Shrink Dual Inline Package (SDIP) Part Number (Details) IC76
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IC76 Series
Shrink Dual Inline Package (SDIP)
Part Number (Details)
IC76
Series Housing Material (12=PSF, PES) Contact Pins Space inches) Contact Plating Gold Plating) Straight, Through Hole Type Flanged Unmarked Flanged
1,000M min. 500V Insulation Resistance: Dielectric Withstanding Voltage: 700V minute max. 10mA/20mV max. Contact Resistance: max. Current Rating: Operating Temperature Range: -40°C +150°C cont. (IC7612) -40°C +170°C cont. (IC7620) Mating Cycles: 25,000 50,000 insertions
Materials Finish
Housing: Polysulphone (PSF), glass-filled UL94V-0 rated Polyethersulphone (PES), glass-filled UL94V-0 rated Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel
Features
Shrink pitch (1.778mm) sockets high-density mounting Dual wipe contacts ensure high reliability
Applicable Dimensions (Reference Only)
Outline Socket Dimensions Recommended Board Layout
View from Socket
1.778
Count
(Contact pos.)
Spot facing (6.2, deep)
1.778
14.5
Part Number
IC76**-2003-G4 IC76**-2006-G4 IC76**-2203-G4 IC76**-2403-G4 IC76**-2804-G4 IC76**-3004-G4 IC76**-4006-G4 IC76**-4206-G4 IC76**-4806-G4 IC76**-5206-G4 IC76**-64075-G4**
Count
20.0 19.5 22.0 24.0 27.5 29.0 38.0 39.5 45.0 48.5 59.5
1.778 16.002 1.778 16.002 1.778 17.78 1.778 19.558 1.778 23.114 1.778 24.892 1.778 33.782 1.778 35.56 1.778 40.894 1.778 44.45 1.778 55.118
17.0 24.6 17.0 17.0 19.5 19.5 24.6 24.6 24.6 24.6 28.4
15.9 10.8 10.8 15.9 15.9 15.9 15.9 19.7
11.8
10.3 10.3 10.3 10.3 10.3 13.7
11.4 19.0 11.4 11.4 13.9 13.9 19.0 19.0 19.0 19.0 22.8
25.5 25.5 26.0 28.0 29.5
23.0 30.6 23.0 23.0 25.5 25.5 30.6 30.6 30.6 30.6 38.2
11.0 11.0 11.0 13.0 16.5 16.5 25.5 25.5 26.0 28.0 29.5
YAMAICHI ELECTRONICS
Munich 45109-0
SPECIFICATIONS SUBJECT ALTERATION WITHOUT PRIOR NOTICE DIMENSIONS MILLIMETER
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