High Reliability INSTALLATION, HANDLING, HARDWARE OPTIONS GENERAL

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High Reliability INSTALLATION, HANDLING, HARDWARE OPTIONS GENERAL

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Filter Design Guide
High Reliability
INSTALLATION, HANDLING, HARDWARE OPTIONS GENERAL
Proper Electrical Operation Requires:
Good filter/case ground. Design layout where filter installed directly into conductive shield enclosure. Minimizing holes, slots, other penetrations shield near filter. form filter leads. Mechanical stress transmitted discoidal capacitor. glass hermetic seal damaged. Contact Filters regarding custom lead lengths accommodate your requirements.
Bolt-Style Filters
exceed recommended mounting torques listed next page. NOTE: preferable keep side torque range when installing filters into threaded mounting holes. epoxy sealed bolt-style units Filters recommends conformal coating units after installation improve moisture resistance. Observe same precautions listed hi-temp filter when soldering filter center pin. bend filter center pin.
Installation Precautions
Although EMI/RFI filters withstand temperature extremes, rapid heat-up cool-down crack internal ceramic capacitor. Pre-heating filter prior soldering should performed whenever possible. Forced-air cooling after soldering recommended.
Avoid Mechanical Stress
pliers other gripping tools capable exerting excessive pressure filter case. alter lead terminal flag either before after soldering.
Cylindrical-Style Filters
Observe recommended mounting torque table next page. series filters (1/4-28 UNF-2A) require oz-in. series (5/16-24 UNF-2A) require oz-in. terminal flags should subjected mechanical stress during after leadwire installation. glass hermetic seal adversely affected. care soldering terminal flags. 18-30 watt soldering iron recommended. CAUTION: large wattage iron without temperature control cause reflow high-temperature solder used seal terminal. This could result loss hermeticity filter.
SPECIFIC RECOMMENDATIONS
Hi-Temp Solder-In Style Filter
Small case design sensitive excessive heating. 150°C preheat prior solder installation using supplied solder preform highly recommended. Vapor phase reflow (VPR) soldering with integral preheat preferred. Infrared (IR) plate soldering also used. Temperature should increased solder temperature (300°C, max.) controlled rate second. Time max. temperature should kept minimum should never exceed seconds. When soldering leads using iron: Iron temperature should exceed 460°F (60/40 solder recommended). small iron, 15-20 watts, apply heat longer than seconds. heat sink clip when lead length permits recommended. expose leads torque stresses moving wires after soldering lead. glass hermetic seal damaged.
HARDWARE OPTIONS
General
Necessary mounting hardware supplied with filters. lockwasher plating will filter case specified. Refer table hardware selection. Standard hardware ("STD") will supplied unless otherwise requested. MIL-F-28861 filters will shipped with MIL-F-28861 hardware.
Filter Design Guide
High Reliability
M28861 SCREENING
Group sequence outlined MIL-F-28861 performed 100% basis whenever Reliability Codes Class Class specified customer. Differences between Class Class screening shown descriptions.
S-CLASS, B-CLASS TESTING
Test Thermal Shock Burn-in MIL-STD-202 (method) 107, cond. Description S-class: cycles from -55°C +125°C. Through-hole mounting required. B-class: above except mounting required. S-class: hours minimum 2.0X rated voltage, 125°C polarity reversal first 24-72 hours; fused circuit each filter. B-class: hours 2.0X rated voltage. S-class, B-class: 2.5X rated voltage seconds minimum, minute maximum, charging current. S-class: test rated, whichever less. Pass/fail limits also based upon 125°C reading from first pieces. B-class: same above, except omit pass/fail piece calculation. S-class, B-class: test 1000 VRMS S-class, B-class: MIL-STD load, no-load specified. S-class, B-class: test optional Voltage Drop Test performed. S-class, B-class: M28861 para. 4.6.6.1 rated), para 4.6.6.2 rated) S-class, B-class: views required with examination images. S-class: condition B-class: condition S-class: M28861 para 4.6.1.2 which includes element, subassembly, pre-cap inspections, B-class: M28861 para 4.6.3 external visual only. S-class, B-class: samples.
Dielectric Withstanding Voltage Insulation Resistance Capacitance D.F. Insertion Loss Resistance Voltage Drop Radiographic Inspect. Seal Test Visual Mechanical Solderability
302, cond.
R-LEVEL SCREENING
test sequence outlined below performed whenever Filters R-level screening specified. Each filter subjected tests order shown 100% basis. Summary data provided R-level Screening included with shipment.
R-LEVEL TESTING
Test Thermal Shock Burn-in Dielectric Withstanding Voltage Insulation Resistance Seal Test Depolarization Capacitance D.F. Resistance Insertion Loss Visual Mechanical MIL-STD-202 (method) 107, cond. 108, cond. 302, cond. 112, cond. Description cycles from -55°C +125°C. hours times rated voltage, ±125°C. Twice (2X) rated voltage 25°C, maximum charging current. Testing performed rated voltage. 125°C value shall specified 25°C. Gross leak test. applicable epoxy-sealed units. hour 150°C. voltage applied. Test signal 1KHz, VRMS. measured lieu voltage drop. MIL-F-15733 para 4.6.9.1 (check test) MIL-F-15733 para. 4.6.1

High Reliability INSTALLATION, HANDLING, HARDWARE OPTIONS GENERAL

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