ATHLON®/DURON® FCPGA Part 11-K754-01 Heat Sink Specification
|
|
|
Top Searches for this datasheet
11-K754-01 (036113) COOLER
ATHLON®/DURON® FCPGA
Part 11-K754-01
Heat Sink Specification
Ball Sleeve Bearing 12VDC Molex 2695 Connector Equivalent (FOO) Speed approximately 4200 Noise less than variations including bearing type, speed, interface materials, please contact Application Engineering
Optimized Assembly High Aspect Ratio Extrusion Maximum Surface Area Phase Change Interface Wire Smart Signal Designed Socket Sturdy clip design withstands rugged environments
Thermal Performance
11-K754-01 tested inside using Asus motherboard, with Athlon. placed °C/watt thermal chamber. thermal resistance measured 0.66 °C/watt from case ambient air. addition, this heat sink also tested meets their thermal requirement Athlon family through 1.33 GHz.
Athlon Duron registered trademarks Advanced Micro Devices. Rev. 05/31/01
Other recent searches
HAT-8+ - HAT-8+ HAT-8+ Datasheet
BYS12-90 - BYS12-90 BYS12-90 Datasheet
BF959 - BF959 BF959 Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
