Cautions Keep safety first your circuit designs! Renesas Technolo

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Cautions Keep safety first your circuit designs! Renesas Technolo

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Cautions
Keep safety first your circuit designs! Renesas Technology Corporation puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap. Notes regarding these materials These materials intended reference assist customers selection Renesas Technology Corporation product best suited customer's application; they convey license under intellectual property rights, other rights, belonging Renesas Technology Corporation third party. Renesas Technology Corporation assumes responsibility damage, infringement third-party's rights, originating product data, diagrams, charts, programs, algorithms, circuit application examples contained these materials. information contained these materials, including product data, diagrams, charts, programs algorithms represents information products time publication these materials, subject change Renesas Technology Corporation without notice product improvements other reasons. therefore recommended that customers contact Renesas Technology Corporation authorized Renesas Technology Corporation product distributor latest product information before purchasing product listed herein. information described here contain technical inaccuracies typographical errors. Renesas Technology Corporation assumes responsibility damage, liability, other loss rising from these inaccuracies errors. Please also attention information published Renesas Technology Corporation various means, including Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). When using information contained these materials, including product data, diagrams, charts, programs, algorithms, please sure evaluate information total system before making final decision applicability information products. Renesas Technology Corporation assumes responsibility damage, liability other loss resulting from information contained herein. Renesas Technology Corporation semiconductors designed manufactured device system that used under circumstances which human life potentially stake. Please contact Renesas Technology Corporation authorized Renesas Technology Corporation product distributor when considering product contained herein specific purposes, such apparatus systems transportation, vehicular, medical, aerospace, nuclear, undersea repeater use. prior written approval Renesas Technology Corporation necessary reprint reproduce whole part these materials. these products technologies subject Japanese export control restrictions, they must exported under license from Japanese government cannot imported into country other than approved destination. diversion reexport contrary export control laws regulations Japan and/or country destination prohibited. Please contact Renesas Technology Corporation further details these materials products contained therein.
H5N2504DL, H5N2504DS
Silicon Channel High Speed Power Switching
ADE-208-1375A 2nd. Edition Jun. 2002 Features
on-resistance leakage current High speed switching gate charge Avalanche ratings
Outline
DPAK-2
DPAK-S
H5N2504DS
H5N2504DL
Gate Drain Source Drain
H5N2504DL, H5N2504DS
Absolute Maximum Ratings
25°C)
Item Drain source voltage Gate source voltage Drain current Drain peak current Body-drain diode reverse drain current Body-drain diode reverse drain peak current Avalanche current Channel dissipation Channel case Thermal Impedance Channel temperature Storage temperature Notes: duty cycle Value 25°C 150°C Symbol VDSS VGSS (pulse) (pulse)
Note3 Note2 Note1 Note1
Ratings 4.17 +150
Unit °C/W
ch-c Tstg
Rev.1, Jun. 2002, page
H5N2504DL, H5N2504DS
Electrical Characteristics
25°C)
Item Drain source breakdown voltage Gate source leak current Zero gate voltage drain current Gate source cutoff voltage Static drain source state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate source charge Gate drain charge Body-drain diode forward voltage Symbol V(BR)DSS IGSS IDSS VGS(off) RDS(on) RDS(on) |yfs| Ciss Coss Crss td(on) td(off) 0.48 0.85 0.48 ±0.1 0.63 0.67 1.30 Unit Test conditions 35.7 diF/dt A/µs
Note4 Note4 Note4
Body-drain diode reverse recovery time Body-drain diode reverse recovery charge Notes: Pulse test
Rev.1, Jun. 2002, page
H5N2504DL, H5N2504DS
Main Characteristics
Power Temperature Derating
Maximum Safe Operation Area
Channel Dissipation
Drain Current
Operation this area 0.03 limited RDS(on) 0.01 25°C Drain Source Voltage 1000
(°C)
Case Temperature
Typical Output Characteristics Pulse Test
Typical Transfer Characteristics
Pulse Test
Drain Current
Drain Current
75°C
25°C
Drain Source Voltage
-25°C Gate Source Voltage
Rev.1, Jun. 2002, page
H5N2504DL, H5N2504DS
Drain Source Saturation Voltage Gate Source Voltage
Drain Source Saturation Voltage VDS(on)
Pulse Test
Drain Source State Resistance RDS(on)
Static Drain Source State Resistance Drain Current Pulse Test
ID=5A Gate Source Voltage
Drain Current
Static Drain Source State Resistance RDS(on)
Forward Transfer Admittance |yfs|
Static Drain Source State Resistance Temperature Pulse Test
Forward Transfer Admittance Drain Current 0.02 0.05 75°C 25°C -25°C
ID=5A
Pulse Test
Case Temperature (°C)
Drain Current
Rev.1, Jun. 2002, page
H5N2504DL, H5N2504DS
Body-Drain Diode Reverse Recovery Time 1000
5000 2000
Typical Capacitance Drain Source Voltage Ciss
Reverse Recovery Time (ns)
Capacitance (pF)
1000
25°C Reverse Drain Current
Coss
Crss Drain Source Voltage
Dynamic Input Characteristics
1000
Switching Characteristics duty
Gate Source Voltage
Switching Time (ns)
Drain Source Voltage
d(off)
d(on)
Gate Charge (nc)
Drain Current
Rev.1, Jun. 2002, page
H5N2504DL, H5N2504DS
VGS(off)
Reverse Drain Current Source Drain Voltage Gate Source Cutoff Voltage Temperature
Gate Source Cutoff Voltage
Reverse Drain Current
10mA
5,10 Pulse Test
0.1mA
Source Drain Voltage
Case Temperature (°C)
Switching Time Test Circuit Monitor D.U.T. Vout Vout Monitor
Waveform
td(off)
td(on)
Rev.1, Jun. 2002, page
H5N2504DL, H5N2504DS
Normalized Transient Thermal Impedance Pulse Width 25°C
Normalized Transient Thermal Impedance
0.05
c(t) 4.17°C/W, 25°C
0.03
0.02 0.01
0.01
Pulse Width
Rev.1, Jun. 2002, page
H5N2504DL, H5N2504DS
Package Dimensions
H5N2504DL
January, 2002
Unit:
0.55
16.2
1.15 (0.7)
0.55 2.29 2.29
0.55
Hitachi Code JEDEC JEITA Mass (reference value)
DPAK (L)-(2) 0.42
Rev.1, Jun. 2002, page
H5N2504DL, H5N2504DS
H5N2504DS
Unit:
0.55
(5.1)
0.25
(1.2)
2.29 2.29
0.55
Hitachi Code JEDEC JEITA Mass (reference value)
(5.1)
DPAK Conforms 0.28
Rev.1, Jun. 2002, page
H5N2504DL, H5N2504DS
Disclaimer
Hitachi neither warrants grants licenses rights Hitachi's third party's patent, copyright, trademark, other intellectual property rights information contained this document. Hitachi bears responsibility problems that arise with third party's rights, including intellectual property rights, connection with information contained this document. Products product specifications subject change without notice. Confirm that have received latest product standards specifications before final design, purchase use. Hitachi makes every attempt ensure that products high quality reliability. However, contact Hitachi's sales office before using product application that demands especially high quality reliability where failure malfunction directly threaten human life cause risk bodily injury, such aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment medical equipment life support. Design your application that product used within ranges guaranteed Hitachi particularly maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions other characteristics. Hitachi bears responsibility failure damage when used beyond guaranteed ranges. Even within guaranteed ranges, consider normally foreseeable failure rates failure modes semiconductor devices employ systemic measures such failsafes, that equipment incorporating Hitachi product does cause bodily injury, fire other consequential damage operation Hitachi product. This product designed radiation resistant. permitted reproduce duplicate, form, whole part this document without written approval from Hitachi. Contact Hitachi's sales office questions regarding this document Hitachi semiconductor products.
Sales Offices
Hitachi, Ltd.
Semiconductor Integrated Circuits Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: (03) 3270-2111 Fax: (03) 3270-5109
further information write
Hitachi Semiconductor (America) Inc. East Tasman Drive Jose,CA 95134 Tel: (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe Ltd. Electronic Components Group Whitebrook Park Lower Cookham Road Maidenhead Berkshire 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 585200 Hitachi Europe GmbH Electronic Components Group Dornacher D-85622 Feldkirchen Postfach 201, D-85619 Feldkirchen Germany Tel: <49> (89) 9180-0 Fax: <49> (89) Hitachi Asia Ltd. Hitachi Tower Collyer Quay #20-00 Singapore 049318 <65>-6538-6533/6538-8577 <65>-6538-6933/6538-3877 Hitachi Asia Ltd. (Taipei Branch Office) 4/F, 167, North Road Hung-Kuo Building Taipei (105), Taiwan <886>-(2)-2718-3666 <886>-(2)-2718-8180 Telex 23222 HAS-TP http://www.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group (Electronic Components) 7/F., North Tower World Finance Centre, Harbour City, Canton Road Tsim Tsui, Kowloon Hong Kong <852>-2735-9218 <852>-2730-0281
Copyright Hitachi, Ltd., 2002. rights reserved. Printed Japan.
Colophon
Rev.1, Jun. 2002, page

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