Multilayer Surface Mount Transient Voltage Surge Suppressors Seri

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Multilayer Surface Mount Transient Voltage Surge Suppressors Seri

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Multilayer Surface Mount Transient Voltage Surge Suppressors
Series family Transient Voltage Surge Suppression devices based Harris Multilayer fabrication technology. These components designed suppress variety transient events, including those specified other standards used Electromagnetic Compliance (EMC). Series typically applied protect integrated circuits other components circuit board level. wide operating voltage energy range make Series suitable numerous applications power supply, control signal lines, complements Harris (ESD) AUML (Automotive) series. Series manufactured from semiconducting ceramics providing bidirectional voltage clamping supplied leadless, surface mount form, compatible with modern reflow wave soldering procedures.
April 1997
Features
Leadless 0603, 0805, 1206 1210 Chip Sizes Multilayer Construction Technology -55oC 125oC Operating Temperature Range Wide Operating Voltage Range VM(DC) 3.5V Rated Surge Current Rated Energy 1000) Inherent Bidirectional Clamping Plastic Epoxy Packaging Assures Better than 94V-0 Flammability Rating Standard Capacitance Types Available
Applications
Suppression Inductive Switching Other Transient Events Such Surge Voltage Circuit Board Level Protection Components Sensitive 1000-4-2, MIL-STD-883C Method 3015.7, Other Industry Specifications (See Also Series) Provides On-Board Transient Voltage Protection Transistors Used Help Achieve Electromagnetic Compliance Products Replace Larger Surface Mount Zeners Many Applications
Packaging
SERIES (LEADLESS CHIP)
Copyright
Harris Corporation 1997
File Number
2461.6
Series
Absolute Maximum Ratings
ratings Individual members series, device ratings specifications table. SERIES Continuous: Steady State Applied Voltage: Voltage Range (VM(DC)). Voltage Range (VM(AC)RMS) Transient: Non-Repetitive Surge Current, 8/20µs Waveform, (ITM) Non-Repetitive Surge Energy, 10/1000µs Waveform, (WTM) Operating Ambient Temperature Range (TA). Storage Temperature Range (TSTG) Temperature Coefficient Clamping Voltage (VC) Specified Test Current. UNITS
<0.01
%/oC
Device Ratings Specifications
MAXIMUM RATINGS (125oC) MAXIMUM MAXIMUM MAXIMUM NONNONCLAMPING REPETITIVE REPETITIVE VOLTAGE SURGE SURGE CURRENT ENERGY NOTED) (8/20µs) (10/1000µs) (8/20µs) I(A) W(J) 15.5 15.5 15.5 15.5 CHARACTERISTICS (25oC)
MAXIMUM CONTINUOUS WORKING VOLTAGE MODEL NUMBER V3.5MLA0603 V3.5MLA0805 V3.5MLA0805L V3.5MLA1206 V5.5MLA0603 V5.5MLA0805 V5.5MLA0805L V5.5MLA1206 V9MLA0603 V14MLA0603 V14MLA0805 V14MLA0805L V14MLA1206 V18MLA0603 V18MLA0805 V18MLA0805L V18MLA1206 V18MLA1210 V26MLA1206 V26MLA1210 VM(DC) VM(AC)
NOMINAL VOLTAGE TEST CURRENT VN(DC) 11.0 15.9 15.9 15.9 16.4 29.5 29.5 VN(DC) 16.0 20.3 20.3 20.3 20.3 28.0 28.0 28.0 28.0 28.0 38.5 38.5
TYPICAL CAPACITANCE 1MHz (pF) 1100 2200 1200 7000 1600 7200 2100 1100 1250 1000
Series
Device Ratings Specifications
(Continued) CHARACTERISTICS (25oC)
MAXIMUM RATINGS (125oC) MAXIMUM MAXIMUM MAXIMUM NONNONCLAMPING REPETITIVE REPETITIVE VOLTAGE SURGE SURGE CURRENT ENERGY NOTED) (8/20µs) (10/1000µs) (8/20µs) I(A) W(J)
MAXIMUM CONTINUOUS WORKING VOLTAGE MODEL NUMBER V33MLA1206 V42MLA1206 V56MLA1206 V68MLA1206 NOTES: VM(DC) VM(AC)
NOMINAL VOLTAGE TEST CURRENT VN(DC) VN(DC)
TYPICAL CAPACITANCE 1MHz (pF)
suffix capacitance energy version. Contact Sales custom capacitance requirements. Typical leakage 25oC 50µA, maximum leakage 100µA VM(DC). Average power dissipation transients 0603, 0805, 1206 1210 sizes exceed 0.05, 0.10W, 0.10W 0.15W, respectively.
Power Dissipation Ratings
PERCENT RATED VALUE
When transients occur rapid succession average power dissipation energy (watt-seconds) pulse times number pulses second. power developed must within specifications shown Device Ratings Characteristics table specific device. Furthermore, operating values need derated high temperatures shown Figure
AMBIENT TEMPERATURE (oC)
FIGURE CURRENT, ENERGY POWER DERATING CURVE
PERCENT PEAK VALUE
EXAMPLE: VIRTUAL ORIGIN WAVE TIME FROM PEAK 8/20µs CURRENT VIRTUAL FRONT TIME 1.25 WAVEFORM: VIRTUAL TIME HALF VALUE VIRTUAL FRONT (IMPULSE DURATION) TIME 20µs VIRTUAL TIME HALF VALUE
TIME
FIGURE PEAK PULSE CURRENT TEST WAVEFORM
Series Maximum Transient Characteristic Curves
MAXIMUM PEAK VOLTAGE MAXIMUM LEAKAGE V14MLA0603 V9MLA0603 MAXIMUM CLAMPING VOLTAGE V18MLA0603 MAXIMUM PEAK VOLTAGE MAXIMUM LEAKAGE MAXIMUM CLAMPING VOLTAGE
V3.5MLA0805L
V5.5MLA0603 V3.5MLA0603
V3.5MLA0805L V3.5MLA0805 3.5VM(DC) RATING
3.5VM(DC) 18VM(DC) RATING 100nA -55oC 125oC 10µA 100µA 10mA 100mA CURRENT 100A
10µA 100µA 10mA CURRENT
-55oC 125oC 100mA 100A
FIGURE V3.5MLA0603 V18MLA0603 MAXIMUM CHARACTERISTICS CURVES
FIGURE V3.5MLA0805/L MAXIMUM CHARACTERISTICS CURVES
MAXIMUM LEAKAGE MAXIMUM PEAK VOLTAGE MAXIMUM CLAMPING VOLTAGE V5.5MLA0805L MAXIMUM PEAK VOLTAGE
MAXIMUM LEAKAGE MAXIMUM CLAMPING VOLTAGE
V14MLA0805L
V5.5MLA0805L V5.5MLA0805
V14MLA0805L V14MLA0805
5.5VM(DC) RATING 10µA 100µA 10mA 100mA CURRENT -55oC 125oC 100A
V14MLA0805 10µA 100µA 10mA 100mA CURRENT
14VM(DC) RATING -55oC 125oC 100A
FIGURE V5.5MLA0805/L MAXIMUM CHARACTERISTICS CURVES
FIGURE V14MLA0805/L MAXIMUM CHARACTERISTICS CURVES
MAXIMUM LEAKAGE MAXIMUM PEAK VOLTAGE MAXIMUM CLAMPING VOLTAGE V18MLA0805L MAXIMUM PEAK VOLTAGE
MAXIMUM LEAKAGE MAXIMUM CLAMPING VOLTAGE
V18MLA0805L V18MLA0805
V14MLA1206 V5.5MLA1206 V3.5MLA1206
V18MLA0805 18VM(DC) RATING -55oC 125oC 10µA 100µA 10mA 100mA CURRENT 100A
14VM(DC) RATING -55oC +125oC
10µA 100µA 10mA 100mA CURRENT
100A
FIGURE V18MLA0805/L MAXIMUM CHARACTERISTICS CURVES
FIGURE V3.5MLA1206 V14MLA1206 MAXIMUM CHARACTERISTIC CURVES
Series Maximum Transient Characteristic Curves
MAXIMUM LEAKAGE MAXIMUM PEAK VOLTAGE MAXIMUM CLAMPING VOLTAGE MAXIMUM PEAK VOLTAGE
(Continued)
1000 MAXIMUM LEAKAGE MAXIMUM CLAMPING VOLTAGE
V68MLA1206 V56MLA1206 68VM(DC) RATING -55oC +125oC 10µA 100µA 10mA 100mA CURRENT 100A
V42MLA1206 V33MLA1206 V26MLA1206 V18MLA1206 10µA 100µA 10mA 100mA CURRENT 100A 42VM(DC) RATING -55oC +125oC
FIGURE V18MLA1206 V42MLA1206 MAXIMUM CHARACTERISTIC CURVES
FIGURE V56MLA1206 V68MLA1206 MAXIMUM CHARACTERISTIC CURVE
MAXIMUM LEAKAGE MAXIMUM PEAK VOLTAGE
MAXIMUM CLAMPING VOLTAGE
V26MLA1210 26VM(DC) RATING V18MLA1210 -55oC +125oC 100A
10µA 100µA 10mA 100mA CURRENT
FIGURE V18MLA1210 V26MLA1210 MAXIMUM CHARACTERISTIC CURVES
Series Device Characteristics
current levels, curve multilayer transient voltage suppressor approaches linear (ohmic) relationship shows temperature dependent affect (Figure 12). suppressor high resistance mode (approaching 106). Leakage currents maximum rated voltage microampere range most cases below 50µA. When clamping transients above 10mA range, multilayer suppressor approaches characteristic. Here, multilayer becomes virtually temperature independent (Figure 13). Speed Response Multilayer Suppressor leadless device. response time limited parasitic lead inductances found other surface mount packaging. response time Zinc Oxide dielectric material less than nanosecond clamp very fast dV/dT events such ESD. Additionally, "real world" applications, associated circuit wiring often greatest factor effecting speed response. Therefore, transient suppressor placement within circuit considered important certain instances.
VARISTOR VOLTAGE PERCENT VNOM VALUE 25oC
10-9 10-8 10-7 125oC 10-6 10-5 10-4 10-3 10-2
VARISTOR CURRENT (ADC)
FIGURE TYPICAL TEMPERATURE DEPENDENCE CHARACTERISTIC CURVE LEAKAGE REGION
CLAMPING VOLTAGE
V26MLA1206
V5.5MLA1206
TEMPERATURE (oC)
FIGURE CLAMPING VOLTAGE OVER TEMPERATURE 10A)
Series
Energy Absorption/Peak Current Capability Energy dissipated within calculated multiplying clamping voltage, transient current transient duration. important advantage multilayer interdigitated electrode construction within mass dielectric material. This results excellent current distribution peak temperature energy absorbed very low. matrix semiconducting grains combine absorb distribute transient energy (heat) (Figure 14). This dramatically reduces peak temperature, thermal stresses enhances device reliability. measure device capability energy handling peak current, V26MLA1206A23 part tested with multiple pulses peak current rating (150A, 8/20 µs). test, 10,000 pulses later, device voltage characteristics still well within specification (Figure 15).
FIRED CERAMIC DIELECTRIC
METAL ELECTRODES
DEPLETION REGION
DEPLETION REGION
GRAINS
FIGURE MULTILAYER INTERNAL CONSTRUCTION
PEAK CURRENT 150A 8/20ms DURATION, BETWEEN PULSES
VOLTAGE
V26MLA1206
2000 4000 6000 NUMBER PULSES 8000 10000 12000
FIGURE REPETITIVE PULSE CAPABILITY
Series Soldering Recommendations
principal techniques used soldering components surface mount technology Infra (IR) Reflow, Vapor Phase Reflow Wave Soldering. When wave soldering, suppressor attached substrate means adhesive. assembly then placed conveyor through soldering process. With Vapor Phase Reflow device placed solder paste substrate. solder paste heated reflows, solders unit board. With suppressor, recommended solder 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb), 63/37 (Sn/Pb). Harris also recommends solder flux. Wave soldering operation most strenuous processes. avoid possibility generating stresses thermal shock, preheat stage soldering process recommended, peak temperature solder process should rigidly controlled. When using reflow process, care should taken ensure that chip subjected thermal gradient steeper than degrees second; ideal gradient being degrees second. During soldering process, preheating within degrees solders peak temperature essential minimize thermal shock. Examples soldering conditions series suppressors given table below. Once soldering process been completed, still necessary ensure that further thermal shocks avoided. possible cause thermal shock printed circuit boards being removed from solder process subjected cleaning solvents room temperature. boards must allowed cool less than 50oC before cleaning. Reflow Soldering operations, standard silver platinum (Ag/Pt) termination finish recommended. Wave Soldering operations, optional silver palladium (Ag/Pd) termination finish recommended. order, append standard model number, e.g. V3.5MLA0603W.
NOTE
RECOMMENDED TEMPERATURE PROFILE TEMPERATURE (oC) INFRARED (IR) REFLOW 25-60 60-120 120-155 155-155 155-220 220-220 220-50 VAPOR PHASE REFLOW 25-90 90-150 150-222 222-222 222-80 80-25 WAVE SOLDER 25-125 125-180 180-260 260-260 260-180 180-80 80-25 TIME (SECONDS)
Recommended Outline
NOTE: Avoid metal runs this area.
SIZE 1210 SIZE DEVICE SYMBOL 0.219 0.147 0.073 5.53 3.73 1.85 1206 SIZE DEVICE 0.203 0.103 0.065 5.15 2.62 1.65 0805 SIZE DEVICE 0.144 0.084 0.058 3.65 2.13 1.48 0603 SIZE DEVICE 0.11 0.064 0.044 1.62 1.12
Series Dimensional Outline
CHIP SIZE 1210 SYMBOL Max. 0.113 0.02 ±0.01 0.125 ±0.012 0.10 ±0.012 2.87 0.50 ±0.25 3.20 ±0.30 2.54 ±0.30 0.071 0.02 ±0.01 0.125 ±0.012 0.06 ±0.011 1206 1.80 0.50 ±0.25 3.20 ±0.03 1.60 ±0.28 0.043 0.01 0.029 0.079 ±0.008 0.049 ±0.008 0805 0.25 0.75 2.01 ±0.2 1.25 ±0.2 0.035 0.015 ±0.008 0.063 ±0.006 0.032 ±0.006 0603 ±0.2 ±0.15 ±0.15
Tape Reel Specifications
Conforms 481, Revision Supplied Publication
SYMBOL Width Cavity Length Cavity Depth Cavity Width Tape Distance Between Drive Hole Centers Cavity Centers Distance Between Drive Hole Centers Tape Edge Distance Between Cavity Center Axial Distance Between Drive Hole Centers Cavity Centers Axial Distance Between Drive Hole Centers Drive Hole Diameter Diameter Cavity Piercing Embossed Tape Thickness Tape Thickness DESCRIPTION MILLIMETERS Dependent Chip Size Minimize Rotation. Dependent Chip Size Minimize Rotation. Dependent Chip Size Minimize Rotation. ±0.2 ±0.5 1.75 ±0.1 ±0.1 ±0.1 ±0.1 1.55 ±0.05 1.05 ±0.05
NOTE: Dimensions millimeters.
Series Ordering Information
VXXML TYPES
1206
SERIES
DEVICE FAMILY Harris TVSS Device MAXIMUM WORKING VOLTAGE
PACKING OPTIONS <100 Bulk (178mm) Diameter Reel (Note) 13in (330mm) Diameter Reel (Note) TERMINATION OPTION Letter: Ag/PT (Standard) Ag/PD CAPACITANCE OPTION Letter: Standard Capacitance Version
MULTILAYER DESIGNATOR PERFORMANCE DESIGNATOR Standard
DEVICE SIZE: i.e.
NOTE: Quantity reel depending upon device size.
Termination Options reflow soldering operations, standard silver platinum (Ag/Pt) termination finish recommended. order, standard model number, e.g., V18MLA0603. wave soldering operations, optional silver palladium (Ag/Pd) termination finish recommended. order, append standard model number, e.g., V18MLA0603W. Tape Reel Series transient suppressors packaged tape reel. standard millimeter inch) reel utilized contains 10000 pieces 1206, 0805 0603 chips. order standard part number, e.g. V18MLA1206T. Other Packaging Option millimeter inch) reels containing 2500, pieces available. order part number, e.g., V18MLA1206H. Option small sample quantities (less than pieces) units shipped bulk pack. order part number, e.g., V18MLA1206A.
EMBOSSMENT TAPE NOMINAL PLASTIC CARRIER TAPE
PRODUCT IDENTIFYING LABEL
178mm 330mm DIA. REEL
Series Explanation Terms
Rated Voltage (VM(DC)) This maximum continuous voltage which applied maximum operating temperature device. rated operating voltage (working voltage) also used reference point leakage current. This voltage always less than breakdown voltage device. Rated Voltage (VM(AC)RMS) This maximum continuous sinusoidal voltage which applied. This voltage applied temperature maximum operating temperature device. Maximum Non-Repetitive Surge Current (ITM) This maximum peak current which applied 8/20µs impulse, with rated line voltage also applied, without causing device failure. pulse applied device either polarity with same confidence factor. Figure waveform description. Maximum Non-Repetitive Surge Energy (WTM) This maximum rated transient energy which dissipated single current pulse specified impulse duration (10/1000µs), with rated voltage applied, without causing device failure. Leakage (IL) Rated Voltage nonconducting mode, device very high impedance (approaching 106) appears almost open circuit system. leakage current drawn this level very low. Nominal Voltage (VN(DC)) This voltage which device changes from state state enters conduction mode operation. voltage usually characterized point specified minimum maximum voltage listed. Clamping Voltage (VC) This peak voltage appearing across suppressor when measured conditions specified pulse current specified waveform. Capacitance This capacitance device specified frequency (1MHz) bias (1VP-P).
Harris Semiconductor products manufactured, assembled tested under ISO9000 quality systems certification.
Harris Semiconductor products sold description only. Harris Semiconductor reserves right make changes circuit design and/or specifications time without notice. Accordingly, reader cautioned verify that data sheets current before placing orders. Information furnished Harris believed accurate reliable. However, responsibility assumed Harris subsidiaries use; infringements patents other rights third parties which result from use. license granted implication otherwise under patent patent rights Harris subsidiaries.
Sales Office Headquarters
general information regarding Harris Semiconductor products, call 1-800-4-HARRIS NORTH AMERICA Harris Semiconductor 883, Mail Stop 53-210 Melbourne, 32902 TEL: 1-800-442-7747 (407) 729-4984 FAX: (407) 729-5321 EUROPE Harris Semiconductor Mercure Center 100, Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Harris Semiconductor Ltd. Tannery Road Cencon #09-01 Singapore 1334 TEL: (65) 748-4200 FAX: (65) 748-0400

Multilayer Surface Mount Transient Voltage Surge Suppressors Seri

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