GEN3 Hexfred Technology Soft Reverse Recovery Hexfred Wafer Form

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GEN3 Hexfred Technology Soft Reverse Recovery Hexfred Wafer Form

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GEN3 Hexfred Technology Soft Reverse Recovery
Hexfred Wafer Form
600V IF(nom) =50A VF(typ)= 1.5V IF(nom) 25°C Power Supply Antiparallel Diode 125mm Wafer
HF50E060ACE
Benefits
Benchmark Efficiency Welding Applications Rugged Transient Performance Excellent Current Sharing Parallel Operation Qualified Industrial Market
Parameter Description Forward Voltage Drop Reverse Breakdown Voltage Reverse Leakage Current
Electrical Characteristics (Wafer Form)
Guaranteed (min, max) 0.94V min, 1.33V 600V 20µA Test Conditions 10A, 25°C 25°C, 25°C, 600V
Mechanical Data
Nominal Backmetal Composition, (Thickness) Nominal Front Metal Composition, (Thickness) Dimensions Wafer Diameter Wafer Thickness, Tolerance Relevant Mechanical Dwg. Number Minimum Street Width Reject Size Location Recommended Storage Environment Recommended Attach Conditions (1kA 6kA) Al/1% (3µm) 0.170'' 0.170" 125mm, with std. flat 381µm, +/-15µm 5645 100µm 0.25mm diameter minimum Consistent throughout same wafer Store original container, dessicated nitrogen, with contamination optimum electrical results, attach temperature should exceed 300°C
Outline
07/01/03
Document Number: 93810 www.vishay.com
Hexfred Wafer Form
Typ. Diode Recovery Waveform Vcc=300V, If=50A, Rg=22, L=200uH Tj=150°C, Driver=IRGC50B60U
HF50E060ACE
-100 -200
Current Voltage
-0.1 -0.05 0.05
Time (uS)
-300 -400 -500 -600 -700 -0.15
0.15
Fig. Typical Diode Forward Characteristics
25°C -40°C 150°C
Fig. Diode Recovery Circuit
DRIVER
Document Number: 93810
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Legal Disclaimer Notice
Vishay
Notice
products described herein were acquired Vishay Intertechnology, Inc., part acquisition International Rectifier's Power Control Systems (PCS) business, which closed April 2007. Specifications products displayed herein pending review Vishay subject terms conditions shown below. Specifications products displayed herein subject change without notice. Vishay Intertechnology, Inc., anyone behalf, assumes responsibility liability errors inaccuracies. Information contained herein intended provide product description only. license, express implied, estoppel otherwise, intellectual property rights granted this document. Except provided Vishay's terms conditions sale such products, Vishay assumes liability whatsoever, disclaims express implied warranty, relating sale and/or Vishay products including liability warranties relating fitness particular purpose, merchantability, infringement patent, copyright, other intellectual property right. products shown herein designed medical, life-saving, life-sustaining applications. Customers using selling these products such applications their risk agree fully indemnify Vishay damages resulting from such improper sale. International Rectifier®, IR®, logo, HEXFET®, HEXSense®, HEXDIP®, DOL®, INTERO®, POWIRTRAIN® registered trademarks International Rectifier Corporation U.S. other countries. other product names noted herein trademarks their respective owners.
Document Number: 99901 Revision: 12-Mar-07
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GEN3 Hexfred Technology Soft Reverse Recovery Hexfred Wafer Form

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