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N-Channel 20-V (D-S) MOSFET PRODUCT SUMMARY rDS(on) 0.003 0.
Top Searches for this datasheetSi7864ADP N-Channel 20-V (D-S) MOSFET PRODUCT SUMMARY rDS(on) 0.003 0.0042 (Typ) FEATURES TrenchFET® Power MOSFETS: Rated rDS(on) (Qgd Optimized Tested RoHS COMPLIANT APPLICATIONS PowerPAK® SO-8 Low-Side MOSFET Synchronous Buck DC/DC Converters Servers Routers 6.15 5.15 Bottom View Ordering Information: Si7864ADP-T1-E3 (Lead (Pb)-Free) N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current 150°C)a Pulsed Drain Current Pulse Width) Continuous Source Current (Diode Conduction)a Avalanche Current Maximum Power Dissipationa Operating Junction Storage Temperature Range Soldering Recommendations (Peak Temperature)b,c Symbol Tstg secs Steady State Unit THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambienta Maximum Junction-to-Case (Drain) Steady State Steady State Symbol RthJA RthJC Typical Maximum Unit °C/W Notes: Surface Mounted Board. Solder Profile PowerPAK SO-8 leadless package. lead terminal exposed copper (not plated) result singulation process manufacturing. solder fillet exposed copper cannot guaranteed required ensure adequate bottom side solder interconnection. Rework Conditions: manual soldering with soldering iron recommended leadless components. Document Number: 73166 S-60782-Rev. 08-May-06 www.vishay.com Si7864ADP SPECIFICATIONS unless otherwise noted Parameter Static Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductancea Diode Forward Voltage Dynamic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Symbol VGS(th) IGSS IDSS ID(on) rDS(on) Ciss Coss Crss td(on) td(off) Test Conditions VGS, Unit 0.0023 0.0032 0.70 5330 0.003 0.0042 1240 VGEN di/dt A/µs Notes: Pulse test; pulse width duty cycle Guaranteed design, subject production testing. Stresses beyond those listed under "Absolute Maximum Ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated operational sections specifications implied. Exposure absolute maximum rating conditions extended periods affect device reliability. TYPICAL CHARACTERISTICS unless noted thru Drain Current Drain Current Drain-to-Source Voltage Gate-to-Source Voltage Output Characteristics Transfer Characteristics www.vishay.com Document Number: 73166 S-60782-Rev. 08-May-06 Si7864ADP TYPICAL CHARACTERISTICS 0.005 unless noted 8500 DS(on) On-Resistance 0.004 0.003 0.002 Capacitance (pF) 6800 Ciss 5100 3400 0.001 1700 Crss Coss 0.000 Drain Current Drain-to-Source Voltage On-Resistance Drain Current Gate-to-Source Voltage rDS(on) On-Resistance (Normalized) Capacitance Total Gate Charge (nC) Junction Temperature (°C) Gate Charge 0.010 On-Resistance Junction Temperature DS(on) On-Resistance 0.008 Source Current 0.006 0.004 0.002 0.00 Source-to-Drain Voltage 0.000 Gate-to-Source Voltage Source-Drain Diode Forward Voltage On-Resistance Gate-to-Source Voltage Document Number: 73166 S-60782-Rev. 08-May-06 www.vishay.com Si7864ADP TYPICAL CHARACTERISTICS unless noted GS(th) Variance Power 0.001 0.01 Time (sec) Temperature (°C) Threshold Voltage Single Pulse Power *Limited rDS(on) Drain Current Single Pulse 0.01 0.01 Drain-to-Source Voltage *VGS minimum which rDS(on) specified Safe Operating Area, Junction-to-Case Normalized Effective Transient Thermal Impedance Duty Cycle Notes: 0.05 0.02 Duty Cycle, Unit Base thJA °C/W Single Pulse 0.01 Square Wave Pulse Duration (sec) PDMZthJA(t) Surface Mounted Normalized Thermal Transient Impedance, Junction-to-Ambient www.vishay.com Document Number: 73166 S-60782-Rev. 08-May-06 Si7864ADP TYPICAL CHARACTERISTICS unless noted Normalized Effective Transient Thermal Impedance Duty Cycle Single Pulse 0.05 0.02 0.01 Square Wave Pulse Duration (sec) Normalized Thermal Transient Impedance, Junction-to-Case Vishay Siliconix maintains worldwide manufacturing capability. Products manufactured several qualified locations. Reliability data Silicon Technology Package Reliability represent composite qualified locations. related documents such package/tape drawings, part marking, reliability data, Document Number: 73166 S-60782-Rev. 08-May-06 www.vishay.com Other recent searchesT10B - T10B T10B Datasheet SML20B56 - SML20B56 SML20B56 Datasheet PCIe-1429 - PCIe-1429 PCIe-1429 Datasheet MPC102 - MPC102 MPC102 Datasheet BFG480W - BFG480W BFG480W Datasheet AO4412 - AO4412 AO4412 Datasheet AO4412L - AO4412L AO4412L Datasheet AM2520SURCK08 - AM2520SURCK08 AM2520SURCK08 Datasheet
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