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REJ03G0367-0100 Rev.1.00 2004 reverse voltage drop suitable high
Top Searches for this datasheetHRL0103C REJ03G0367-0100 Rev.1.00 2004 reverse voltage drop suitable high efficiency reverse current. Extremely small Flat Package (EFP) suitable surface mount design. Ordering Information Type HRL0103C Laser Mark Package Code Arrangement Cathode mark Mark Cathode Anode Rev.1.00 2004 page HRL0103C Absolute Maximum Ratings 25°C) Item Peak reverse voltage Reverse voltage Average rectified current Peak forward surge current Non-Repetitive peak forward surge current Junction temperature Storage temperature Notes: from Fig.3 Fig.5. sine wave pulse. Symbol Value +125 Unit IFSM Tstg Electrical Characteristics 25°C) Item Forward voltage Reverse current Capacitance Thermal resistance Symbol Rth(j-a) 0.40 0.60 Unit °C/W Test Condition Polyimide board Notes: Polyimide board Unit: Please soldering iron avoid high stress package. material lead exposed cutting plane. There for, soldering nature lead part considered unquestioned. Please kindly consider soldering nature. Rev.1.00 2004 page HRL0103C Main Characteristic Pulse test 10-1 75°C 10-3 Pulse test 10-4 Reverse current 75°C Forward current 10-2 10-3 25°C 50°C 10-6 25°C 10-5 10-7 10-6 10-8 Forward voltage Fig.1 Forward current Forward voltage 0.12 Reverse voltage Fig.2 Reverse current Reverse voltage 0.030 Reverse power dissipation Forward power dissipation 0.10 D=1/6 sin(=180°) D=1/3 D=1/2 0.025 125°C D=5/6 25°C 0.08 0.020 D=1/3 0.06 0.015 D=1/2 0.04 0.010 sin(=180°) 0.02 0.005 0.05 0.10 0.15 Forward current Fig3. Forward power dissipation Forward current Reverse voltage Fig4. Reverse power dissipation Reverse voltage Rev.1.00 2004 page HRL0103C Average rectified current (mA) VR=VRRM/2 =125°C Rth(j-a)=800°C/W D=1/2 sin(=180°) D=1/3 D=1/6 Ambient temperature (°C) Fig.5 Average rectified current Ambient temperature Rev.1.00 2004 page HRL0103C Package Dimensions January, 2003 Unit: 0.05 0.05 0.13 0.05 0.47± 0.03 0.05 0.05 Package Code JEDEC JEITA Mass (reference value) 0.0007 Rev.1.00 2004 page Sales Strategic Planning Div. Keep safety first your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Renesas Technology Corp. puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. 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