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TEHAMA

850 CHIP SET COOLING SOLUTIONS

TEHAMA
850 CHIP SET COOLING SOLUTIONS
Part # 23410
35 mm Tall 5 pc. Assembly
Part # 23411
23 mm Tall 5 pc. Assembly
· Easy Mounting to 850 Chip Set · Pre-Applied Interface Material · Shock Absorbing Gasket · Protects Chip and Package · Two Heights Available · Solder Anchor Required on PCB · Custom Variations Are Possible · Shipping in High Volume 850 Chip Set Solution - 5 Components
SINK MOUNTING SURFACETEMPERATURE RI ABOVE AMBIENT - deg. C
AIR VELOCITY - LFM 200 300 400 500 10
THERMAL RESISTANCE FROM SINK MOUNTIN SURFACE TO AMBIENT - C / WATT
Aluminum Extruded Heat Sink Spring Wing Clip To Secure Wire Clip in Place Wire Clip That Attaches to Solder Anchor Chomerics T710 Interface Pad with Pull Tab Poron Silicone Foam Gasket
Solder Anchor Sold Separately
Part #: A13494
Two solder anchors must be soldered to PCB prior to attaching the heat sink clip
0 0 2 4 6 8 10 0 HEAT DISSIPATED - WATTS
T710 is a Registered Trademark of Chomerics
Rev. 1 08 / 08 / 2000