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REJ03G1106-0200 (Previous: ADE-208-1375A) Rev.2.00 2005 on-resist
Top Searches for this datasheetH5N2504DL, H5N2504DS REJ03G1106-0200 (Previous: ADE-208-1375A) Rev.2.00 2005 on-resistance leakage current High speed switching gate charge Avalanche ratings Outline RENESAS Package code: PRSS0004ZD-B (Package name: DPAK (L)-(2) RENESAS Package code: PRSS0004ZD-C (Package name: DPAK Gate Drain Source Drain Rev.2.00 2005 page H5N2504DL, H5N2504DS Absolute Maximum Ratings 25°C) Item Drain source voltage Gate source voltage Drain current Drain peak current Body-drain diode reverse drain current Body-drain diode reverse drain peak current Avalanche current Channel dissipation Channel case thermal Impedance Channel temperature Storage temperature Notes: duty cycle Value 25°C 150°C Symbol VDSS VGSS (pulse) Note Value 4.17 +150 Unit °C/W (pulse) Note ch-c Tstg Note Note Electrical Characteristics 25°C) Item Drain source breakdown voltage Gate source leak current Zero gate voltage drain current Gate source cutoff voltage Static drain source state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate source charge Gate drain charge Body-drain diode forward voltage Body-drain diode reverse recovery time Body-drain diode reverse recovery charge Note: Pulse test Symbol (BR) IGSS IDSS (off) (on) (on) |yfs| Ciss Coss Crss (on) (off) 0.48 0.85 0.48 ±0.1 0.63 0.67 1.30 Unit Test Conditions Note Note 35.7 diF/dt A/µs Note Rev.2.00 2005 page H5N2504DL, H5N2504DS Main Characteristics Power Temperature Derating Maximum Safe Operation Area Channel Dissipation Drain Current Operation this area limited RDS(on) 0.03 25°C 0.01 1000 Case Temperature (°C) Drain Source Voltage Typical Output Characteristics Pulse Test Typical Transfer Characteristics Pulse Test Drain Current Drain Current 75°C 25°C -25°C Drain Source Voltage Gate Source Voltage Drain Source Saturation Voltage Gate Source Voltage Drain Source Saturation Voltage VDS(on) Pulse Test Static Drain Source State Resistance Drain Current Drain Source State Resistance RDS(on) Pulse Test Gate Source Voltage Drain Current Rev.2.00 2005 page H5N2504DL, H5N2504DS Static Drain Source State Resistance Temperature Forward Transfer Admittance |yfs| 75°C 0.02 0.05 Pulse Test 25°C -25°C Pulse Test Static Drain Source State Resistance RDS(on) Forward Transfer Admittance Drain Current Case Temperature (°C) Drain Current Body-Drain Diode Reverse Recovery Time 1000 Typical Capacitance Drain Source Voltage 5000 2000 Ciss Reverse Recovery Time (ns) 25°C Capacitance (pF) 1000 Coss Crss Reverse Drain Current Drain Source Voltage Dynamic Input Characteristics Switching Characteristics 1000 duty td(off) Drain Source Voltage Gate Source Voltage Switching Time (ns) td(on) Gate Charge (nC) Drain Current Rev.2.00 2005 page H5N2504DL, H5N2504DS Reverse Drain Current Source Drain Voltage Gate Source Cutoff Voltage VGS(off) Gate Source Cutoff Voltage Case Temperature Pulse Test Reverse Drain Current Source Drain Voltage Case Temperature (°C) Normalized Transient Thermal Impedance Pulse Width Normalized Transient Thermal Impedance 25°C 4.17°C/W, 25°C 0.05 0.03 0.02 0.01 0.01 Pulse Width Switching Time Test Circuit Waveform Monitor D.U.T. Vout Monitor Vout td(on) td(off) Rev.2.00 2005 page H5N2504DL, H5N2504DS Package Dimensions JEITA Package Code RENESAS Code PRSS0004ZD-B Package Name DPAK(L)-(2) DPAK(L)-(2)V MASS[Typ.] 0.42g Unit: 0.55 16.2 1.15 (0.7) 0.55 2.29 2.29 0.55 JEITA Package Code SC-63 RENESAS Code PRSS0004ZD-C Package Name DPAK(S) DPAK(S)V MASS[Typ.] 0.28g Unit: (0.1) (0.1) 0.55 (5.1) 0.25 (1.2) Max. 2.29 2.29 0.55 Rev.2.00 2005 page (5.1) H5N2504DL, H5N2504DS Ordering Information Part Name H5N2504DL-E H5N2504DSTL-E 3200 3000 Quantity (Sack) Taping Shipping Container Note: some grades, production terminated. Please contact Renesas sales office check state production before ordering product. Rev.2.00 2005 page Sales Strategic Planning Div. Keep safety first your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Renesas Technology Corp. puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. 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