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CHANNEL 100V 0.021 TO247 STripFETPOWER MOSFET TYPE STW55NE10
Top Searches for this datasheetSTW55NE10 CHANNEL 100V 0.021 TO247 STripFETPOWER MOSFET TYPE STW55NE10 VDSS DS(on) <0.027 TYPICAL RDS(on) 0.021 EXCEPTIONAL dv/dt CAPABILITY 100% AVALANCHE TESTED GATE CHARGE APPLICATION ORIENTED CHARACTERIZATION DESCRIPTION This Power MOSFET latest development STMicroelectronics unique "Single Feature SizeTM" strip-based process. resulting transistor shows extremely high packing density on-resistance, rugged avalanche characteristics less critical alignment steps therefore remarkable manufacturing reproducibility. APPLICATIONS HIGH CURRENT, HIGH SPEED SWITCHING SOLENOID RELAY DRIVERS MOTOR CONTROL, AUDIO AMPLIFIERS DC-DC DC-AC CONVERTERS AUTOMOTIVE ENVIRONMENT TO-247 INTERNAL SCHEMATIC DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol Parameter Drain-source Voltage Drain- gate Voltage Gate-source Voltage Drain Current (continuous) Drain Current (continuous) Drain Current (pulsed) Total Dissipation Derating Factor dv/dt Peak Diode Recovery voltage slope Tstg Storage Temperature Max. Operating Junction Temperature Value di/dt A/µs, V(BR)DSS, TJMAX Unit V/ns Pulse width limited safe operating area January 1999 STW55NE10 THERMAL DATA thj-case Rthj-amb thc-sink Thermal Resistance Junction-case Thermal Resistance Junction-ambient Thermal Resistance Case-sink Maximum Lead Temperature Soldering Purpose 0.83 oC/W AVALANCHE CHARACTERISTICS Symbol Parameter Avalanche Current, Repetitive Not-Repetitive (pulse width limited max) Single Pulse Avalanche Energy (starting Value Unit ELECTRICAL CHARACTERISTICS (Tcase unless otherwise specified) Symbol (BR)DSS IGSS Parameter Drain-source Breakdown Voltage Test Conditions Min. Typ. Max. Unit Zero Gate Voltage Rating Drain Current Rating Gate-body Leakage Current Symbol GS(th) DS(on) D(on) Parameter Gate Threshold Voltage Static Drain-source Resistance Test Conditions 27.5 Min. Typ. 0.021 Max. 0.027 Unit State Drain Current D(on) DS(on)max DYNAMIC Symbol Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Test Conditions D(on) DS(on)max Min. Typ. 4350 Max. Unit STW55NE10 ELECTRICAL CHARACTERISTICS (continued) SWITCHING Symbol d(on) Parameter Turn-on Time Rise Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Test Conditions =4.7 (see test circuit, figure Min. Typ. Max. Unit SWITCHING Symbol tr(Voff) Parameter Off-voltage Rise Time Fall Time Cross-over Time Test Conditions =4.7 (see test circuit, figure Min. Typ. Max. Unit SOURCE DRAIN DIODE Symbol Parameter Source-drain Current Source-drain Current (pulsed) Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current 10.5 di/dt A/µs (see test circuit, figure Test Conditions Min. Typ. Max. 1100 Unit Pulsed: Pulse duration duty cycle Pulse width limited safe operating area Safe Operating Area Thermal Impedance STW55NE10 Output Characteristics Transfer Characteristics Transconductance Static Drain-source Resistance Gate Charge Gate-source Voltage Capacitance Variations STW55NE10 Normalized Gate Threshold Voltage Temperature Normalized Resistance Temperature Source-drain Diode Forward Characteristics STW55NE10 Fig. Unclamped Inductive Load Test Circuit Fig. Unclamped Inductive Waveform Fig. Switching Times Test Circuits Resistive Load Fig. Gate Charge test Circuit Fig. Test Circuit Inductive Load Switching Diode Recovery Times STW55NE10 TO-247 MECHANICAL DATA MIN. 3.55 15.3 19.7 14.2 34.6 3.65 0.079 0.140 10.9 15.9 20.3 14.8 0.602 0.776 0.559 0.413 1.362 0.217 0.118 0.144 TYP. MAX. MIN. 0.185 0.087 0.016 0.039 0.079 0.118 0.429 0.626 0.779 0.582 inch TYP. MAX. 0.209 0.102 0.031 0.055 0.094 0.134 DIM. P025P STW55NE10 Information furnished believed accurate reliable. However, STMicroelectronics assumes responsibility consequences such information infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights STMicroelectronics. Specification mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. STMicroelectronics products authorized critical components life support devices systems without express written approval STMicroelectronics. logo trademark STMicroelectronics 1998 STMicroelectronics Printed Italy Rights Reserved STMicroelectronics GROUP COMPANIES Australia Brazil Canada China France Germany Italy Japan Korea Malaysia Malta Mexico Morocco Netherlands Singapore Spain Sweden Switzerland Taiwan Thailand United Kingdom U.S.A. http://www.st.com Other recent searchesTMP86FH92IDMG - TMP86FH92IDMG TMP86FH92IDMG Datasheet SG6860 - SG6860 SG6860 Datasheet RN142G - RN142G RN142G Datasheet DDS-815-011 - DDS-815-011 DDS-815-011 Datasheet 54F38 - 54F38 54F38 Datasheet 74F38 - 74F38 74F38 Datasheet 2SC4833 - 2SC4833 2SC4833 Datasheet 25NHTBJB2496 - 25NHTBJB2496 25NHTBJB2496 Datasheet
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