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Agilent ACPF-7003 High Rx and Image Rejection Tx Filter for US PCS Band

-30° to +85° C Typ Max 3.5 2.5 3.0

Agilent ACPF-7003 High Rx and Image Rejection Tx Filter for US PCS Band
Data Sheet
+25° C Symbol f IL IL IL S21 S21 S21 S21 S21 S21 S21 S21 Pin max Parameters Passband 1850.6 - 1909.4 Insertion Loss 1855-1905 MHz Ripple, 1850-1910 MHz Min Rejection, 1930.6-1990 MHz Min Rejection 10 -1715 MHz Min Rejection 1715 - 1785 MHz Min Rejection 1785 - 1830 MHz Min Rejection 1990 - 2500 MHz Min Rejection 2500 - 3820 MHz Min Rejection 3820 - 5730 MHz Safe Input Power Level Units MHz 2.0 1.5 2.5 3.5 2.5 3.0 2.5 35 25 25 25 30 22 15 10 20 13 45 35 25 25 25 30 22 15 10 20 Min Typ Max Min
-30° to +85° C Typ Max 3.5 2.5 3.0
Insertion Loss 1850.6-1855 MHz dB dB dB dB dB dB dB dB dB dB dB dBm Insertion Loss 1905-1909.4 MHz dB
S11, S22 In-band return loss
Absolute Maximum Ratings2
Parameter Operating temperature1 Storage temperature
Unit °C °C
Value -30 to +85 -40 to +125
Notes: 1. Temperature is defined at case TC, the temperature of the underside of the filter where it makes contact with the circuit board. 2. Specifications are guaranteed over the given temperature range. Operation in excess of any one of these conditions may result in permanent damage to the device.
Figure 1. Attenuation (dB) vs. frequency
Figure 2. Insertion Loss (dB) vs. frequency
Figure 3. Attenuation (dB) vs. frequency (broadband)
Figure 4. Return Loss (dB) vs. frequency
Figure 5. S(1, 1)
Figure 6. S(2, 2)
PCB Interface & Mounting instructions Mounting Consideration and board description The ACPF-7003 FBAR filter has one input (Pin 1), one output (Pin 3) and two grounds (Pins 2 and 4.) · Demo board uses 3 mil Getek Microstrip. The demo board uses CPWG transmission lines for high isolation between the two ports. It uses via holes to connect the CPWG line from the underside of the board to the filter mounting pads on top.
Note: For best performance, try to reproduce this board stack up closely. If GroundSignal-Ground (GSG) type board is used, better return loss can be achieved since it eliminates connector mismatch.
Figure 7. Board stack up description
0.7 mils 3 mils 0.7 mils 28 mils
Input connection TOP BACK
Demo boards Demo boards are available for sampling. (See board drawing in Figures 7, 8, and 9.)
Output connection
Figure 8. PCB Footprint pad
Figure 9. Closer look at the recommended board footprint and soldermask
1.0 MAX
Pin 1 Marking
Figure 10. Detailed Bottom, Side and Top view of Package (dimensions in mm)
LAYER 1 0.61 0.70 0.61 0.30
0.33 1.92 Dimension in mm
Via to layer 2
This region is Soldermask covering ground
Region (4) & (2) is exposed ground for soldering filter pads
Figure 11. Suggested PCB layers
LAYER 2 (GROUND layer)
SIDE VIEW
Alloy type
Sn42Bi58 Sn43Pb43Bi14 Sn63Pb37 Sn60Pb40 Sn91 / Zn9 Sn96.2Ag2.5Cu0.8Sb0.5
Melting temperature (oC)
Recommended working temperature (oC)
Alloy type
Sn95.8Ag3.5Cu0.7 Sn96.5Ag3.5 Sn100 Sn95Sb5 Sn97Cu3
Melting temperature (oC)
Recommended working temperature (oC)
300 250 200 Temperature, °C 150 100 50 0 0 50 100 150 Time, seconds 200 250 300 Tested profile shown.
Figure 12. Recommended solder profile
1.0 MIN.
USER DIRECTION OF UNREELING
Figure 13. Carrier tape drawing
8° typ
Figure 14. Reel drawing
Notes: 1. Cover tape material is clear polyester film coated with heat activated and anti static properties. 2. All dimensions are in mm except tape length. 3. Surface resistivity: 1010 to 1011 Ohms / sq.
CARRIER TAPE
USER FEED DIRECTION
COVER TAPE
Figure 15. Tape and reel orientation
Pin 1 Position Empty Pocket / Cavity Leader : 125 Pocket - 1 Trailer : 125 Pocket - 1 : Pin 1 Location A : WORK WEEK B : DATE CODE C, D : LOT NUMBER A C
User Feed Direction
B D End View
Top View Figure 16. Device orientation in the carrier tape
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