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applications suppression Transient suppression dimensions construction
Top Searches for this datasheetbidirectional suppressor features (16kV) 61000-4-2 rating Surface mount package High component density Products with lead-free terminations meet RoHS requirements applications suppression Transient suppression dimensions construction Bonding Wire Molded Resin Wafer Lead Molded Resin Bonding Wire Lead Wafer Package Total Code Power 225mw 225mw 225mw Pins Dimensions inches (mm) ±0.2 ±0.2 ±0.1 ±0.1 ±0.2 .114 (2.90) .114 (2.90) .114 (2.90) .091 (2.30) .110 (2.80) .110 (2.80) .037 (0.95) .037 (0.95) .075 (1.90) .075 (1.90) .039 (1.0) .039 (1.0) .039 (1.0) ±0.05 .017 (0.43) .017 (0.43) .017 (0.43) Bonding Wire Lead Wafer Molded Resin circuit schematic ordering information Part Type Package Code From table above Lead Plating Packaging embossed plastic tape Voltage further information packaging, please refer Appendix Specifications given herein changed time without prior notice. Please confirm technical specifications before order and/or use. 1/08/06 Speer Electronics, Inc. Bolivar Drive Bradford, 16701 814-362-5536 Fax: 814-362-8883 www.koaspeer.com circuit protection bidirectional suppressor applications ratings Part Designation circuit protection Diode Breakdown Voltage 5.1V Leakage Current (Typ.) ±0.1uA@14V ±0.1uA@5V Capacitance Channel Clamp Voltage H.B.M. ±20V Voltage Capability 61000-4-2 16kV 16kV Peak Pulse Current 8/20us 5.1A 20pF 15pF application schematic Gnd. (Transient) Transceiver Connector clamp Specifications given herein changed time without prior notice. Please confirm technical specifications before order and/or use. 4/21/05 Speer Electronics, Inc. Bolivar Drive Bradford, 16701 814-362-5536 Fax: 814-362-8883 www.koaspeer.com Other recent searchestfs460c - tfs460c tfs460c Datasheet Si4465DY - Si4465DY Si4465DY Datasheet MSC55 - MSC55 MSC55 Datasheet LA16B - LA16B LA16B Datasheet VY-S6 - VY-S6 VY-S6 Datasheet IN74ACT20 - IN74ACT20 IN74ACT20 Datasheet
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