REJ03G0070-0100Z (Previous: ADE-208-1614) Rev.1.00 Aug.29.2003 re

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REJ03G0070-0100Z (Previous: ADE-208-1614) Rev.1.00 Aug.29.2003 re

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HRD0103C
REJ03G0070-0100Z (Previous: ADE-208-1614) Rev.1.00 Aug.29.2003
reverse voltage drop suitable high efficiency reverse current. Super small Flat Package (SFP) suitable surface mount design.
Ordering Information
Type HRD0103C Laser Mark Package Code
Arrangement
Cathode mark Mark
Cathode Anode
Rev.1.00, Aug.29.2003, page
HRD0103C
Absolute Maximum Ratings
25°C)
Item Peak reverse voltage Reverse voltage Average rectified current Peak forward surge current Non-Repetitive peak forward surge current Junction temperature Storage temperature Notes: from Fig.3 Fig.5. sine wave pulse. Symbol
Value +125
Unit
IFSM
Tstg
Electrical Characteristics
25°C)
Item Forward voltage Symbol Reverse current Capacitance Thermal resistance Note: Rth(j-a) °C/W Unit Test Condition Polyimide board
Polyimide board
Unit:
Please soldering iron avoid high stress package.
Rev.1.00, Aug.29.2003, page
HRD0103C
Main Characteristics
Pulse test 10-1
75°C
10-3 Pulse test 10-4
Reverse current
75°C
Forward current
10-2
10-3
25°C
50°C
10-6
25°C
10-5
10-7
10-6
10-8
Forward voltage Fig.1 Forward current Forward voltage 0.12 0.030
Reverse voltage Fig.2 Reverse current Reverse voltage
0.10
Reverse power dissipation
Forward power dissipation
D=1/6 sin(=180°) D=1/3 D=1/2
0.025
125°C
D=5/6
0.08
25°C
0.020
D=2/3
0.06
0.015
D=1/2
0.04
0.010
sin(=180°)
0.02
0.005
0.05
0.10
0.15
Forward current Fig3. Forward power dissipation Forward current
Reverse voltage Fig4. Reverse power dissipation Reverse voltage
Rev.1.00, Aug.29.2003, page
HRD0103C
Average rectified current (mA)
VR=VRRM/2 =125°C Rth(j-a)=600°C/W
D=1/2 sin(=180°)
D=1/3 D=1/6
Ambient temperature (°C) Fig.5 Average rectified current Ambient temperature
Rev.1.00, Aug.29.2003, page
HRD0103C
Package Dimensions
January, 2003
Unit:
0.10 0.10
0.13 0.05
0.55
0.05 0.05
Package Code JEDEC JEITA Mass (reference value)
0.0010
Rev.1.00, Aug.29.2003, page
Sales Strategic Planning Div.
Keep safety first your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Renesas Technology Corporation puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap.
Notes regarding these materials
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