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REJ03G0048-0100Z (Previous: ADE-208-956) Rev.1.00 Jul.17.2003 Nar


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HVD368B
REJ03G0048-0100Z (Previous: ADE-208-956) Rev.1.00 Jul.17.2003
Narrow terminal Capacitance deviation. series resistance. max) Good linearity. Super small Flat Package (SFP) suitable surface mount design.
Ordering Information
Type HVD368B Laser Mark Package Code
Arrangement
Cathode mark Mark
Cathode Anode
Rev.1.00, Jul.17.2003, page
HVD368B
Absolute Maximum Ratings
25°C)
Item Reverse voltage Junction temperature Storage temperature Symbol Tstg Value +125 Unit
Electrical Characteristics
25°C)
Item Reverse current Symbol Capacitance Capacitance ratio Series resistance 15.0 16.5 10.2 Unit Test Condition 60°C
Notes: Please soldering iron avoid high stress package. material lead exposed cutting plane. Therefore, soldering nature lead part considered unquestioned. Please kindly consider soldering nature.
Rev.1.00, Jul.17.2003, page
HVD368B
Main Characteristic
10-10 1MHz 10-11
Reverse current
Capacitance (pF)
10-12
10-13
10-14
Reverse voltage
Reverse voltage Fig.1 Reverse current Reverse voltage
Fig.2 Capacitance Reverse voltage
470MHz
Series resistance
(LogC)/(LogVR)
Reverse voltage
-0.5
-1.0
-1.5
-2.0
Reverse voltage
Fig.3 Series resistance Reverse voltage
Fig.4 Linearity factor Reverse voltage
Rev.1.00, Jul.17.2003, page
HVD368B
Package Dimensions
January, 2003
Unit:
0.10 0.10
0.13 0.05
0.55
0.05 0.05
Package Code JEDEC JEITA Mass (reference value)
0.0010
Rev.1.00, Jul.17.2003, page
Sales Strategic Planning Div.
Keep safety first your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Renesas Technology Corporation puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap.
Notes regarding these materials
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