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applications suppression Transient suppression dimensions construction


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bidirectional suppressor features (16kV) 61000-4-2 rating Surface mount package High component density Products with lead-free terminations meet RoHS requirements
applications suppression Transient suppression dimensions construction
Bonding Wire Molded Resin Wafer Lead Molded Resin Bonding Wire Lead Wafer
Package Total Code Power 225mw 225mw 225mw
Pins
Dimensions inches (mm) ±0.2 ±0.2 ±0.1 ±0.1 ±0.2 .114 (2.90) .114 (2.90) .114 (2.90) .091 (2.30) .110 (2.80) .110 (2.80) .037 (0.95) .037 (0.95) .075 (1.90) .075 (1.90) .039 (1.0) .039 (1.0) .039 (1.0)
±0.05 .017 (0.43) .017 (0.43) .017 (0.43)
Bonding Wire Lead Wafer Molded Resin
circuit schematic
ordering information
Part Type Package Code From table above Lead Plating Packaging embossed plastic tape Voltage
further information packaging, please refer Appendix
Specifications given herein changed time without prior notice. Please confirm technical specifications before order and/or use. 1/08/06
Speer Electronics, Inc. Bolivar Drive Bradford, 16701 814-362-5536 Fax: 814-362-8883 www.koaspeer.com
circuit protection
bidirectional suppressor applications ratings
Part Designation
circuit protection
Diode Breakdown Voltage 5.1V
Leakage Current (Typ.) ±0.1uA@14V ±0.1uA@5V
Capacitance
Channel Clamp Voltage H.B.M. ±20V
Voltage Capability 61000-4-2 16kV 16kV
Peak Pulse Current 8/20us 5.1A
20pF 15pF
application schematic
Gnd. (Transient)
Transceiver
Connector
clamp
Specifications given herein changed time without prior notice. Please confirm technical specifications before order and/or use.
4/21/05
Speer Electronics, Inc. Bolivar Drive Bradford, 16701 814-362-5536 Fax: 814-362-8883 www.koaspeer.com

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