(Manufactured Toshiba Malaysia) Darlington Sink Driver ULN20

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(Manufactured Toshiba Malaysia) Darlington Sink Driver ULN20

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ULN2003,04APG/AFWG
(Manufactured Toshiba Malaysia)
Darlington Sink Driver
ULN2003APG/AFWG Series high-voltage, high-current darlington drivers comprised seven darlington pairs. units feature integral clamp diodes switching inductive loads. Applications include relay, hammer, lamp display (LED) drivers. suffix appended part number represents Lead (Pb)-Free product.
ULN2003APG ULN2004APG
Features
Output current (single output): High sustaining voltage output: Output clamp diodes Inputs compatible with various types logic Package Type-APG: DIP-16pin Package Type-AFWG: SOL-16pin
ULN2003AFWG ULN2004AFWG
Type ULN2003APG/AFWG ULN2004APG/AFWG
Input Base Resistor 10.5
Designation TTL, CMOS 6~15 PMOS, CMOS
Weight DIP16-P-300-2.54A 1.11 (typ.) SOL16-P-150-1.27A 0.15 (typ.)
Connection (top view)
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ULN2003,04APG/AFWG
Schematics (each driver)
ULN2003APG/AFWG ULN2004APG/AFWG
Note: input output parasitic diodes cannot used clamp diodes.
Absolute Maximum Ratings 25°C)
Characteristic Output sustaining voltage Output current Input voltage Clamp diode reverse voltage Clamp diode forward current Power dissipation Operating temperature Storage temperature AFWG Symbol (SUS) IOUT Topr Tstg Rating -0.5~50 -0.5~30 1.47 1.25 (Note) -40~85 -55~150 Unit mA/ch
Note: (Test Board: JEDEC 2s2p)
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ULN2003,04APG/AFWG
Recommended Operating Conditions 85°C)
Characteristic Output sustaining voltage Output current AFWG Input voltage Input voltage (output Input voltage (output off) ULN2003A ULN2004A ULN2003A ULN2004A (ON) IOUT IOUT Symbol (SUS) Circuits 85°C 120°C Duty Duty Duty Duty Test Condition 85°C 85°C (Note) Typ. 0.76 0.65 mA/ch Unit
(OFF)
Clamp diode reverse voltage Clamp diode forward current Power dissipation AFWG
Note: (Test Board: JEDEC 2s2p)
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ULN2003,04APG/AFWG
Electrical Characteristics 25°C unless otherwise noted)
Characteristic Output leakage current Symbol ICEX Test Circuit Test Condition 25°C 85°C IOUT Collector-emitter saturation voltage (sat) IOUT IOUT Current transfer ratio Input current (output ULN2003A ULN2004A (ON) (OFF) IOUT IOUT IOUT IOUT 85°C IOUT (ON) ULN2004A IOUT IOUT IOUT tOFF VOUT VOUT 25°C 85°C 1000 Typ. Unit
Input current (output off) ULN2003A Input voltage (output
Clamp diode reverse current Clamp diode forward voltage Input capacitance Turn-on delay Turn-off delay
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ULN2003,04APG/AFWG
Test Circuit
ICEX (sat), (ON)
(OFF)
(ON)
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ULN2003,04APG/AFWG
tON, tOFF
Note Pulse width duty cycle Output impedance Note below Input Condition
Type Number ULN2003A ULN2004A
Note includes probe capacitance.
Precautions Using
This does include built-in protection circuits excess current overvoltage. this subjected excess current overvoltage, destroyed. Hence, utmost care must taken when systems which incorporate this designed. Utmost care necessary design output line, COMMON line since destroyed short-circuit between outputs, contamination fault, fault improper grounding.
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ULN2003,04APG/AFWG
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ULN2003,04APG/AFWG
2.00 Type-APG free 1.75 Type-AFWG (Test Board: JEDEC 2s2p)
1.50 1.25 1.00 0.75 0.50 0.25
Power dissipation
Ambient temperature
(°C)
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ULN2003,04APG/AFWG
Package Dimensions
Weight: 1.11 (typ.)
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ULN2003,04APG/AFWG
Package Dimensions
Weight: 0.15 (typ.)
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ULN2003,04APG/AFWG
Notes Contents
Equivalent Circuits
equivalent circuit diagrams simplified some parts them omitted explanatory purposes.
Test Circuits
Components test circuits used only obtain confirm device characteristics. These components circuits guaranteed prevent malfunction failure from occurring application equipment.
Usage Considerations
Notes Handling
absolute maximum ratings semiconductor device ratings that must exceeded, even moment. exceed these ratings. Exceeding rating(s) cause device breakdown, damage deterioration, result injury explosion combustion. appropriate power supply fuse ensure that large current does continuously flow case over current and/or failure. will fully break down when used under conditions that exceed absolute maximum ratings, when wiring routed improperly when abnormal pulse noise occurs from wiring load, causing large current continuously flow breakdown lead smoke ignition. minimize effects flow large current case breakdown, appropriate settings, such fuse capacity, fusing time insertion circuit location, required. your design includes inductive load such motor coil, incorporate protection circuit into design prevent device malfunction breakdown caused current resulting from inrush current power negative current resulting from back electromotive force power OFF. breakdown cause injury, smoke ignition. stable power supply with with built-in protection functions. power supply unstable, protection function operate, causing breakdown. breakdown cause injury, smoke ignition. insert devices wrong orientation incorrectly. Make sure that positive negative terminals power supplies connected properly. Otherwise, current power consumption exceed absolute maximum rating, exceeding rating(s) cause device breakdown, damage deterioration, result injury explosion combustion. addition, device that applied current with inserting wrong orientation incorrectly even just time. Carefully select external components (such inputs negative feedback capacitors) load components (such speakers), example, power regulator. there large amount leakage current such input negative feedback condenser, output voltage will increase. this output voltage connected speaker with input withstand voltage, overcurrent failure cause smoke ignition. (The over current cause smoke ignition from itself.) particular, please attention when using Bridge Tied Load (BTL) connection type that inputs output voltage speaker directly.
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ULN2003,04APG/AFWG
Points Remember Handling
Heat Radiation Design using with large current flow such power amp, regulator driver, please design device that heat appropriately radiated, exceed specified junction temperature (Tj) time condition. These generate heat even during normal use. inadequate heat radiation design lead decrease life, deterioration characteristics breakdown. addition, please design device taking into considerate effect heat radiation with peripheral components. Back-EMF When motor rotates reverse direction, stops slows down abruptly, current flow back motor's power supply effect back-EMF. current sink capability power supply small, device's motor power supply output pins might exposed conditions beyond absolute maximum ratings. avoid this problem, take effect back-EMF into consideration system design.
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ULN2003,04APG/AFWG
About solderability, following conditions were confirmed Solderability Sn-37Pb solder Bath solder bath temperature 230°C dipping time seconds number times once R-type flux Sn-3.0Ag-0.5Cu solder Bath solder bath temperature 245°C dipping time seconds number times once R-type flux
RESTRICTIONS PRODUCT
information contained herein subject change without notice. 021023_D
060116EBA
TOSHIBA continually working improve quality reliability products. Nevertheless, semiconductor devices general malfunction fail their inherent electrical sensitivity vulnerability physical stress. responsibility buyer, when utilizing TOSHIBA products, comply with standards safety making safe design entire system, avoid situations which malfunction failure such TOSHIBA products could cause loss human life, bodily injury damage property. developing your designs, please ensure that TOSHIBA products used within specified operating ranges forth most recent TOSHIBA products specifications. Also, please keep mind precautions conditions forth "Handling Guide Semiconductor Devices," "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A TOSHIBA products listed this document intended usage general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products neither intended warranted usage equipment that requires extraordinarily high quality and/or reliability malfunction failure which cause loss human life bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, types safety devices, etc. Unintended Usage TOSHIBA products listed this document shall made customer's risk. 021023_B products described this document shall used embedded downstream products which manufacture, and/or sale prohibited under applicable laws regulations. 060106_Q information contained herein presented only guide applications products. responsibility assumed TOSHIBA infringements patents other rights third parties which result from use. license granted implication otherwise under patent patent rights TOSHIBA others. 021023_C products described this document subject foreign exchange foreign trade laws. 021023_E
2006-06-14

(Manufactured Toshiba Malaysia) Darlington Sink Driver ULN20

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