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Kyocera's series Multilayer Ceramic Chip Capacitors designed meet wide variety needs. offer complete range products both general specialized applications, including general-purpose series, high-voltage series profile series, series automotive uses.
have factories worldwide order supply global customer bases quickly efficiently maintain reputation highest-volume producers industry. products highly reliable their monolithic structure high-purity superfine uniform ceramics their integral internal electrodes. combining superior manufacturing technology materials with high dielectric constants, produce extremely compact components with exceptional specifications. stringent quality control every phase production from material procurement shipping ensures consistent manufacturing super quality. Kyocera components available wide choice dimensions, temperature characteristics, rated voltages, terminations meet specific configurational requirements.
Free
RoHS Compliant
series General
series Arrays
series Profile
series High-Voltage
series Automotive
Structure
External Termination Electrodes
Nickel Barrier Termination Products
Internal Electrodes (Pd, Dielectric Ceramic Layer
CuNi Plating Plating
Temperature compensation: Titanate family Zirconate family High dielectric constant: Barium Titanate family
Tape Reel
Bulk Cassette
Please contact your local AVX, Kyocera sales office distributor specifications covered this catalog. products continually being improved. result, capacitance range each series subject change without notice. Please contact sales representative confirm compatibility with your application.
Kyocera Ceramic Chip Capacitors available different applications classified below: Series Dieletric Options (NP0) Typical Applications Features Terminations Available Size
General Purpose
Wide Range
Nickel Barrier
0201, 0402, 0603 0805, 1206, 1210 1812
(NP0)
High Voltage Power Circuits
High Voltage 250VDC, 630VDC 1000VDC, 2000VDC 3000VDC, 4000VDC
Nickel Barrier
0805, 1206, 1210 1812, 2208, 1808 2220
(NP0)
PLCC (Decoupling)
Profile
Nickel Barrier
0402, 0603, 0805 1206, 1210
Automotive
Thermal shock Resistivity High Reliability Reduction Placing Costs
Nickel Barrier
0603, 0805, 1206
option
(NP0) X5R,
Digital Signal Pass line
Nickel Barrier
0405, 0508
Dimensions
External Electrode
Dimensions
Tape Reel
Size
CODE 0201 0402 0603 0805 1206 1210 1808 1812 2208 2220
CODE 0603 1005 1608 2012 3216 3225 4520 4532 5720 5750
Dimensions (mm) 0.6±0.03 1.0±0.05 1.6±0.10 2.0±0.10 3.2±0.20 3.2±0.20 4.5±0.20 4.5±0.30 5.7±0.40 5.7±0.40 0.3±0.03 0.5±0.05 0.8±0.10 1.25±0.10 1.60±0.15 2.50±0.20 2.00±0.20 3.20±0.20 2.00±0.20 5.00±0.40 min. 0.13 0.15 0.20 0.20 0.30 0.30 0.15 0.30 0.15 0.30 max. 0.23 0.35 0.60 0.75 0.85 1.00 0.85 1.10 0.85 1.40 min. 0.20 0.30 0.50 0.70 1.40 1.40 2.60 2.00 4.20 2.50 max. 0.33 0.55 0.90 1.35 1.75 2.70 2.20 3.00 2.20 2.70
(Thickness) depends capacitance value. Standard thickness shown appropriate product pages. series (please refer applicable page)
Bulk Cassette
Size CODE 0402 0603 0805 CODE 1005 1608 2012 1.0±0.05 1.6±0.07 2.0±0.1 0.5±0.05 0.8±0.07 1.25±0.1 0.5±0.05 0.8±0.07 1.25±0.1 min. 0.15 0.20 0.20 max. 0.35 0.60 0.75 min. 0.30 0.50 0.70
Note) Regarding support Bulk cases, please contact further information.
Multilayer Ceramic Chip Capacitors Ordering Information
KYOCERA PART NUMBER: SERIES CODE
General Purpose High Voltage Profile Automotive Capacitor Arrays
SIZE CODE
SIZE (JIS) 0201 (0603) 0402 (1005) 0603 (1608) 0508 (1220)/ 4cap SIZE (JIS) 0805 (2012) 1206 (3216) 1210 (3225) 1808 (4520) 1812 (4532) SIZE (JIS) 2208 (5720) 2220 (5750) 0405 (1012)/ 2cap 0508 (1220)/ 2cap
DIELECTRIC CODE
CODE CODE (NPO) (Option) (Option) Negative dielectric types available request.
CAPACITANCE CODE
Capacitance expressed significant digits plus number zeros. Values 10pF, Letter denotes decimal point, 100000pF 1.5pF 0.1µF 0.5pF 4700pF 100µF
TOLERANCE CODE
±0.05pF (option) ±0.1pF (option) ±0.25pF ±0.5pF ±1pF ±10% ±20% +80%
VOLTAGE CODE
4VDC 6.3VDC 10VDC 16VDC 25VDC 35VDC 50VDC 100VDC 250VDC 400VDC 630VDC 1000 2000 3000 4000 1000VDC 2000VDC 3000VDC 4000VDC
TERMINATION CODE
Nickel Barrier
PACKAGING CODE
Bulk Bulk Cassette (option) Reel Taping Cavity pitch Reel Taping Cavity pitch Reel Taping Cavity pitch Reel Taping Cavity pitch
OPTION
Thickness max. value indicated series 1.25mm max. 0.95mm max.
Multilayer Ceramic Chip Capacitors Temperature Characteristics Tolerance
High Dielectric Constant
Dielectric Temperature Range 85°C 125°C 125°C 105°C 85°C max. ±15% ±22% +22%
Temperature Compensation Type
Electric Code Value (pF) N750 +350 -1000
±250ppm/ ±120ppm/ ±60ppm/ ±30ppm/ e.g. 0±30ppm/ Note: parts will marked "CG" will conform above table.
Available Tolerances
Dielectric materials, capacitance values tolerances available following combinations only: Dielectric Tolerance C=±0.25pF D=±0.50pF F=±1pF
Standard Number
<0.5pF 10pF Series Series Series (Option) Capacitance <10pF
A=±0.05pF B=±0.1pF G=±2% J=±5% K=±10%
K=±10%
M=±20% Z=-20% +80%
Note: Nominal values below 10pF available standard values 0.5pF, 1.0pF, 1.5pF, 2.0pF, 3.0pF, 4.0pF, 5.0pF, 6.0pF, 7.0pF, 8.0pF, 9.0pF (X5R) available request. option
Series Profile Applications Nickel Barrier Terminations
[RoHS Compliant Products]
This profile series ideal where height clearance limited.
Applications
Circuits requiring compact, low-profile design, such smart cards.
Dielectric
Size (EIA Code)
Rated Voltage (VDC) Capacitance (pF)
1000 2200 4700 10000 22000 47000 100000 220000 470000 1000000 2200000 4700000 10000000
CT05 (0402)
CT105 (0603)
CT21 (0805)
CT316 (1206)
CT32 (1210)
series: Option Optional Spec.
Dielectric
Size (EIA Code)
Rated Voltage (VDC) Capacitance (pF)
1000 2200 4700 10000 22000 47000 100000 220000 470000 1000000
Dielectric
CT05 (0402) Size (EIA Code)
CT05 (0402)
Rated Voltage (VDC) Capacitance (pF)
1000 2200 4700 10000 22000 47000 100000 220000 470000 1000000 2200000 4700000 10000000
Series: Option
Size Thickness (mm)
Taping (180 reel) Taping (330 reel)
105, 316,
0.35 max. 10kp (P8) (P8)
0.55 max. (P8) 10kp (P8)
max. (P8) 10kp (P8)
0.95 max. (P8) 10kp (P8)
max. (E8) 10kp (E8)
1.25 max. (E8) 10kp (E8)
max. (E8) (E8)
Note: width paper tape 12mm width plastic width plastic tape option Carrier tape pitch from capaitor another.
Multilayer Ceramic Chip Capacitors Electrical Characteristics
Capacitance-Temperature (temperature compensation)
Aging (change capacitance over time)
temperature compensation: 1MHz, 1Vrms/ high dielectric constant: 1kHZ, 1Vrms
1MHz, 1Vrms
DCapacitance
DCapacitance
Initial value should after 48hr. Heat treatment. 1,000 Duration (hrs.) 10,000 100,000
Temperature
Capacitance-Temperature (high dielectric constant)
X7R,
Capacitance
Impedance-Frequency
1kHz, 1Vrms 0VDC
Impedance
1Vrms
0.01 0.001
0VDC
Temperature
1,000
10,000
Frequency (MHz)
Bias
temperature compensation 1MHz, 1Vrms high dielectric constant 1kHz, 1Vrms
Voltage
Rated 25V: X7R,
DCapacitance
Rated 25V: X7R,
temperature compensation: 1MHz Vrms/ high dielectric constant: 1kHz
Voltage (Vrms)
Please verify individual characteristics design stage ensure total suitability
Multilayer Ceramic Chip Capacitors Test Conditions Standards
Test Conditions Specifications Temperature Compensation type Characteristics)
Test Items Capacitance Value Specifications nominal capacitance) Within tolerance C30pF: Q1000 C<30pF: Q400+20C Test Conditions C1000pF C>1000pF 1MHz±10% 1kHz±10% 5Vrms
Insulation resistance (IR) 10,000M 500M min., whichever less Dielectric resistance Appearance Termination strength Bending strength Vibration test Appearance Soldering heat resistance Appearance
Withstand voltage
Measured after rated voltage applied minute normal room temperature humidity. Apply times rated voltage seconds.
problem observed problem observed problem observed mechanical damage bent significant change detected Within tolerance C30pF: Q1000 C<30pF: Q400+20C significant change detected ±2.5% ±0.25pF max., whichever larger C30pF: Q1000 C<30pF: Q400+20C 10,000M 500M min., whichever smaller Resists without problem termination: min.
Microscope
Apply sideward force 500g (5N) PCB- mounted sample. Glass epoxy (t=1.6mm); fulcrum Spacing: 90mm; seconds.
Vibration frequency: (Hz) Amplitude: 1.5mm Sweeping condition: 105510Hz/ min. directions: hours each Total hours Soak sample 260°C±5°C solder 10±0.5 seconds place room normal temperature humidity; measure after 24±2 hours. (Preheating Conditions) Order Temperature 100°C 200°C 235±5°C 245±5°C Time minutes minutes 2±0.5 sec. 3±0.5 sec.
Soaking Condition Solderability Temperature cycle Appearance Sn63 Solder Sn-3Ag-0.5Cu
significant change detected ±2.5% ±0.25pF max., whichever larger C30pF: Q1000 C<30pF: Q400+20C 10,000M 500M min., whichever samller
(Cycle) Normal room temperature min.) Lowest operation temperature min.) Normal room temperature min.) Highest operation temperature min.) After five cycles, measure after 24±2 hours.
Withstand voltage Resists without problem
Load humidity test
Appearance
significant change detected ±7.5% ±0.75pF max., whichever larger C30pF: Q200 C<30pF: Q100+10C/ 500M min., whichever smaller significant change detected ±0.3pF max., whichever larger C30pF: Q350 10pFC<30pF: Q275+5C/ C<10pF: Q200+10C 1,000M min., whichever smaller
After appling rated voltage 500+24/ hours pre-condition 40±2°C, humidity 95%RH allow parts stabilize 48±4 hours, room temperature before making measurements.
High- temperature with loading
Appearance
After applying twice rated voltage temperature 125±3°C 1000+48/ hours, measure sample after storing 24±2 hours.
series, times when rated voltage 250V; use/ times when rated voltage exceeds 630V. 0201 Size Apply 500V minute case rated voltage 630V higher.
Except series. charge discharge current capacitor must exceed 50mA.
Multilayer Ceramic Chip Capacitors Test Conditions Standards
Test Conditions Specifications High Dielectric Type (X5R, X7R, Y5V)
Test Items Capacitance Value Specifications X7R/ Within tolerance
2.5% max., 3.5% max. (2), 7.0% max. (12) 5.0% max. (3), 7.5% max. (17) 5.0% max., 7.0% max. (13) 9.0% max. (4), 12.5% max.
Test Conditions previous treatment Capacitance Fire
C10µF C>10µF
1kHz±10% 1.0±0.2Vrms 120Hz±10% 0.5±0.1Vrms
Insulation resistance (IR) (15) 10,000M 500M min., whichever less Dielectric resistance (15) Appearance Termination strength Bending strength test Vibration test Appearance Soldering heat resistance Appearance (15) problem observed problem observed problem observed problem observed bent significant change detected Within tolerance Satisfies initial value significant change detected Within ±7.5% Satisfies initial value 10,000M 500M min., whichever smaller Within ±20%
Measured after rated voltage applied minutes normal room temperature humidity. (10) Apply times rated voltage seconds.
Microscope
Apply sideward force 500g (5N) (16) PCB-mounted sample. Glass epoxy (03, type Series: T=0.8mm); fulcrum Spacing: 90mm; seconds.
Vibration frequency: (Hz) Amplitude: 1.5mm Sweeping condition: 105510Hz/ min. directions: hours each Total hours previous treatment Soak sample 260°C±5°C solder 10±0.5 seconds place room normal temperature humidity; measure after 48±4 hours. (Preheating Conditions) Order Temperature 100°C 200°C 235±5°C 245±5°C Time minutes minutes 2±0.5 sec. 3±0.5 sec.
Withstand voltage (15) Resists without problem
Soaking Condition Solderability Temperature cycle Appearance (15) termination: min. significant change detected Within ±7.5% Satisfies initial value 10,000M 500M min., whichever samller Within ±20% Sn63 Solder Sn-3Ag-0.5Cu
previous treatment (Cycle) Normal room temperature min.) Lowest operation temperature min.) Normal room temperature min.) Highest operation temperature min.) After five cycles, measure after 48±4hours. previous treatment After applying rated voltage 40±2°C humidty 95%RH, 500+24/ hours keep room condition 48±4 hours then measure check specification limits. previous treatment After applying twice rated voltage highest operating temperature 1000+48/ hours, measure sample after storing 48±4 hours.
Withstand voltage (15) Resists without problem
Load humidity test (11)
Appearance (15)
significant change detected Within ±12.5% 200% max. initial value Within ±30% 150% max. initial value
500M min., whichever smaller significant change detected Within ±12.5% 200% max. initial value Within ±30% 150% max. initial value
High- temperature with loading
Appearance (15)
1,000M min., whichever smaller
times when rated voltage 250V over. times when rated voltage 630V over. 16V/ type. Apply X5R16V/ type, 6.3V/ type. Apply type, CM32Y5V335 (25V Type). Apply 6.3V/ type. Apply max. CM21Y5V106/ CM316Y5V226. Exclude series with thickness less than 0.66mm series. times when rated voltage 6.3V/ 10V/ 250V 100V (32X7R474/ 43X7R105/ 55X7R105). times when rated voltage 630V over. Keep specimen 150°C+0/ -10°C hour, leave specimen room ambient 48±4 hours. Apply same test condition hour, then leave specimen room ambient 48±4 hours.
series over 630V, apply 500V minutes room ambient. Except series. Apply type. Apply series CM105Y5V154 over, CM21Y5V105 over, 316Y5V155 over. Measurement condition 1kHz, 1Vrms Y5V, C<47µF type. charge/ discharge current capacitor must exceed 50mA. 0201 Size Apply 6.3V type.
above test conditions standards apply products with optional specifications.
Multilayer Ceramic Chip Capacitors Packaging Options
Tape Reel
Reel
(Unit:
Reel
Code Reel 7-inch Reel (CODE: 13-inch Reel (CODE: Code Reel 7-inch Reel (CODE: 13-inch Reel (CODE:
-2.0 330±2.0
min.
13±0.5 100±1.0 10.0±1.5 2.0±0.5 9.5±1.0 16.5 max.
21±0.8
Carrier tape width 8mm. size (1808) over, Tape width 12mm 14±1.5, 18.4mm max.
F=2mm (03, Type)
Feed Hole
Carrier Tape
Punched rectangular hole hold capacitor
(Unit:
(Paper)
Type
0.37±0.03 0.65±0.1 1.0±0.2 1.15±0.1 1.5±0.2 1.5±0.2 1.5±0.2 2.0±0.2 2.9±0.2 2.4±0.2 3.6±0.2 2.4±0.2 5.3±0.2
0.67±0.03 1.15±0.1 1.8±0.2 1.55±0.1 2.3±0.2 2.3±0.2 2.3±0.2 3.6±0.2 3.6±0.2 4.9±0.2 4.9±0.2 6.0±0.2 6.0±0.2
2.0±0.05 2.0±0.05 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 8.0±0.1 4.0±0.1 8.0±0.1
Type: max. Type: 0.75 max. Type: max.
F=4mm (105, D11, D12, F12, 316, Type)
(Plastic)
Feed Hole
(Paper)
Punched rectangular hole hold capacitor
max.
Holes only plastic carrier tape.
max.
max.
F=8mm (43, Type)
(Plastic)
Feed Hole Punched rectangular hole hold capacitor
max.
(Unit:
±0.05 ±0.1 ±0.1
Carrier Tape Paper
Plastic
±0.3
±0.05 1.75 ±0.1 ±0.05 ±0.1 +0.1/
max.
Bulk Cassette
(Unit:
Slider Shutter
12mm Plastic
12.0 ±0.3
±0.05
Connection Area
Multilayer Ceramic Chip Capacitors Precautions
Circuit Design
Once application assembly environments have been checked, capacitor used conformance with rating performance which provided both catalog specifications. exceeding that which specified result inferior performance cause short, open, smoking, flaming occur, etc. Please consult manufacturer advance when capacitor used devices such devices which deal with human life, i.e. medical devices; devices which highly public orientated; devices which demand high standard liability. Accident malfunction devices such medical devices, space equipment devices having with atomic power could generate grave consequence with respect human lives possibly, portion public. Capacitors used these devices require high reliability design different from that general purpose capacitors. Please capacitors conformance with operating temperature provided both catalog specifications. especially cautious exceed maximum temperature. situation maximum temperature forth both catalog specifications exceeded, capacitor's insulation resistance deteriorate, power suddenly surge short-circuit occur. capacitor loss, self-heat equivalent series resistance when alternating electric current passed therethrough. this effect becomes especially pronounced high frequency circuits, please exercise caution. When using capacitor (self-heating) circuit, please make sure surface capacitor remains under maximum temperature usage. Also, please make certain temperature rises remain below 20°C. Please keep voltage under rated voltage which applied capacitor. Also, please make certain peak voltage remains below rated voltage when voltage super-imposed voltage. situation where pulse voltage employed, ensure average peak voltage does exceed rated voltage. Exceeding rated voltage provided both catalog specifications lead defective withstanding voltage worst case situations, cause capacitor smoke flame. When capacitor employed circuit which there continuous application high frequency voltage steep pulse voltage, even though within rated voltage, please inquire manufacturer. situation capacitor employed using high frequency voltage extremely fast rising pulse voltage, even though within rated voltage, possible capacitor reliability will deteriorate. common phenomenon high-dielectric products have deteriorated amount static electricity application voltage. caution necessary degree deterioration varies depending quality capacitor materials, capacity, well load voltage time operation. capacitor environment where might easily exceed respective provisions concerning shock vibration specified catalog specifications. addition, common piezo phenomenon high dielectric products have some voltage vibration have noise voltage change. Please contact sales such case. electrostatic capacity value delivered capacitor within specified tolerance, please consider this when designing respective product order that assembled product function appropriately. Please contact upon using conductive adhesives.
Storage
component stored minimal packaging heat-sealed chuck-type plastic bag), should kept closed. Once been opened, reseal store desiccator. Keep storage place temperature degree humidity storage atmosphere must free containing sulfur chlorine. Also, avoid exposing product saline moisture. product exposed such atmospheres, terminals will oxidize solderability will effected. Precautions apply chip capacitors packaged carrier tapes bulk cases. solderability assured months from shipping date (six months silver palladium) above storage precautions followed. Chip capacitors crack exposed hydrogen (H2) while sealed coated with silicon, which generates hydrogen gas.
Multilayer Ceramic Chip Capacitors Surface Mounting Information
Dimensions recommended typical land
Land Pattern Sample capacitor
Standard
Size
(Unit:
0.20 0.30 0.25 0.35 0.30 0.40 0.30 0.50 0.35 0.45 0.40 0.60 0.70 1.00 0.80 1.00 0.60 0.80 1.00 1.30 1.00 1.20 0.80 1.10 2.10 2.50 1.10 1.30 1.00 1.30 2.10 2.50 1.10 1.30 1.90 2.30 2.50 3.20 1.80 2.30 1.50 1.80 2.50 3.20 1.80 2.30 2.60 3.00 4.20 4.70 2.00 2.50 1.50 1.80 4.20 4.70 2.00 2.50 4.20 4.70
Soldering resist
series: Please refer applicable page.
When mounting capacitor substrate, important consider carefully that amount solder (size fillet) used direct effect upon capacitor once mounted. greater amount solder, greater stress elements. this cause substrate break crack, important establish appropriate dimensions with regard amount solder when designing land substrate. situation where more devices mounted onto common land, separate device into exclusive pads using soldering resist.
Automotive Series
Size
(Unit:
0.60 0.90 0.80 1.00 0.70 1.00 0.90 1.20 0.80 1.20 0.90 1.40 1.40 1.90 1.00 1.30 1.30 1.80
Ideal Solder Thickness
Chip Capacitor Solder
Typical mounting problems
Item recommended example Recommended example/ Separated solder
Solder resist
Multiple parts mount
Solder resist
Mount with leaded parts
Leaded parts Leaded parts
Soldering iron
Wire soldering after mounting
Wire
Solder resist
Solder resist
Solder resist
Overview
Multilayer Ceramic Chip Capacitors Surface Mounting Information
Mounting Design
chip could crack warps during processing after chip been soldered.
Recommended chip position minimize stress from warpage
(Not recommended)
(Ideal)
Actual Mounting
position vacuum nozzle low, large force applied chip capacitor during mounting, resulting cracking. During mounting, nozzle pressure static load minimize shock vaccum nozzle, provide support back minimize flexture.
Crack
Support
Bottom position pick nozzle should adjusted surface substrate which camber corrected. reduce possibility chipping cracks, minimize vibration chips stored bulk case. discharge pressure must adjusted part size. Verify pressure during setup avoid fracturing cracking chips capacitors.
Resin Mold
large amount resin used molding chip, cracks occur contraction stress during curing. avoid such cracks, shrinkage resin. insulation resistance chip will degrade moisture absorption. moisture absorption resin. Check carefully that resin does generate decomposition reaction during curing process during normal storage. Such gases crack chip capacitor damage device itself.
Multilayer Ceramic Chip Capacitors Surface Mounting Information
Soldering Method
Ceramic easily damaged rapid heating cooling. some heat shock unavoidable, preheat enough limit temperature difference (Delta within degree Celsius. product size used reflow wave soldering, product size over capacitor arrays used reflow. Circuit shortage smoking created using capacitors which used neglecting above caution. Please recommended soldering conditions.
Recommended Temperature Profile (62Sn Solder) Reflow
Peak temperature 230°C5°C seconds maximum More than180°C, seconds maximum Preheat Cool normal room temperature after removing from furnace.
Recommended Temperature Profile (Sn-3Ag-0.5Cu) Reflow
250°C5°C sec. max. 3°C/ sec. 180°C Preheat
Minimize soldering time. Ensure that allowable temperature difference does exceed 150°C. Ensure that allowable temperature difference does exceed 130°C 3.22.5mm size larger.
Wave
Sodering iron
Temperature iron chip Wattage shape soldering iron Soldering Time 380°C max. max. 3.0mm max. sec. max. Cautions Pre-heating necessary Rapid heating must avoided. Delta T150°C Avoid direct touching capacitors. Avoid rapid cooling after soldering. Natural cooling recommended.
Temperature Temperature
Temperature
220°C max. sec. max.
seconds
seconds
9030 sec. Minimize soldering time. Ensure that allowable temperature difference does exceed 150°C. Ensure that allowable temperature difference does exceed 130°C 3.22.5mm size larger.
Wave
Preheat
Cool normal room temperature
Preheat Cool normal room temperature
245°C 260°C
230°C 260°C
Temperature
sec.
sec. max.
sec.
sec. max.
Ensure that chip capacitor preheated adequately. Ensure that temperature difference does exceed 150°C. Cool naturally after soldering. Wave soldering applicable chips with size 3.2x2.5mm larger.
Ensure that chip capacitor preheated adequately. Ensure that temperature difference does exceed 150°C. Cool naturally after soldering. Wave soldering applicabel chips with size 3.22.5mm larger.

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