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Tolerant 350K Used Gates CMOS Gates MG2RT Description M
Top Searches for this datasheetFull Range Matrices with 480K Gates Drawn CMOS, Metal Layers, Gates DPRAM Compilers Library Optimized Synthesis, Floor Plan Automatic Test Generation (ATG) Volts Operation; Single Dual Supply Mode High Speed Performances: NAND2 Propagation Delay 4.5V, 2.7V Toggle Frequency 4.5V, 2.7V Programmable Available upon Request High System Frequency Skew Control through Clock Tree Synthesis Software Power Consumption: 1.96 µW/Gate/MHz µW/Gate/MHz Integrated Power Reset Matrices with Fully Programmable Pads Standard I/Os Versatile Cell: Input, Output, I/O, Supply, Oscillator CMOS/TTL/PCI Interface Latch-up Protected High Noise Immunity: with Slew Rate Control Internal Decoupling Signal Filtering between Periphery Core Application Dependent Supply Routing Several Independant Supply Sources Wide Selection MQFPs MCGA Packages Pins Delivery Form with 94.6 Pitch Advanced Support: Floor Plan, Proprietary Delay Models, Timing Driven Layout, Power Management Cadence®, Mentor®, Vital® Synopsys® Reference Platforms EDIF VHDL Reference Formats Available Military Space Quality Grades (SCC, MIL-PRF-38535) Single Event Latch-up below threshold 80MeV/mg/cm2 Tested Total Dose Krad (Si) according Method 1019 with 5962-00B02 Tolerant 350K Used Gates CMOS Gates MG2RT Description MG2RT series micron, array based, CMOS product family. Several arrays 480K gates cover most system integration needs. MG2RT manufactured using micron drawn, metal layer CMOS process, called SCMOS 3/2RT. base cell architecture MG2RT series provides high routability logic with extremely dense compiled memories: DPRAM. generated using synthesis tools. Accurate control clock distribution achieved hardware (Clock Tree Synthesis) software. noise prevention techniques applied array periphery: three more independent supplies, internal decoupling, customiszation dependent supply routing, noise filtering, skew controlled I/Os, swing differential I/Os, contribute improve noise immunity reduce emission level. MG2RT supported advanced software environment based industry standards linking proprietary commercial tools. Verilog, Modelsym Design Compiler reference front-end tools. Floor planning associated with timingdriven layout provides short back-end cycle. MG2RT library allows straight forward migration from MG1RT Gates. netlist based this library simulated either MG2RT MG2RTP. also simulated provided there hardened cells. Table List Available MG2RT Matrices Type MG2044E MG2091E MG2194E Total Gates 44616 91464 193800 264375 361680 481143 Typical Usable Gates 31200 64000 135600 185000 253100 336800 Total Pads Maximum Programmable MG2265E MG2360E MG2480E Note: available designs. Libraries MG2RT cell library been designed take full advantage features offered both logic test synthesis tools. Design testability assured full support SCAN, JTAG (IEEE 1149) BIST methodologies. More complex macro functions available VHDL, such Two-wire Interface (TWI), UART, Timer. Block Generators Block generators used create customer specific simulation model metallisation pattern regular functions like DPRAM. basic cell architecture allows cell DPRAM. main characteristics these generators summarised below. Maximum Size (bits) Typical Characteristics Kbits) Bits/Word 1-36 1-36 Access Time (ns) Used Cells Function DPRAM MG2RT 4115L-AERO-06/05 MG2RT Buffer Interfacing Flexibility Inputs buffers configured input, output, bi-directional, oscillator supply. level translator located close each buffer. Input buffers with CMOS thresholds non-inverting feature versions with without hysteresis. CMOS input buffers incorporate pull-up pull down terminators. special purposes, buffer allowing direct input matrix core available. Several kinds CMOS output drivers offered: fast buffers with drive noise buffers with drive Outputs Clock Generation Clock Generation Atmel offers different types oscillators: high frequency crystal oscillators oscillators. devices, mark-space ratio better than 40/60 start-up time less than Frequency (MHz) Oscillators Xtal Xtal Xtal Xtal 100M Typical Consumption (mA) Contact factory. 4115L-AERO-06/05 Power Supply Noise Protection speed density SCMOS3/2RT technology cause large switching current spikes example when: either high current output buffers switch simultaneously, 480,000 gates switching within window Sharp edges high currents cause some parisitic elements packaging become significant. this frequency range, package inductance series resistance should taken into account. known that inductor slows down settling time current causes voltage drops power supply lines. These drops affect behavior circuit itself disturb external application (ground bounce). order improve noise immunity core matrix, several mechanisms have been implemented inside arrays. kinds protection have been added: limit buffer switching noise other protect buffers against switching noise coming from matrix. Buffers Switching Protection Three features implemented limit noise generated switching current: power supplies input output buffers separated. rise fall times output buffers controlled internal regulator. design rule concerning number buffers connected same power supply line been imposed. Matrix Switching This noise disturbance caused large number gates switching simultaneously. allow Current Protection this without impacting functionality circuit, three features have been added: Decoupling capacitors integrated directly silicon reduce power supply drop. power supply network been implemented matrix. This solution reduces number parasitic elements such inductance resistance constitutes artificial Ground plane. mesh network supplies approximately cells. pass filter been added between matrix input output buffer. This limits transmission noise coming from ground supply matrix external world output buffers. MG2RT 4115L-AERO-06/05 MG2RT Packaging Atmel offers wide range packaging options which listed below: Pins Package Type(1) min/max Lead Spacing (mils) MQFP Note: Contact Atmel local design centers check availability matrix/package combination. 4115L-AERO-06/05 Design Flows Tools Design Flows Modes generic design flow MG2RT array illustrated below. down design methodology proposed which starts with high level system description refined successive design steps. each step, structural verification performed which includes following tasks: Gate level logic simulation comparison with high level simulation results. Design test rules check. Power consumption analysis. Timing analysis (only after floor plan). System specification, preferably VHDL form. Functional description level. Logic synthesis. Floor planning bonding diagram generation. Test/Scan insertion, and/or fault simulation. Physical cell placement, JTAG insertion clock tree synthesis. Routing. main design stages are: meet various requirements designers, several interface levels between customer Atmel possible. each possible design modes review meeting required data transfer from user Atmel. cases final routing verifications performed Atmel. design acceptance formalized design review which authorizes Atmel proceed with sample manufacturing. MG2RT 4115L-AERO-06/05 MG2RT Figure MG2RT Design Flow System Specifications Simulation Logic synthesis Floor Plan Bonding diagram Gate Level Simulation Scan insertion Fault Simulation Placement JTAG insertion Clock Tree Synthesis Routing Extract Backannotated Simulation Sign-off Samples Manufacturing Test 4115L-AERO-06/05 Design Tool Design Kits (DK) basic content design described table below. interface formats from Atmel rely IEEE industry standard: VHDL functional descriptions VHDL EDIF netlists Tabular, .VCD simulation results (VITAL format) back annotation physical floor plan information design kits supported several commercial tools listed below. Design Support Cadence/Verilog (RTL gate), Logic Design Planner Mentor/Modelsim (RTL gate), Velocity, Architect, Flex Test Synopsys, Design Compiler, PrimeTime Vital Table Design Description Design Tool library Design manual libraries Synthesis library Gate level simulation library Design rules analyser Power consumption analyser Floor plan library Timing analyser library Package bonding software Scan path JTAG insertion fault simulation library Atmel Software Name Third Party Tools STAR COMET Note: Refer "Design kits cross reference tables" ATD-TS-WF-R0181 MG2RT 4115L-AERO-06/05 MG2RT Electrical Characteristics Absolute Maximum Ratings Ambient temperature under bias (TA) Military +125°C Junction temperature. 175°C Storage temperature. +150°C TTL/CMOS: Supply voltage -0.5V voltage .-0.5V 0.5V Note: Stresses above those listed cause permanent damage device. Exposure absolute maximum rating conditions extended period affect device reliability. Characteristics Table Characteristics Specified Symbol Parameter Input voltage CMOS input input Input HIGH voltage(3) CMOS input input Output voltage Output HIGH voltage Schmitt trigger positive threshold CMOS input input Schmitt trigger negative threshold CMOS input input CMOS hysteresis 25°C/5V hysteresis 25°C/5V Input leakage pull up/down Pull Pull down 3-State Output Leakage current Output Short circuit current IOSN IOSP ICCSB ICCOP Leakage current cell Operating current cell 0.39 Unit Conditions =24, mA(1) =-24, -12, mA(1) -120 Delta BOUT3 BOUT6 BOUT12 BOUT24 µA/MHz/gate 10.0 0.58 Notes: According buffer: Bout24, Bout12, Bout6, Bout3. Supplied design limit guaranteed tested. more than output time shorted maximum duration seconds. Without Schmitt trigger. 4115L-AERO-06/05 Table Characteristics Specified 0.3V Symbol Parameter Input voltage(3) LVCMOS input LVTTL input Input HIGH voltage(3) LVCMOS input LVTTL input Output voltage LVTTL Output high voltage LVTTL Schmitt trigger positive threshold LVCMOS input LVTTL input Schmitt trigger negative threshold LVCMOS input LVTTL input CMOS hysteresis 25°C/3V hysteresis 25°C/3V Input leakage pull up/down Pull Pull down 3-State Output Leakage current Output Short circuit current IOSN IOSP ICCSB ICCOP Leakage current cell Operating current cell Unit Conditions IOL=12, mA(1) IOH= mA(1) Delta BOUT3 BOUT6 BOUT12 BOUT24 µA/MHz/gate 0.25 Notes: According buffer: Bout24, Bout12, Bout6, Bout3. Supplied design limit guaranteed tested. more than output time shorted maximum duration seconds. Without Schmitt trigger. MG2RT 4115L-AERO-06/05 MG2RT Characteristics Table Characteristics 25°C, Process typical (all values Buffer BOUT12 Description Output buffer with drive Load Tphl Tplh BOUT3 Output buffer with drive Tphl Tplh BOUTQ noise output buffer with drive Tphl Tplh B3STA3 3-state output buffer with drive Tphl Tplh B3STA12 3-state output buffer with drive Tphl Tplh B3STAQ noise 3-state output buffer with drive Tphl 4.42 6.34 2.79 3.01 3.72 4.61 4.89 2.64 6.44 4.07 4.36 4.73 6.24 7.35 4.86 2.97 6.36 4.48 2.76 4.63 3.64 7.22 Transition Tplh 2.53 3.91 4115L-AERO-06/05 Table Characteristics 25°C, Process typical (all values Cell BINCMOS Description CMOS input buffer Load Tphl Tplh BINTTL input buffer Tphl Tplh Inverter Tphl Tplh NAND2 input NAND Tphl Tplh Tphl FDFF flip-flop, Tplh BUF4X High drive internal buffer Tphl Tplh NOR2 2-Input gate Tphl Tplh OAI22 4-input INVERT gate Tphl Tplh Tphl OSFF flip-flop with scan input, 0.56 -0.34 -0.6 0.42 0.83 1.00 0.54 1.23 1.38 0.37 0.68 0.45 1.14 0.58 0.65 0.81 1.08 0.33 -0.12 0.76 0.44 -0.24 0.66 0.68 1.21 1.02 0.42 0.73 0.53 1.11 0.52 0.75 1.06 1.31 Transition Tplh 0.77 1.14 MG2RT 4115L-AERO-06/05 Atmel Corporation 2325 Orchard Parkway Jose, 95131, Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Operations Memory 2325 Orchard Parkway Jose, 95131, Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 RF/Automotive Theresienstrasse Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 1150 East Cheyenne Mtn. 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