Schottky Rectifier Chip Central Semiconductor Corp. PRO
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CPD31
Schottky Rectifier Chip
Central
Semiconductor Corp.
PROCESS DETAILS Size Thickness Anode Bonding Area Side Metalization Back Side Metalization MILS MILS MILS Al/Ni/Au Ti/Ni/Au
GEOMETRY GROSS INCH WAFER 1,504
BACKSIDE CATHODE
Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
(2-November 2006)
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