Drawing updated reflect current requirements. footnote under paragraph
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REVISIONS DESCRIPTION Make changes IOUT, specified paragraph 1.4, table IIA, specified figure paragraph 4.1. DATE (YR-MO-DA) 00-08-01 APPROVED MONNIN
Drawing updated reflect current requirements. footnote under paragraph1.5 Table
02-04-30 05-06-15
MONNIN MONNIN
SHEET SHEET STATUS SHEETS PMIC SHEET PREPARED RICK OFFICER
STANDARD MICROCIRCUIT DRAWING
THIS DRAWING AVAILABLE DEPARTMENTS AGENCIES DEPARTMENT DEFENSE
CHECKED RAJESH PITHADIA
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil
APPROVED RAYMOND MONNIN
DRAWING APPROVAL DATE 00-06-20
MICROCIRCUIT, DIGITAL-LINEAR, RADIATION HARDENED, 8-CHANNEL SOURCE DRIVER, MONOLITHIC SILICON
AMSC
REVISION LEVEL
SIZE SHEET
CAGE CODE
67268
5962-00520
DSCC FORM 2233
5962-E325-05
SCOPE Scope. This drawing documents three product assurance class levels consisting high reliability (device classes space application (device class appropriate satellite similar applications (device class choice case outlines lead finishes available reflected Part Identifying Number (PIN). When available, choice Radiation Hardness Assurance (RHA) levels reflected PIN. device class user encouraged review manufacturer's Quality Management (QM) plan part their evaluation these parts their acceptability intended application. PIN. shown following example: 5962 00520
Federal stock class designator
designator (see 1.2.1)
Device type (see 1.2.2)
Device class designator (see 1.2.3)
Case outline (see 1.2.4)
Lead finish (see 1.2.5)
Drawing number
1.2.1 designator. Device classes marked devices meet MIL-PRF-38535 specified levels marked with appropriate designator. Device class marked devices meet MIL-PRF-38535, appendix specified levels marked with appropriate designator. dash indicates non-RHA device. 1.2.2 Device type(s). device type(s) identify circuit function follows: Device type Generic number IS-2981RH Circuit function Radiation hardened, 8-channel source driver
1.2.3 Device class designator. device class designator single letter identifying product assurance level follows: Device class Device requirements documentation Vendor self-certification requirements MIL-STD-883 compliant, nonJAN class level microcircuits accordance with MIL-PRF-38535, appendix Certification qualification MIL-PRF-38535 Certification qualification MIL-PRF-38535 with performance specified device manufacturers approved quality management plan.
1.2.4 Case outline(s). case outline(s) designated MIL-STD-1835 follows: Outline letter Descriptive designator CDIP2-T18 Terminals Package style Dual-in-line
1.2.5 Lead finish. lead finish specified MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
SIZE
REVISION LEVEL
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SHEET
Absolute maximum ratings. Supply voltage (VCC) Pulsed collector current (IOUT) -350 Time averaged collector current (IOUT) -300 Pulse output clamp diode current (IF) Time averaged output clamp diode current (IF) Input voltage (VIN) -0.3 maximum) Output voltage (VOUT) Maximum power dissipation (PD): driver, continuous Total package Soldering temperature Junction temperature (TJ) +260°C +175°C
Thermal resistance, junction-to-case (JC) 16°C/W Thermal resistance, junction-to-ambient (JA) 65°C/W Recommended operating conditions. Supply voltage (VCC) Operating ambient temperature range (TA) -55°C +125°C Radiation features. Maximum total dose available (dose rate rads(Si)/s) Krads (Si) Latch None
Stresses above absolute maximum rating cause permanent damage device. Extended operation maximum levels degrade performance affect reliability. Outputs paralleled increase drive currents. output momentarily -1.75 when output clamp diode activated with -200 clamp surge current. Based continuous output current maximum VCESAT Duration seconds maximum distance less than from device body lead shall resoldered until minutes have elapsed. These parts dose rate sensitive space environment demonstrate enhanced dose rate effects. Radiation point limits noted parameters guaranteed only conditions specified MIL-STD-883, method 1019, condition Guaranteed design process tested.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00520
SHEET
APPLICABLE DOCUMENTS Government specification, standards, handbooks. following specification, standards, handbooks form part this drawing extent specified herein. Unless otherwise specified, issues these documents those cited solicitation contract. DEPARTMENT DEFENSE SPECIFICATION MIL-PRF-38535 Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines.
DEPARTMENT DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 List Standard Microcircuit Drawings. Standard Microcircuit Drawings.
(Copies these documents available online http://assist.daps.dla.mil from Standardization Document Order Desk, Robbins Avenue, Building Philadelphia, 19111-5094.) Order precedence. event conflict between text this drawing references cited herein, text this drawing takes precedence. Nothing this document, however, supersedes applicable laws regulations unless specific exemption been obtained.
REQUIREMENTS Item requirements. individual item requirements device classes shall accordance with MIL-PRF-38535 specified herein modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. individual item requirements device class shall accordance with MIL-PRF-38535, appendix non-JAN class level devices specified herein. 3.1.1 Microcircuit die. requirements microcircuit die, appendix this document. Design, construction, physical dimensions. design, construction, physical dimensions shall specified MIL-PRF-38535 herein device classes MIL-PRF-38535, appendix herein device class 3.2.1 Case outline. case outline shall accordance with 1.2.4 herein. 3.2.2 Terminal connections. terminal connections shall specified figure 3.2.3 Test circuits. test circuits shall specified figure 3.2.4 Timing test circuit waveform. timing circuit waveform shall specified figure 3.2.5 Radiation exposure circuit. radiation exposure circuit shall specified figure Electrical performance characteristics postirradiation parameter limits. Unless otherwise specified herein, electrical performance characteristics postirradiation parameter limits specified table shall apply over full ambient operating temperature range. Electrical test requirements. electrical test requirements shall subgroups specified table IIA. electrical tests each subgroup defined table
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00520
SHEET
TABLE Electrical performance characteristics. Conditions -55°C +125°C unless otherwise specified Output leakage current (see figure ICEX 0.25 VOUT under test Collector-emitter saturation voltage (see figure VCESAT IOUT -350 pulsed tested M,D,P,L,R Input current (outputs open) (see figure IIN(ON) 3.85 IIN(OFF) Output source current (see figure Supply current (outputs open) (see figure Clamp diode leakage current (see figure Clamp diode forward voltage (see figure inputs simultaneously VOUT open open footnotes table -1.75 1,2,3 1,2,3 1,2,3 1,2,3
Test
Symbol
Group subgroups
Device type
Limits
Unit
IOUT
1,2,3
-350
1,2,3
1,2,3
1,2,3
-1.5
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00520
SHEET
TABLE Electrical performance characteristics Continued. Conditions -55°C +125°C unless otherwise specified Turn-on delay time Turn-off delay time tPLH tPHL figure figure 9,10,11 9,10,11
Test
Symbol
Group subgroups
Device type
Limits
Unit
Devices supplied this drawing have been characterized through levels irradiation. However, this device only tested level. Post irradiation values identical unless otherwise specified Table When performing post irradiation electrical measurements level, +25°C.
These parts dose rate sensitive space environment demonstrate enhanced dose rate effects. Radiation point limits noted parameters guaranteed only conditions specified MIL-STD-883, method 1019, condition tested, shall guaranteed limits specified table herein.
Marking. part shall marked with listed herein. addition, manufacturer's also marked. packages where marking entire number feasible space limitations, manufacturer option marking "5962-" device. product using this option, designator shall still marked. Marking device classes shall accordance with MIL-PRF-38535. Marking device class shall accordance with MIL-PRF-38535, appendix 3.5.1 Certification/compliance mark. certification mark device classes shall "QML" required MIL-PRF-38535. compliance mark device class shall required MIL-PRF-38535, appendix Certificate compliance. device classes certificate compliance shall required from QML-38535 listed manufacturer order supply requirements this drawing (see 6.6.1 herein). device class certificate compliance shall required from manufacturer order listed approved source supply MIL-HDBK-103 (see 6.6.2 herein). certificate compliance submitted DSCC-VA prior listing approved source supply this drawing shall affirm that manufacturer's product meets, device classes requirements MIL-PRF-38535 herein device class requirements MIL-PRF-38535, appendix herein. Certificate conformance. certificate conformance required device classes MIL-PRF-38535 device class MIL-PRF-38535, appendix shall provided with each microcircuits delivered this drawing. Notification change device class device class notification DSCC-VA change product (see herein) involving devices acquired this drawing required change that affects this drawing. Verification review device class device class DSCC, DSCC's agent, acquiring activity retain option review manufacturer's facility applicable required documentation. Offshore documentation shall made available onshore option reviewer. 3.10 Microcircuit group assignment device class Device class devices covered this drawing shall microcircuit group number (see MIL-PRF-38535, appendix
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
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Device type Case outline Terminal number
Terminal symbol INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT
FIGURE Terminal connections.
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FIGURE Test circuits.
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FIGURE Timing test circuit waveform.
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DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
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16.9 16.9
FIGURE Radiation hardened exposure circuit.
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VERIFICATION Sampling inspection. device classes sampling inspection procedures shall accordance with MIL-PRF-38535 modified device manufacturer's Quality Management (QM) plan, including screening (4.2), qualification (4.3), conformance inspection (4.4). modification plan shall affect form, fit, function described herein. device class sampling inspection procedures shall accordance with MIL-PRF-38535 device manufacturer's plan including screening, qualification, conformance inspection. performance envelope reliability information shall specified manufacturer's plan. device class sampling inspection procedures shall accordance with MIL-PRF-38535, appendix Screening. device classes screening shall accordance with MIL-PRF-38535, shall conducted devices prior qualification technology conformance inspection. device class screening shall accordance with method 5004 MIL-STD-883, shall conducted devices prior quality conformance inspection. device class screening shall accordance with device manufacturer's Quality Management (QM) plan, shall conducted devices prior qualification technology conformance inspection. 4.2.1 Additional criteria device class Burn-in test, method 1015 MIL-STD-883. Test condition test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified method 1015. +125°C, minimum. Interim final electrical test parameters shall specified table herein.
4.2.2 Additional criteria device classes burn-in test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. burn-in test circuit shall maintained under document revision level control device manufacturer's Technology Review Board (TRB) accordance with MIL-PRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified method 1015 MIL-STD-883. device classes interim final electrical test parameters shall specified table herein. Additional screening device class beyond requirements device class shall specified MIL-PRF-38535, appendix
Qualification inspection device classes Qualification inspection device classes shall accordance with MIL-PRF-38535. Qualification inspection device class shall accordance with device manufacturer's Quality Management (QM) plan. Inspections performed shall those specified MIL-PRF-38535 herein groups inspections (see 4.4.1 through 4.4.4). Conformance inspection. Technology conformance inspection classes shall accordance with MIL-PRF-38535 including groups inspections specified herein. Quality conformance inspection device class shall accordance with MIL-PRF-38535, appendix specified herein. Inspections performed device class shall those specified method 5005 MIL-STD-883 herein groups inspections (see 4.4.1 through 4.4.4). Technology conformance inspection class shall accordance with device manufacturer's Quality Management (QM) plan. 4.4.1 Group inspection. Tests shall specified table herein. Subgroups table method 5005 MIL-STD-883 shall omitted.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
SIZE
REVISION LEVEL
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TABLE IIA. Electrical test requirements. Test requirements Subgroups accordance with MIL-STD-883, method 5005, table Device class Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group test requirements (see 4.4) Group end-point electrical parameters (see 4.4) Group end-point electrical parameters (see 4.4) Group end-point electrical parameters (see 4.4) 1,2,3,9,10,11 1,2,3,9,10,11 1,2,3,9,10,11 1,2,3,9, 10,11 1,2,3,9,10,11 1,2,3,9,10,11 Device class 1,2,3,9, 10,11 1,2,3,9,10,11 1,2,3,9, 10,11 Subgroups accordance with MIL-PRF-38535, table III) Device class Device class specified plan specified plan specified plan specified plan specified plan specified plan
applies subgroup applies subgroups deltas. Delta limits specified table shall required where specified, delta limits shall completed with reference zero hour electrical parameters (see table
TABLE IIB. Burn-in operating life test, delta parameters (+25°C). Test Symbol Conditions Supply current Input current IIN(ON) Limits ±100 Unit
These parameters shall recorded before after required burn-in life test determine delta limits.
4.4.2 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.2.1 Additional criteria device class Steady-state life test conditions, method 1005 MIL-STD-883: Test condition test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified method 1005 MILSTD-883. +125°C, minimum. Test duration: 1,000 hours, except permitted method 1005 MIL-STD-883.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00520
SHEET
4.4.2.2 Additional criteria device classes steady-state life test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF38535. test circuit shall maintained under document revision level control device manufacturer's accordance with MIL-PRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified method 1005 MIL-STD-883. 4.4.3 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.4 Group inspection. Group inspection required only parts intended marked radiation hardness assured (see herein). levels device classes shall specified MIL-PRF-38535. End-point electrical parameters shall specified table herein. 4.4.4.1 Group inspection device class device class requirements shall accordance with class radiation requirements MIL-PRF-38535. End-point electrical parameters shall specified table herein. 4.4.4.1.1 Accelerated aging test. Accelerated aging tests shall performed devices requiring level greater than rads(Si). post-anneal end-point electrical parameter limits shall specified table herein shall preirradiation end-point electrical parameter limit 25°C ±5°C. Testing shall performed initial qualification after design process changes which affect response device. 4.4.4.2 Total dose irradiation testing. Total dose irradiation testing shall performed accordance with MIL-STD-883 method 1019, condition specified herein. device class total dose requirements shall accordance with class radiation requirements MIL-PRF-38535. 4.4.4.3 Dose rate induced latchup testing. Dose rate induced latchup testing shall performed accordance with test method 1020 MIL-STD-883 specified herein (see herein). Tests shall performed devices, SEC, approved test structures technology qualification after design process changes which effect capability process.
PACKAGING Packaging requirements. requirements packaging shall accordance with MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class
NOTES Intended use. Microcircuits conforming this drawing intended Government microcircuit applications (original equipment), design applications, logistics purposes. 6.1.1 Replaceability. Microcircuits covered this drawing will replace same generic device covered contractor prepared specification drawing. 6.1.2 Substitutability. Device class devices will replace device class devices. Configuration control SMD's. proposed changes existing SMD's will coordinated with users record individual documents. This coordination will accomplished using Form 1692, Engineering Change Proposal. Record users. Military industrial users should inform Defense Supply Center Columbus when system application requires configuration control which SMD's applicable that system. DSCC will maintain record users this list will used coordination distribution changes drawings. Users drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. Comments. Comments this drawing should directed DSCC-VA, Columbus, Ohio 43218-3990, telephone (614) 692-0547. Abbreviations, symbols, definitions. abbreviations, symbols, definitions used herein defined MIL-PRF-38535 MIL-HDBK-1331.
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Sources supply. 6.6.1 Sources supply device classes Sources supply device classes listed QML38535. vendors listed QML-38535 have submitted certificate compliance (see herein) DSCC-VA have agreed this drawing. 6.6.2 Approved sources supply device class Approved sources supply class listed MIL-HDBK-103. vendors listed MIL-HDBK-103 have agreed this drawing certificate compliance (see herein) been submitted accepted DSCC-VA.
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APPENDIX APPENDIX FORMS PART 5962-00520
SCOPE A.1.1 Scope. This appendix establishes minimum requirements microcircuit supplied under Qualified Manufacturers List (QML) Program. microcircuit meeting requirements MIL-PRF-38535 manufacturers approved plan monolithic microcircuits, multi-chip modules (MCMs), hybrids, electronic modules, devices using chip wire designs accordance with MIL-PRF-38534 specified herein. product assurance classes consisting military high reliability (device class space application (device class reflected Part Identification Number (PIN). When available, choice Radiation Hardiness Assurance (RHA) levels reflected PIN. A.1.2 PIN. shown following example: 5962 00520
Federal stock class designator
designator (see A.1.2.1) Drawing number
Device type (see A.1.2.2)
Device class designator (see A.1.2.3)
code
details (see A.1.2.4)
A.1.2.1 designator. Device classes identified meet MIL-PRF-38535 specified levels. dash indicates non-RHA die. A.1.2.2 Device type(s). device type(s) identify circuit function follows: Device type A.1.2.3 Device class designator. Device class Device requirements documentation Certification qualification requirements MIL-PRF-38535 Generic number IS-2981RH Circuit function Radiation hardened 8-channel source driver
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00520
SHEET
APPENDIX APPENDIX FORMS PART 5962-00520
A.1.2.4 details. details designation unique letter which designates die's physical dimensions, bonding location(s) related electrical function(s), interface materials, other assembly related information, each product variant supplied this appendix. A.1.2.4.1 physical dimensions. type Figure number
A.1.2.4.2 bonding locations electrical functions. type A.1.2.4.3 Interface materials. type A.1.2.4.4 Assembly related information. type A.1.3 Absolute maximum ratings. paragraph herein details. A.1.4 Recommended operating conditions. paragraph herein details. Figure number Figure number Figure number
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00520
SHEET
APPENDIX APPENDIX FORMS PART 5962-00520
APPLICABLE DOCUMENTS. A.2.1 Government specification, standards, handbooks. following specification, standards, handbooks form part this drawing extent specified herein. Unless otherwise specified, issues these documents those cited solicitation contract. DEPARTMENT DEFENSE SPECIFICATION MIL-PRF-38535 Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT DEFENSE STANDARD MIL-STD-883 Test Method Standard Microcircuits. DEPARTMENT DEFENSE HANDBOOKS MIL-HDBK-103 List Standard Microcircuit Drawings. MIL-HDBK-780 Standard Microcircuit Drawings. (Copies these documents available online http://assist.daps.dla.mil from Standardization Document Order Desk, Robbins Avenue, Building Philadelphia, 19111-5094.) A.2.2 Order precedence. event conflict between text this drawing references cited herein, text this drawing takes precedence. Nothing this document, however, supersedes applicable laws regulations unless specific exemption been obtained. REQUIREMENTS A.3.1 Item requirements. individual item requirements device classes shall accordance with MIL-PRF-38535 specified herein modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. A.3.2 Design, construction physical dimensions. design, construction, physical dimensions shall specified MIL-PRF-38535 herein manufacturer's plan device classes A.3.2.1 physical dimensions. physical dimensions shall specified A.1.2.4.1 figure A-1. A.3.2.2 bonding locations electrical functions. bonding locations electrical functions shall specified A.1.2.4.2 figure A-1. A.3.2.3 Interface materials. interface materials shall specified A.1.2.4.3 figure A-1. A.3.2.4 Assembly related information. assembly related information shall specified A.1.2.4.4 figure A-1. A.3.2.5 Test circuits. test circuits shall defined paragraph 3.2.3 herein. A.3.2.6 Radiation exposure circuit. radiation exposure circuit shall defined paragraph 3.2.5 herein.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
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APPENDIX APPENDIX FORMS PART 5962-00520
A.3.3 Electrical performance characteristics post-irradiation parameter limits. Unless otherwise specified herein, electrical performance characteristics post-irradiation parameter limits specified table body this document. A.3.4 Electrical test requirements. wafer probe test requirements shall include functional parametric testing sufficient make packaged capable meeting electrical performance requirements table A.3.5 Marking. minimum, each unique die, loaded single multiple stack carriers, shipment customer, shall identified with wafer number, certification mark, manufacturer's identification listed A.1.2 herein. certification mark shall "QML" required MIL-PRF-38535. A.3.6 Certification compliance. device classes certificate compliance shall required from QML-38535 listed manufacturer order supply requirements this drawing (see A.6.4 herein). certificate compliance submitted DSCC-VA prior listing approved source supply this appendix shall affirm that manufacturer's product meets, device classes requirements MIL-PRF-38535 requirements herein. A.3.7 Certificate conformance. certificate conformance required device classes MIL-PRF-38535 shall provided with each microcircuit delivered this drawing. VERIFICATION A.4.1 Sampling inspection. device classes sampling inspection procedures shall accordance with MIL-PRF-38535 modified device manufacturer's Quality Management (QM) plan. modifications plan shall affect form, fit, function described herein. A.4.2 Screening. device classes screening shall accordance with MIL-PRF-38535, defined manufacturer's plan. minimum, shall consist Wafer acceptance class product using criteria defined MIL-STD-883, method 5007. 100% wafer probe (see paragraph A.3.4 herein). 100% internal visual inspection applicable class criteria defined MIL-STD-883, method 2010 alternate procedures allowed MIL-STD-883, method 5004.
A.4.3 Conformance inspection. A.4.3.1 Group inspection. Group inspection required only parts intended identified radiation assured (see A.3.5 herein). levels device classes shall specified MIL-PRF-38535. point electrical testing packaged shall specified table herein. Group tests conditions specified paragraphs 4.4.4.1, 4.4.4.1.1, 4.4.4.2, 4.4.4.3 herein. CARRIER A.5.1 carrier requirements. requirements carrier shall accordance with manufacturer's plan specified purchase order acquiring activity. carrier shall provide adequate physical, mechanical electrostatic protection.
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APPENDIX APPENDIX FORMS PART 5962-00520
NOTES A.6.1 Intended use. Microcircuit conforming this drawing intended microcircuits built accordance with MIL-PRF-38535 MIL-PRF-38534 government microcircuit applications (original equipment), design applications, logistics purposes. A.6.2 Comments. Comments this appendix should directed DSCC-VA, Columbus, Ohio, 43218-3990 telephone (614)-692-0547. A.6.3 Abbreviations, symbols, definitions. abbreviations, symbols, definitions used herein defined MIL-PRF-38535 MIL-HDBK-1331. A.6.4 Sources supply device classes Sources supply device classes listed QML-38535. vendors listed within QML-38535 have submitted certificate compliance (see A.3.6 herein) DSCC-VA have agreed this drawing.
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APPENDIX APPENDIX FORMS PART 5962-00520
bonding locations electrical functions physical dimensions. size: 2660 5120 microns thickness: mils Interface materials. metallization: Al/Cu 16.0 ±2.0 Backside metallization: None Glassivation. Type: Nitride (Si3N4) over Silox (SiO2) Thickness: Nitride ±1.0 Substrate: HVTDLM, bonded wafer, dielectric isolation Assembly related information. Substrate potential: Must tied GND. Special assembly instructions: Bond four locations current sharing purposes. Bond both locations current sharing purposes. used applications. backside must connected GND. FIGURE A-1. bonding locations electrical functions.
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STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 05-06-15 Approved sources supply 5962-00520 listed below immediate acquisition information only shall added MIL-HDBK-103 QML-38535 during next revision. MIL-HDBK-103 QML-38535 will revised include addition deletion sources. vendors listed below have agreed this drawing certificate compliance been submitted accepted DSCC-VA. This information bulletin superseded next dated revision MIL-HDBK-103 QML-38535. DSCC maintains online database current sources supply
Standard microcircuit drawing 5962R0052001QVC 5962R0052001TVC 5962R0052001VVC 5962R0052001V9A
Vendor CAGE number 34371 34371 34371 34371
Vendor similar IS1-2981RH-8 IS1-2981RH-T IS1-2981RH-Q IS0-2981RH-Q
lead finish shown each representing hermetic package most readily available from manufacturer listed that part. desired lead finish listed contact vendor determine availability. Caution. this number item acquisition. Items acquired this number satisfy performance requirements this drawing.
Vendor CAGE number 34371
Vendor name address Intersil Corporation 2401 Palm Blvd. P.O. Melbourne, 32902-0883
information contained herein disseminated convenience only Government assumes liability whatsoever inaccuracies information bulletin.
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