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Cautions Keep safety first your circuit designs! Renesas Technolo
Top Searches for this datasheetCautions Keep safety first your circuit designs! Renesas Technology Corporation puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap. Notes regarding these materials These materials intended reference assist customers selection Renesas Technology Corporation product best suited customer's application; they convey license under intellectual property rights, other rights, belonging Renesas Technology Corporation third party. 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Edition 2002 Features on-resistance RDS(on) typ. gate drive devices High Speed Switching Outline LDPAK H7N0401LS H7N0401LM H7N0401LD Gate Drain Source Drain H7N0401LD, H7N0401LS, H7N0401LM Absolute Maximum Ratings 25°C) Item Drain source voltage Gate source voltage Drain current Drain peak current Body-drain diode reverse drain current Avalanche current Avalanche energy Channel dissipation Channel temperature Storage temperature Symbol VDSS VGSS (pulse) Note3 Note1 Ratings Unit Note3 PchNote Tstg +150 Notes: duty cycle Value 25°C Value 25°C, Rev.3, 2002, page H7N0401LD, H7N0401LS, H7N0401LM Electrical Characteristics 25°C) Item Drain source breakdown voltage Zero gate voltage drain current Gate source leak current Gate source cutoff voltage Forward transfer admittance Static drain source state resistance Static drain source state resistance Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate source charge Gate drain charge Turn-on delay time Rise time Turn-off delay time Fall time Symbol V(BR)DSS IDSS IGSS VGS(off) |yfs| RDS(on) RDS(on) Ciss Coss Crss td(on) td(off) 9300 1300 0.95 ±0.1 Unit Test Conditions mANote 47.5 VNote 47.5 VGS= VNote 47.5 VGS=4.5 VNote 47.5 0.63 diF/dt 100A/µs Body-drain diode forward voltage Body-drain diode reverse recovery time Notes: Pulse test Rev.3, 2002, page H7N0401LD, H7N0401LS, H7N0401LM Main Characteristics Power Temperature Derating Maximum Safe Operation Area 1000 Drain Current Channel Dissipation this area Operation limited RDS(on) (°C) 25°C Case Temperature Drain Source Voltage Typical Output Characteristics Typical Transfer Characteristics Pulse Test Pulse Test Drain Current Drain Current Drain Source Voltage 75°C 25°C -25°C Gate Source Voltage Rev.3, 2002, page H7N0401LD, H7N0401LS, H7N0401LM Drain Source Saturation Voltage Gate Source Voltage Static Drain Source State Resistance Drain Current Pulse Test Drain Source Saturation Voltage VDS(on) Pulse Test Drain Source State Resistance RDS(on) Gate Source Voltage 1000 Drain Current Drain Source State Resistance RDS(on) Forward Transfer Admittance |yfs| Static Drain Source State Resistance Temperature Pulse Test Forward Transfer Admittance Drain Current 1000 Pulse Test 1000 25°C 75°C -25°C (°C) Case Temperature Drain Current Rev.3, 2002, page H7N0401LD, H7N0401LS, H7N0401LM Body-Drain Diode Reverse Recovery Time 25°C Typical Capacitance Drain Source Voltage 1000 Reverse Recovery Time (ns) 30000 Capacitance (pF) 10000 Ciss 3000 1000 Coss Crss Reverse Drain Current Drain Source Voltage Dynamic Input Characteristics Switching Characteristics 1000 Switching Time (ns) duty Drain Source Voltage Gate Source Voltage d(off) d(on) Gate Charge (nc) Drain Current Rev.3, 2002, page H7N0401LD, H7N0401LS, H7N0401LM Reverse Drain Current Source Drain Voltage Repetitive Avalanche Energy (mJ) Maximum Avalanche Energy Channel Temperature Derating duty Reverse Drain Current Pulse Test Source Drain Voltage Channel Temperature (°C) Avalanche Test Circuit Avalanche Waveform VDSS VDSS Monitor Monitor (BR)DSS Rev.3, 2002, page H7N0401LD, H7N0401LS, H7N0401LM Normalized Transient Thermal Impedance Pulse Width Normalized Transient Thermal Impedance 25°C 0.05 c(t) 1.25°C/ 25°C 0.03 0.01 Pulse Width Switching Time Test Circuit Waveform Monitor D.U.T. Vout Monitor Vout td(on) td(off) Rev.3, 2002, page H7N0401LD, H7N0401LS, H7N0401LM Package Dimensions January, 2002 Unit: (1.4) 4.44 0.15 10.2 11.3 10.0 1.27 0.86 0.76 2.54 2.54 11.0 2.59 Hitachi Code JEDEC JEITA Mass (reference value) LDPAK Rev.3, 2002, page H7N0401LD, H7N0401LS, H7N0401LM January, 2002 Unit: 4.44 10.2 (1.4) 10.0 (1.5) (1.5) 1.27 2.54 0.86 2.54 Hitachi Code JEDEC JEITA Mass (reference value) LDPAK (S)-(1) January, 2002 Unit: 4.44 10.2 (1.4) 10.0 (1.5) (2.3) 1.27 2.54 0.86 2.54 Hitachi Code JEDEC JEITA Mass (reference value) LDPAK (S)-(2) 1.35 Rev.3, 2002, page 0.15 H7N0401LD, H7N0401LS, H7N0401LM Disclaimer Hitachi neither warrants grants licenses rights Hitachi's third party's patent, copyright, trademark, other intellectual property rights information contained this document. Hitachi bears responsibility problems that arise with third party's rights, including intellectual property rights, connection with information contained this document. Products product specifications subject change without notice. Confirm that have received latest product standards specifications before final design, purchase use. Hitachi makes every attempt ensure that products high quality reliability. However, contact Hitachi's sales office before using product application that demands especially high quality reliability where failure malfunction directly threaten human life cause risk bodily injury, such aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment medical equipment life support. Design your application that product used within ranges guaranteed Hitachi particularly maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions other characteristics. Hitachi bears responsibility failure damage when used beyond guaranteed ranges. Even within guaranteed ranges, consider normally foreseeable failure rates failure modes semiconductor devices employ systemic measures such failsafes, that equipment incorporating Hitachi product does cause bodily injury, fire other consequential damage operation Hitachi product. This product designed radiation resistant. permitted reproduce duplicate, form, whole part this document without written approval from Hitachi. Contact Hitachi's sales office questions regarding this document Hitachi semiconductor products. Sales Offices Hitachi, Ltd. Semiconductor Integrated Circuits Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: (03) 3270-2111 Fax: (03) 3270-5109 further information write Hitachi Semiconductor (America) Inc. East Tasman Drive Jose,CA 95134 Tel: (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe Ltd. Electronic Components Group Whitebrook Park Lower Cookham Road Maidenhead Berkshire 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 585200 Hitachi Europe GmbH Electronic Components Group Dornacher D-85622 Feldkirchen Postfach 201, D-85619 Feldkirchen Germany Tel: <49> (89) 9180-0 Fax: <49> (89) Hitachi Asia Ltd. Hitachi Tower Collyer Quay #20-00 Singapore 049318 <65>-6538-6533/6538-8577 <65>-6538-6933/6538-3877 Hitachi Asia Ltd. (Taipei Branch Office) 4/F, 167, North Road Hung-Kuo Building Taipei (105), Taiwan <886>-(2)-2718-3666 <886>-(2)-2718-8180 Telex 23222 HAS-TP http://www.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group (Electronic Components) 7/F., North Tower World Finance Centre, Harbour City, Canton Road Tsim Tsui, Kowloon Hong Kong <852>-2735-9218 <852>-2730-0281 Copyright Hitachi, Ltd., 2002. rights reserved. Printed Japan. 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