test Symbol V(BR)DSS IDSS IGSS VGS(off) |yfs| RDS(on) Ciss Coss Crss td(on) td(off) 0.014 4900 1000 ±0.1 0.016 Unit Test conditions 47.5 Note4 47.5 VNote4 47.5 1.58 Note4 diF/dt A/µs Rev.2.00 2006 page H5N1506P Main Characteristics Power Temperature Derating 1000 Maximum Safe Operation Area 25°C Channel Dissipation Drain Current (1shot) Operation 25°C) area limited Operation this 0.03 RDS(on) 0.01 1000 Case Temperature (°C) Drain Source Voltage Typical Output Characteristics Pulse Test Typical Transfer Characteristics Pulse Test Drain Current Drain Current 75°C 25°C -25°C Drain Source Voltage Drain Source Saturation Voltage Gate Source Voltage Drain Source State Resistance RDS(on) Drain Source Saturation Voltage VDS(on) Pulse Test Gate Source Voltage Static Drain Source State Resistance Drain Current 0.05 0.02 0.01 0.005 0.002 0.001 Pulse Test 47.5 1000 Gate Source Voltage Drain Current Rev.2.00 2006 page H5N1506P Static Drain Source State Resistance Temperature Forward Transfer Admittance |yfs| 0.05 1000 25°C 75°C Pulse Test 1000 -25°C Pulse Test Static Drain Source State Resistance RDS(on) Forward Transfer Admittance Drain Current 0.04 47.5 0.03 0.02 0.01 Case Temperature (°C) Drain Current Typical Capacitance Drain Source Voltage 100000 30000 Body-Drain Diode Reverse Recovery Time Reverse Recovery Time (ns) 1000 1000 25°C Capacitance (pF) 10000 3000 1000 Crss Coss Ciss Reverse Drain Current Drain Source Voltage Dynamic Input Characteristics Drain Source Voltage Switching Characteristics Gate Source Voltage 10000 duty td(off) Switching Time (ns) 1000 td(on) Gate Charge (nC) Drain Current Rev.2.00 2006 page H5N1506P Reverse Drain Current Source Drain Voltage Gate Source Cutoff Voltage VGS(off) Gate Source Cutoff Voltage Case Temperature Reverse Drain Current Pulse Test Source Drain Voltage Case Temperature (°C) Normalized Transient Thermal Impedance Normalized Transient Thermal Impedance Pulse Width 25°C 0.05 c(t) 0.833°C/W, 25°C 0.03 0.02 0.01 Pulse Width Switching Time Test Circuit Waveform Monitor D.U.T. Vout Monitor Vout td(off) td(on) Rev.2.00 2006 page H5N1506P Package Dimensions Package Name TO-3P JEITA Package Code SC-65 RENESAS Code PRSS0004ZE-A Previous Code TO-3P TO-3PV MASS[Typ.] 5.0g Unit: 15.6 14.9 19.9 18.0 5.45 5.45 Ordering Information Part Name H5N1506P-E Quantity (Tube) Shipping Container Note: some grades, production terminated. Please contact Renesas sales office check state production before ordering product. Rev.2.00 2006 page Sales Strategic Planning Div. Keep safety first your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Renesas Technology Corp. puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. 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