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REJ03G1119-0500 (Previous: ADE-208-1490C) Rev.5.00 2005 on-resist
Top Searches for this datasheetH7N0203AB REJ03G1119-0500 (Previous: ADE-208-1490C) Rev.5.00 2005 on-resistance (on) =2.4 typ. drive current gate drive device driven from source Outline RENESAS Package code: PRSS0004AC-A (Package name: TO-220AB) Gate Drain (Flange) Source Rev.5.00 2005 page H7N0203AB Absolute Maximum Ratings 25°C) Item Drain source voltage Gate source voltage Drain current Drain peak current Body-drain diode reverse drain current Avalanche current Avalanche energy Channel dissipation Channel case thermal impedance Channel temperature Storage temperature Notes: duty cycle Value 25°C, Value 25°C Symbol VDSS VGSS (pulse) Note Value 1.25 +150 Unit °C/W Note ch-c Tstg Note Note Electrical Characteristics 25°C) Item Drain source breakdown voltage Gate source breakdown voltage Gate source leak current Zero gate voltage drain current Gate source cutoff voltage Static drain source state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate source charge Gate drain charge Turn-on delay time Rise time Turn-off delay time Fall time Body-drain diode forward voltage Body-drain diode reverse recovery time Note: Pulse test Symbol (BR) (BR) IGSS IDSS (off) (on) |yfs| Ciss Coss Crss (on) (off) 6800 1850 0.90 Unit Test Conditions ±100 Note Note 0.22 diF/dt A/µs Note Note Rev.5.00 2005 page H7N0203AB Main Characteristics Power Temperature Derating 1000 Maximum Safe Operation Area Operation 25°C) Channel Dissipation Drain Current Operation shot) this area limited (on) 0.03 25°C 0.01 Case Temperature (°C) Drain Source Voltage Typical Output Characteristics Pulse Test Typical Transfer Characteristics Pulse Test Drain Current Drain Current -25°C 75°C 25°C Drain Source Voltage Gate Source Voltage Drain Source Saturation Voltage Gate Source Voltage (on) (mV) Pulse Test Static Drain Source State Resistance Drain Current Drain Source State Resistance (on) Pulse Test Drain Source Voltage 1000 Gate Source Voltage Drain Current Rev.5.00 2005 page H7N0203AB Static Drain Source State Resistance Temperature Forward Transfer Admittance |yfs| Pulse Test 1000 -25°C Static Drain Source State Resistance (on) Forward Transfer Admittance Drain Current 75°C 25°C Pulse Test 0.01 Case Temperature (°C) Drain Current Typical Capacitance Drain Source Voltage 100000 50000 Dynamic Input Characteristics Capacitance (pF) 20000 10000 5000 2000 1000 Crss Coss Ciss Drain Source Voltage Drain Source Voltage Gate Charge (nc) Switching Characteristics 1000 Static Drain Source State Resistance Drain Current Reverse Recovery Time (ns) duty Switching Time (ns) td(off) td(on) 25°C Drain Current Drain Current Rev.5.00 2005 page Gate Source Voltage H7N0203AB Reverse Drain Current Source Drain Voltage Maximum Avalanche Energy Channel Temperature Derating Repetitive Avalanche Energy (mJ) duty Reverse Drain Current Pulse Test Source Drain Voltage VSDF Channel Temperature (°C) Normalized Transient Thermal Impedance Pulse Width Normalized Transient Thermal Impedance 25°C 1.25°C/W, 25°C 0.05 0.03 0.01 Pulse Width Avalanche Test Circuit Avalanche Waveform IAP2 VDSS VDSS V(BR)DSS Monitor Monitor D.U.T Rev.5.00 2005 page H7N0203AB Switching Time Test Circuit Switching Time Waveform Monitor D.U.T. Vout Monitor Vout td(on) td(off) Rev.5.00 2005 page H7N0203AB Package Dimensions JEITA Package Code SC-46 RENESAS Code PRSS0004AC-A Package Name TO-220AB TO-220ABV MASS[Typ.] 1.8g Unit: 11.5 2.79 10.16 -0.08 +0.2 -0.1 +0.1 4.44 1.26 0.15 18.5 15.0 1.27 0.76 14.0 2.54 2.54 Ordering Information Part Name Quantity Shipping Container H7N0203AB-E (Sack) Note: some grades, production terminated. Please contact Renesas sales office check state production before ordering product. Rev.5.00 2005 page Sales Strategic Planning Div. Keep safety first your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Renesas Technology Corp. puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. 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