SCES660 JUNE 2006 Controlled Baseline Assembly/Test Site, Fabrica

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SCES660 JUNE 2006 Controlled Baseline Assembly/Test Site, Fabrica

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SN74LVC2G06-EP DUAL INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
SCES660 JUNE 2006
Controlled Baseline Assembly/Test Site, Fabrication Site Extended Temperature Performance -55°C 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree Supports Operation Power Consumption, 10-µA ±24-mA Output Drive Typical VOLP (Output Ground Bounce) <0.8 25°C
Component qualification accordance with JEDEC industry standards ensure reliable operation over extended temperature range. This includes, limited Highly Accelerated Stress Test (HAST) biased 85/85, temperature cycle, autoclave unbiased HAST, electromigration, bond intermetallic life, mold compound life. Such qualification testing should viewed justifying this component beyond specified performance environmental limits.
Typical VOHV (Output Undershoot) 25°C Inputs Open-Drain Outputs Accept Voltages Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds JESD Class Protection Exceeds JESD 2000-V Human-Body Model (A114-A) 200-V Machine Model (A115-A) 1000-V Charged-Device Model (C101)
PACKAGE (TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
This dual inverter buffer/driver designed 1.65-V 5.5-V operation. output SN74LVC2G06 device open drain connected other open-drain outputs implement active-low wired-OR active-high wired-AND functions. maximum sink current This device fully specified partial-power-down applications using Ioff. Ioff circuitry disables outputs, preventing damaging current backflow through device when powered down. ORDERING INFORMATION
-55°C 125°C PACKAGE (SC-70) Tape reel ORDERABLE PART NUMBER SN74LVC2G06MDCKREP TOP-SIDE MARKING
Package drawings, standard packing quantities, thermal data, symbolization, design guidelines available www.ti.com/sc/package.
FUNCTION TABLE (each inverter)
INPUT OUTPUT
Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet.
PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters.
Copyright 2006, Texas Instruments Incorporated
SN74LVC2G06-EP DUAL INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
SCES660 JUNE 2006
LOGIC DIAGRAM (POSITIVE LOGIC)
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
Tstg Supply voltage range Input voltage range Voltage range applied output high-impedance power-off Voltage range applied output high state Input clamp current Output clamp current Continuous output current Continuous current through Package thermal impedance Storage temperature range state -0.5 -0.5 -0.5 -0.5 ±100 UNIT °C/W
Stresses beyond those listed under "absolute maximum ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated under "recommended operating conditions" implied. Exposure absolute-maximum-rated conditions extended periods affect device reliability. input negative-voltage output voltage ratings exceeded input output current ratings observed. value provided recommended operating conditions table. package thermal impedance calculated accordance with JESD 51-7.
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SN74LVC2G06-EP DUAL INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
SCES660 JUNE 2006
Recommended Operating Conditions
Supply voltage
Operating Data retention only 1.65 1.95 High-level input voltage 1.65 1.95 Low-level input voltage Input voltage Output voltage 1.65 Low-level output current 0.15 Input transition rise fall rate Operating free-air temperature 1.65 0.65
UNIT
0.35 ns/V
unused inputs device must held ensure proper device operation. Refer application report, Implications Slow Floating CMOS Inputs, literature number SCBA004.
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER Ioff inputs GND, input typical values 25°C. Other inputs TEST CONDITIONS 1.65 1.65 1.65 0.45 0.55 0.55 UNIT
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SN74LVC2G06-EP DUAL INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
SCES660 JUNE 2006
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure
PARAMETER FROM (INPUT) (OUTPUT) 0.15 UNIT
Operating Characteristics
25°C
PARAMETER Power dissipation capacitance TEST CONDITIONS UNIT
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SN74LVC2G06-EP DUAL INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
SCES660 JUNE 2006
PARAMETER MEASUREMENT INFORMATION (Open Drain)
VLOAD From Output Under Test (see Note Open TEST tPZL (see Notes tPLZ (see Notes tPHZ/tPZH LOAD CIRCUIT INPUT 0.15 tr/tf VCC/2 VCC/2 VCC/2 VLOAD 0.15 0.15 Timing Input Input VOLTAGE WAVEFORMS PULSE DURATION Input tPLH Output tPHL tPHL tPLH Output VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING NONINVERTING OUTPUTS Output Control Output Waveform VLOAD (see Note Output Waveform VLOAD (see Note tPZL tPZH VOLTAGE WAVEFORMS SETUP HOLD TIMES tPLZ VLOAD/2 tPHZ VLOAD/2 VLOAD/2 VOLTAGE WAVEFORMS ENABLE DISABLE TIMES LOW- HIGH-LEVEL ENABLING Data Input VLOAD VLOAD VLOAD
NOTES: includes probe capacitance. Waveform output with internal conditions such that output low, except when disabled output control. Waveform output with internal conditions such that output high, except when disabled output control. input pulses supplied generators having following characteristics: MHz, outputs measured time, with transition measurement. Since this device open-drain outputs, tPLZ tPZL same tpd. tPZL measured tPLZ measured parameters waveforms applicable devices.
Figure Load Circuit Voltage Waveforms
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PACKAGE OPTION ADDENDUM
5-Jul-2006
PACKAGING INFORMATION
Orderable Device SN74LVC2G06MDCKREP V60/06640-01XE
Status ACTIVE ACTIVE
Package Type SC70 SC70
Package Drawing
Pins Package Plan 3000 Green (RoHS Sb/Br) 3000 Green (RoHS Sb/Br)
Lead/Ball Finish NIPDAU NIPDAU
Peak Temp Level-1-260C-UNLIM Level-1-260C-UNLIM
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
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SCES660 JUNE 2006 Controlled Baseline Assembly/Test Site, Fabrica

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