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REJ03G0157-0600Z (Previous: ADE-208-108E) Rev.6.00 Jan.06.2004 fo


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HRW0502A
REJ03G0157-0600Z (Previous: ADE-208-108E) Rev.6.00 Jan.06.2004
forward voltage drop suitable high efficiency rectifying. MPAK Package suitable high density surface mounting high speed assembly.
Ordering Information
Type HRW0502A Laser Mark Package Code MPAK
Arrangement
(Top View)
Anode Cathode
Rev.6.00, Jan.06.2004, page
HRW0502A
Absolute Maximum Ratings
25°C)
Item Repetitive peak reverse voltage Average rectified current Non-Repetitive peak forward surge current Junction temperature Storage temperature Notes: from Fig.4 Fig.6 sine wave pulse Symbol VRRM Tstg
Value +125
Unit
IFSM
Electrical Characteristics
25°C)
Item Forward voltage Reverse current Capacitance Thermal resistance Note: Polyimide board
Symbol Rth(j-a)
Unit °C/W
Test Condition Polyimide board
Unit:
Rev.6.00, Jan.06.2004, page
HRW0502A
Main Characteristic
Pulse test
Reverse current Forward current
75°C
10-1 Pulse test 10-2
10-1
25°C
10-3
75°C
10-4
25°C
10-3
10-5
10-4
10-6
Forward voltage Fig.1 Forward current Forward voltage
Reverse voltage Fig.2 Reverse current Reverse voltage
1MHz Pulse test
Capacitance (pF)
Reverse voltage
Fig.3 Capacitance Reverse voltage
Rev.6.00, Jan.06.2004, page
HRW0502A
25°C D=1/3 sin(=180°) D=1/2
Forward power dissipation Reverse power dissipation
D=1/6
125°C
D=5/6
D=2/3 D=1/2
sin(=180°)
Forward current Fig.4 Forward power dissipation Forward current
Reverse voltage Fig.5 Reverse power dissipation Reverse voltage
VR=VRRM/2
Average rectified current
=125°C Rth(j-a)=340°C/W
sin(=180°)
D=1/6
D=1/2 D=1/3
Ambient temperature (°C) Fig.6 Average rectified current Ambient temperature
Rev.6.00, Jan.06.2004, page
HRW0502A
Package Dimensions
January, 2003
Unit:
(0.65)
0.10 3-0.4 0.05
0.16 0.06
0.10
0.15
(0.95) (0.95)
(0.3)
(0.65)
Package Code JEDEC JEITA Mass (reference value)
MPAK Conforms 0.011
Rev.6.00, Jan.06.2004, page
Sales Strategic Planning Div.
Keep safety first your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Renesas Technology Corp. puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap. Notes regarding these materials These materials intended reference assist customers selection Renesas Technology Corp. product best suited customer's application; they convey license under intellectual property rights, other rights, belonging Renesas Technology Corp. third party. Renesas Technology Corp. assumes responsibility damage, infringement third-party's rights, originating product data, diagrams, charts, programs, algorithms, circuit application examples contained these materials. information contained these materials, including product data, diagrams, charts, programs algorithms represents information products time publication these materials, subject change Renesas Technology Corp. without notice product improvements other reasons. therefore recommended that customers contact Renesas Technology Corp. authorized Renesas Technology Corp. product distributor latest product information before purchasing product listed herein. information described here contain technical inaccuracies typographical errors. Renesas Technology Corp. assumes responsibility damage, liability, other loss rising from these inaccuracies errors. Please also attention information published Renesas Technology Corp. various means, including Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). When using information contained these materials, including product data, diagrams, charts, programs, algorithms, please sure evaluate information total system before making final decision applicability information products. Renesas Technology Corp. assumes responsibility damage, liability other loss resulting from information contained herein. Renesas Technology Corp. semiconductors designed manufactured device system that used under circumstances which human life potentially stake. Please contact Renesas Technology Corp. authorized Renesas Technology Corp. product distributor when considering product contained herein specific purposes, such apparatus systems transportation, vehicular, medical, aerospace, nuclear, undersea repeater use. prior written approval Renesas Technology Corp. necessary reprint reproduce whole part these materials. these products technologies subject Japanese export control restrictions, they must exported under license from Japanese government cannot imported into country other than approved destination. diversion reexport contrary export control laws regulations Japan and/or country destination prohibited. Please contact Renesas Technology Corp. further details these materials products contained therein.
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Renesas Technology America, Inc. Holger Way, Jose, 95134-1368, U.S.A Tel: (408) 382-7500 Fax: (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, 5FH, United Kingdom Tel: <44> (1628) 100, Fax: <44> (1628) Renesas Technology Europe GmbH Dornacher Str. D-85622 Feldkirchen, Germany Tel: <49> (89) Fax: <49> (89) Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. #99, Fu-Hsing Rd., Taipei, Taiwan Tel: <886> 2715-2888, Fax: <886> 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. Harbour Front Avenue, #06-10, Keppel Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
2003. Renesas Technology Corp., rights reserved. Printed Japan.
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