Preliminary TOSHIBA Linear Image Sensor (charge coupled device)
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TCD2914BFG
Preliminary TOSHIBA Linear Image Sensor
(charge coupled device)
TCD2914BFG
TCD2914BFG high sensitive dark current 10680 elements line color image sensor with 10680 elements line image sensor. sensor designed scanner. device contains 10680 elements line photodiodes which provide lines/mm (1200 dpi) across size paper. device operated pulse power supply.
Features
Weight: 2.0g (typ.) 10680 elements line
Number Image Sensing Elements: 10680 elements line Color Image Sensing Element Size: 2.625 2.625 centers Color 2.625m 5.25m 2.625m centers Photo Sensing Region: High sensitive dark current photodiode Distanced Between Photodiode Array: lines) array array, array array lines) array array
Clock: phase (5.0 Power Supply:12 Power Supply Voltage Internal Circuit: Clamp Circuit Package: CLCC Package Color Filter: Red, Green, Blue
Connections (top view)
Black&White 10680 10680 10680 10680
Maximum Ratings (Note1)
Characteristic Clock pulse voltage Shift pulse voltage Reset pulse voltage Clamp pulse voltage Switch pulse voltage Power supply voltage Operating temperature Storage temperature Symbol Topr Tstg -0.3~15 0~60 -25~85 -0.3~8.0 Rating Unit
Note voltage with respect terminals (ground).
2006-9-14
TCD2914BFG
Block Diagram
CLAMP
ANALOG SHIFT REGISTER 1(EVEN) SHIFT GATE S10679 S10680 PHOTO DIODE (B/W)
SHIFT GATE CLAMP ANALOG SHIFT REGISTER 2(ODD)
ANALOG SHIFT REGISTER SHIFT GATE S10679 S10680 CLAMP PHOTO DIODE
SHIFT GATE ANALOG SHIFT REGISTER
ANALOG SHIFT REGISTER SHIFT GATE S10679 S10680 CLAMP PHOTO DIODE
SHIFT GATE ANALOG SHIFT REGISTER
ANALOG SHIFT REGISTER SHIFT GATE S10679 S10680 CLAMP PHOTO DIODE
SHIFT GATE ANALOG SHIFT REGISTER
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TCD2914BFG
Names
Symbol Name Signal Output (red) Ground Clamp Gate Reset Gate Last stage transfer Clock (phase Color Last stage transfer Clock Color Connection Switch Gate Color Clock (phase Color Clock (phase Color Shift Gate Color Symbol Name Signal Output (green B/W) Signal Output (blue B/W) Power Last stage transfer Clock (phase Clock (phase Color Clock (phase Color Ground Clock (phase Clock (phase Shift Gate Shift Gate
Arrangement Effective Pixel (S1)
2.625 Photo Diode Arrays (10680 pixels line) 5.25
(=2.625m 24lines) Blue Photo Diode Arrays (10680 pixels line)
(=2.625m 24lines) Green Photo Diode Arrays (10680 pixels line)
(=2.625m 24lines)
Photo Diode Arrays (10680 pixels line)
2.625
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TCD2914BFG
Optical/Electrical Characteristics (Color 1200dpi Mode) 25°C, 5.0V (pulse), MHz, MHz, tINT light source light source CM500S filter mm),
Characteristics Sensitivity Green Blue Photo response uniformity Register imbalance Saturation output voltage Saturation exposure Dark signal voltage Dark signal uniformity power dissipation Total transfer efficiency Output impedance output voltage Reset noise Random noise Symbol PRNU PRNU VSAT VDRK DSNU VRSN 0.32 Typ. 0.47 10.0 1000 (Note9) (Note10) (Note3) (Note4) (Note5) (Note6) (Note7) (Note8) V/lxs (Note2) Unit Note
load resistance
load resistance
Characteristics Sensitivity Photo response uniformity Saturation output voltage Saturation exposure Dark signal voltage Dark signal uniformity power dissipation Total transfer efficiency Output impedance signal output voltage Reset noise Random noise
Optical/Electrical Characteristics (B/W 1200dpi Mode) 25°C, (pulse), MHz, MHz, tINT light source light source CM500S filter mm),
Symbol (B/W) PRNU PRNU VSAT VDRK DSNU VRSN 0.18 Typ. 11.2 0.26 13.5 10.0 1000 Unit V/lxs (Note (Note10) Note (Note2) (Note3) (Note4) (Note6) (Note7) (Note8)
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TCD2914BFG
Note Sensitivity defined each color signal outputs average when photosensitive surface applied with light uniform illumination uniform color temperature. Note PRNU defined each color single chip expressions below when photosensitive surface applied with light uniform illumination uniform color temperature. PRNU 100(%)
Where average total signal output maximum deviation from amount incident light shown below. 1/2SE Green 1/2SE Blue 1/4SE
Note PRNU defined maximum voltage with next pixel, where measured (typ.) Note Register imbalance defined follows. 10679 |Xn-X(n+1)|
Note VSAT defined minimum saturation output effective pixels. Note Definition SE(B/W) VSAT R(B/W) (lxs) SE(Color)= VSAT (lxs) R(G)
Note VDRK defined average dark signal voltage effective pixels. DSNU defined different voltage between VDRK VMDK when VMDK maximum dark signal voltage.
VDRK VMDK DSNU
Note signal output voltage defined follows. Reset Noise Voltage defined follows.
VRSN
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TCD2914BFG
Note Random noise defined standard deviation (sigma) output level difference between adjacent effective pixels under illumination (i.e. dark conditions) calculated following procedure.
video output Output waveform (effective pixels under dark condition) pixel video output
pixel
adjacent pixels (pixel after reference level clamp reading fixed measurement points. Each output level video output periods averaged over period subtracted from standard deviation calculated after procedure repeated times readings).
Procedure (2), repeated times sigma value. sigma values averaged.
value calculated using above procedure observed times larger than that measured relative ground level. specify random noise follows.
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TCD2914BFG
Operating Condition
Characteristics Clock pulse voltage Level Level Level Level Level Level Level Level Level Level Level Level Symbol 11.4 Typ. 12.0 12.6 Unit
Final Stage Clock voltage
V1B, V1D*
Shift pulse voltage
Reset pulse voltage
Clamp pulse voltage
Switch pulse voltage Power supply voltage
Clock Characteristics 25°C)
Characteristics Clock pulse frequency Reset pulse frequency Clamp pulse frequency Clock (1A) capacitance Color (Note Clock (2A) capacitance Color (Note Final Stage Clock capacitance (Note Clock (1D) capacitance (Note Clock (2D) capacitance (Note Shift gate capacitance Reset gate capacitance Clamp gate capacitance Switch gate capacitance Symbol C1A1, C1A2 C2A1, C2A2 C1B, Typ. 20.0 20.0 20.0 Unit
Note
Clocking Mode
Mode Clamp Line Clamp 1200DPI 600DPI 1200DPI 600DPI Pulse Pulse Pulse Pulse
Color
Pulse Pulse
Pulse
Pulse
Pulse
Pulse
Pulse
Pulse
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TCD2914BFG
Timing Chart Color 1200DPI Mode (Bit Clamp Mode)
("L") SH2, ("H") ("L")
tINT (integration time)
S10679
S10680
S10677
S10676
S10678
OS1,
DUMMY OUTPUTS elements)
LIGHT SHIELD OUTPUTS elements) elements) elements)
DUMMY OUTPUTS elements)
DUMMY OUTPUTS elements) TEST OUTPUTS elements)
DUMMY OUTPUTS elements)
SIGNAL OUTPUTS (10680 elements) LINE READOUT PERIOD (10776 elements)
DUMMY OUTPUTS elements)
2006-9-14
TCD2914BFG
Timing Chart Color 1200DPI Mode (Line Clamp Mode)
("L") SH2, ("H") ("L")
tINT (integration time)
S10679
S10680
S10677
S10676
S10678
OS1,
DUMMY OUTPUTS elements)
LIGHT SHIELD OUTPUTS elements) elements) elements)
DUMMY OUTPUTS elements)
DUMMY OUTPUTS elements) TEST OUTPUTS elements)
DUMMY OUTPUTS elements)
SIGNAL OUTPUTS (10680 elements) LINE READOUT PERIOD (10776 elements)
DUMMY OUTPUTS elements)
2006-9-14
TCD2914BFG
Timing Chart Color 600DPI Mode (Bit Clamp Mode)
("L")
tINT (integration time)
SH2, ("H") ("L")
S10675+S10676
S10677+S10678
S10679+S10680
D20+D21
D70+D71
D72+D73
S1+S2 D74+D75
D80+D81
D86+D87
D88+D89
D90+D91
D22+D23
D24+D25
D26+D27
D76+D77
D78+D79
D92+D93
D94+D95
D0+D1
D2+D3
S3+S4
OS1,
DUMMY OUTPUTS elements)
LIGHT SHIELD OUTPUTS elements) elements)
DUMMY OUTPUTS elements) elements)
DUMMY OUTPUTS elements)
DUMMY OUTPUTS elements)
element) SIGNAL OUTPUTS (5340 elements) DUMMY OUTPUTS elements)
TEST OUTPUT
LINE READOUT PERIOD (5388 elements)
2006-9-14
TCD2914BFG
Timing Chart Color 600DPI Mode (Line Clamp Mode)
("L") SH2, ("H") ("L")
tINT (integration time)
S10675+S10676
S10677+S10678
S10679+S10680
D20+D21
D70+D71
D72+D73
S1+S2 D74+D75
D80+D81
D86+D87
D88+D89
D90+D91
D92+D93
D24+D25 D22+D23
D26+D27
D76+D77
D78+D79
D94+D95
D0+D1
D2+D3
S3+S4
OS1,
DUMMY OUTPUTS elements)
LIGHT SHIELD OUTPUTS elements) elements)
DUMMY OUTPUTS elements) elements)
DUMMY OUTPUTS elements)
DUMMY OUTPUTS elements)
element) SIGNAL OUTPUTS (5340 elements) DUMMY OUTPUTS elements)
TEST OUTPUT
LINE READOUT PERIOD (5388 elements)
2006-9-14
TCD2914BFG
Timing Chart 1200DPI Mode (Bit Clamp Mode)
("H") ("H") ("L")
S10678 S10677 S10677
tINT (integration time) tINT (integration time)
S10679
S10680
S10679
DUMMY OUTPUTS elements)
LIGHT SHIELD OUTPUTS elements) element) element) DUMMY OUTPUTS elements)
DUMMY OUTPUTS elements) element)
DUMMY OUTPUTS elements)
LIGHT SHIELD OUTPUTS elements) element) element) DUMMY OUTPUTS elements)
DUMMY OUTPUTS elements) element)
DUMMY OUTPUTS elements)
LIGHT SHIELD OUTPUTS elements) element) element) DUMMY OUTPUTS elements)
DUMMY OUTPUTS elements) element)
DUMMY OUTPUTS elements)
SIGNAL OUTPUTS (2670 elements)
TEST OUTPUT element) DUMMY OUTPUTS elements)
SIGNAL OUTPUTS (2670 elements)
TEST OUTPUT element) DUMMY OUTPUTS elements)
SIGNAL OUTPUTS (2670 elements)
TEST OUTPUT element)
LINE READOUT PERIOD (2694 elements)
LINE READOUT PERIOD (2694 elements)
LINE READOUT PERIOD (2694 elements)
2006-9-14
TCD2914BFG
Timing Chart 1200DPI Mode (Line Clamp Mode)
("H") ("H") ("L")
S10678 S10677 S10677
tINT (integration time) tINT (integration time)
S10679
S10680
S10679
DUMMY OUTPUTS elements)
LIGHT SHIELD OUTPUTS elements) element) element) DUMMY OUTPUTS elements)
DUMMY OUTPUTS elements) element)
DUMMY OUTPUTS elements)
LIGHT SHIELD OUTPUTS elements) element) element) DUMMY OUTPUTS elements)
DUMMY OUTPUTS elements) element)
DUMMY OUTPUTS elements)
LIGHT SHIELD OUTPUTS elements) element) element) DUMMY OUTPUTS elements)
DUMMY OUTPUTS elements) element)
DUMMY OUTPUTS elements)
SIGNAL OUTPUTS (2670 elements)
TEST OUTPUT element) DUMMY OUTPUTS elements)
SIGNAL OUTPUTS (2670 elements)
TEST OUTPUT element) DUMMY OUTPUTS elements)
SIGNAL OUTPUTS (2670 elements)
TEST OUTPUT element)
LINE READOUT PERIOD (2694 elements)
LINE READOUT PERIOD (2694 elements)
LINE READOUT PERIOD (2694 elements)
2006-9-14
TCD2914BFG
Timing Chart 600DPI Mode (Bit Clamp Mode)
("H") ("H") SH2, ("L")
S10677+S10678
tINT (integration time)
D56+D57
D60+D61
D72+D73
D64+D65
D12+D13
S1+S2
S10679+S10680
D58+D59
D62+D63
D74+D75
D66+D67
D14+D15
S3+S4
DUMMY OUTPUTS elements)
LIGHT SHIELD OUTPUTS elements) element) element) DUMMY OUTPUTS elements)
DUMMY OUTPUTS elements) element)
DUMMY OUTPUTS elements)
SIGNAL OUTPUTS (2670 elements)
TEST OUTPUT element)
LINE READOUT PERIOD (2694 elements)
2006-9-14
TCD2914BFG
Timing Chart 600DPI Mode (Line Clamp Mode)
("H") ("H") SH2, ("L")
S10677+S10678
tINT (integration time)
D56+D57
D60+D61
D72+D73
D64+D65
D12+D13
S1+S2
S10679+S10680
D58+D59
D62+D63
D74+D75
D66+D67
D14+D15
S3+S4
DUMMY OUTPUTS elements)
LIGHT SHIELD OUTPUTS elements) element) element) DUMMY OUTPUTS elements)
DUMMY OUTPUTS elements) element)
DUMMY OUTPUTS elements)
SIGNAL OUTPUTS (2670 elements)
TEST OUTPUT element)
LINE READOUT PERIOD (2694 elements)
2006-9-14
TCD2914BFG
Timing Requirements
4.5V
4.0V(min)
4.0V(min) 0.5V
("L" ("H" "H") "L")
(Note12)
(max) (min)
(Note voltage level level.
Color 1200dpi Mode
(Bit Clamp Mode)
Video signal
Video signal
(Line Clamp Mode)
Video signal
Video signal
Color 600dpi Mode
(Bit Clamp Mode)
Video signal
(Line Clamp Mode) Video signal
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TCD2914BFG
Timing Requirements (cont.)
1200dpi Mode 600dpi Mode (SH2=SH3)
(Bit Clamp Mode)
(Line Clamp Mode)
Video signal
Characteristics Pulse timing pulse rise time, fall time pulse width Pulse timing pulse width (Note pulse width (Note pulse rise time, fall time pulse rise time, fall time pulse width Pulse timing Pulse timing Pulse timing Pulse timing pulse rise time, fall time pulse width Video data delay time (Note Pulse timing
Symbol t10,
1000 3000
Typ. (Note 1075 4000
Unit
t16,
t3-100
Note Typ. case fRS= MHz. Note Pulse width period when voltage difference between over 4.0V. Observe specification strictly because normal transfer efficiency. Note Load Resistance
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TCD2914BFG
Typical Spectral Response
Spectral response
25°C
Relative response
Green Blue
Wave length (nm)
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TCD2914BFG
Typical Drive Circuit f=10MHz lower)
+5.0V F/25 F/25 F/25
TCD2914BFG +5.0V F/25
F/25 F/25 +5.0V F/25
IC1, TC74AC04P TR1, 2SC1815-Y 1500
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TCD2914BFG
Typical Drive Circuit
+5.0V F/25 F/25 F/25
TCD2914BFG +5.0V F/25
F/25 F/25 +5.0V F/25
IC1, TC74AC04P TR1, 1500
2006-9-14
TCD2914BFG
Caution
Electrostatic Breakdown
Store shorting clip conductive foam avoid electrostatic breakdown. Image Sensor protected against static electricity, inferior puncture mode device static electricity sometimes detected. handing device, necessary execute following static electricity preventive measures, order prevent trouble rate increase manufacturing system static electricity. Prevent generation static electricity friction making work with bare hands putting cotton gloves non-charging working clothes. Discharge static electricity providing earth plate earth wire floor, door stand work room. Ground tools such soldering iron, radio cutting pliers pincer. necessarily required execute precaution items static electricity. right mitigate precautions confirming that trouble rate within prescribed range. Ionized recommended discharge when handling image sensors.
Incident Light
sensor sensitive infrared light. Note that infrared light component degrades resolution PRNU sensor.
Cloudiness Glass Inside
surface mount products have haze inside glass, careful about following. Even haze arises inside glass, when pixel area, there problem quality. Before aluminum opened, please keep products environment below 3090%RH. after aluminum opened, please keep products environment below 3060%RH Please mount products within 12month from sealed date within month from opening aluminum bag. (Sealed date printed aluminum bag.)
Ultrasonic Cleaning
Ultrasonic cleaning should used with such hermetically-sealed ceramic package because bonding wires become disconnected resonance during cleaning process.
Mounting
case solder mounting, devices should mounted with window glass protective tape order avoid dust dirt included reflow machine.
Window Glass Protective Tape
window glass protective tape manufactured from materials which static charges tend build When removing tape from sensor after solder mounting, install ionizer prevent tape from being charged with static electricity. When tape removed, adhesives will remain glass surface. Since these adhesives appear black white flaws image, please wipe window glass surface with cloth into which organic solvent infiltrated. Then please attach product. reuse tape.
2006-9-14
TCD2914BFG
Soldering Temperature Profile free
Good temperature profile each soldering method follows. addition, case repair work accompanied removal, since degree parallel spoiled with left solder, please carry case repair work accompanied removal, carry with soldering iron reflow, only time. Using soldering iron Complete soldering within seconds lead temperatures 260°C, within three seconds lead temperatures 350. Using long infrared rays reflow reflow Please reflow condition that package surface (electrode) temperature solder maker's recommendation profile. that reflow profile within below condition Peak temperature: less. Time keep high temperature 220250, 3040sec. Pre. heat 150190, 60120sec
Window Glass
dust stain glass window package degrade optical performance sensor. Keep glass window clean saturating cotton swab alcohol lightly wiping surface, allow glass dry, blowing with filtered Care should taken avoid mechanical thermal shock because glass window easily damage.
Cleaning Method Window Glass Surface
Wiping Cloth soft cloth with fine mesh. wiping cloth must cause dust from itself. clean wiping cloth necessarily. Recommended wiping cloth follow; cloth (Toray Industries) Cleaner Recommended cleaning liquid window glass follow; EE-3310 (Olympus) When using solvents, such alcohol, unavoidably, cautious next. clean thing with quick-drying. After liquid dries, there needs residual substance. thing safe human body. And, please observe term solvent storage container solvent clean. cautious fire enough. Cleaning First, surface window glass wiped with wiping cloth into which cleaner infiltrated. Please wipe down surface window glass least times more. Next, surface window glass wipes with wiping cloth. Please wipe down surface window glass least times more. Finally, blow cleaning performed filtered. operator wipes surface window glass with above-mentioned process dirt still remains, Toshiba recommends repeating clean operation from beginning. cautious next thing. Don't infiltrate cleaner much. wiping portion performed into optical range don't touch edge window glass. sure wipe long direction same direction. wiping cloth always uses unused portion.
Wiper
2006-9-14
TCD2914BFG
Foot Pattern
recommend fig1 foot pattern your PCB(Printed circuit Board).
41.4 37.6
P1.27 12.70
1.27
0.67
0.67
fig1
Mask Solder Paste Application
recommend metal mask that have following thickness. TCD****BFG(Pad material thickness 0.2mm. recommend that size pattern metal mask 100% recommended foot pattern fig1.
Temperature cycle
After mounting, temperature cycle stress much, surface mount products have possibility that crack arise solder. method preventing solder crack, underfil effective
Reuse Tray
reuse tray order reduce plastic waste can. Please cooperate with reusing ecology.
2006-9-14
TCD2914BFG
Caution Package Handling
Over force products cause crack chip removing product. three point bending strength this product following. (Reference data) stress loaded from fulcrum, stress package will increase. When will treat every process, please careful particularly. example, soldering PCB, cutting PCB, wiping glass surface, optical assemble
Bending Test force(N) force(N)
force(N)
force(N)
22CLCC Bearing length 13mm Bearing length 36mm
force from upside 300[] force from downside 200[] force from upside 150[] force from downside 80[]
2006-9-14
TCD2914BFG
Application Note: Timing Chart (Color 300DPI Mode: Clamp Mode)
("L")
tINT (integration time)
SH2, ("H") ("L")
S10677+S10678 +S10679+S10680
D76+D77 +D78+D79
D24+D25 +D26+D27
D80+D81 +D82+D83
D20+D21 +D22+D23
D68+D69 +D70+D71
D72+D73 +D74+D75
D92+D93 +D94+D95
D88+D89 +D90+D91
D0+D1 +D2+D3
S1+S2 +S3+S4
OS1,
DUMMY OUTPUTS elements)
LIGHT SHIELD OUTPUTS elements)
element)
DUMMY OUTPUTS elements)
DUMMY OUTPUT element)
element)
SIGNAL OUTPUTS (2670 elements)
TEST OUTPUT element)
DUMMY OUTPUTS elements)
DUMMY OUTPUTS elements)
LINE READOUT PERIOD (2694 elements)
2006-9-14
TCD2914BFG
Application Note: Timing Chart (Color 300DPI Mode: Line Clamp Mode)
("L")
tINT (integration time)
SH2, ("H") ("L")
S10677+S10678 +S10679+S10680
D76+D77 +D78+D79
D24+D25 +D26+D27
D80+D81 +D82+D83
D20+D21 +D22+D23
D68+D69 +D70+D71
D72+D73 +D74+D75
D92+D93 +D94+D95
D88+D89 +D90+D91
D0+D1 +D2+D3
S1+S2 +S3+S4
OS1,
DUMMY OUTPUTS elements)
LIGHT SHIELD OUTPUTS elements)
element)
DUMMY OUTPUTS elements)
DUMMY OUTPUT element)
element)
SIGNAL OUTPUTS (2670 elements)
TEST OUTPUT element)
DUMMY OUTPUTS elements)
DUMMY OUTPUTS elements)
LINE READOUT PERIOD (2694 elements)
2006-9-14
TCD2914BFG
Timing Example (Color 300dpi Mode)
(Bit Clamp Mode)
(Line Clamp Mode)
Video signal
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TCD2914BFG
Package Dimensions
Weight: 2.0g (typ.)
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TCD2914BFG
RESTRICTIONS PRODUCT
information contained herein subject change without notice.
030619EBA
information contained herein presented only guide applications products. responsibility assumed TOSHIBA infringements patents other rights third parties which result from use. license granted implication otherwise under patent patent rights TOSHIBA others. TOSHIBA continually working improve quality reliability products. Nevertheless, semiconductor devices general malfunction fail their inherent electrical sensitivity vulnerability physical stress. responsibility buyer, when utilizing TOSHIBA products, comply with standards safety making safe design entire system, avoid situations which malfunction failure such TOSHIBA products could cause loss human life, bodily injury damage property. developing your designs, please ensure that TOSHIBA products used within specified operating ranges forth most recent TOSHIBA products specifications. Also, please keep mind precautions conditions forth "Handling Guide Semiconductor Devices," "TOSHIBA Semiconductor Reliability Handbook" etc. TOSHIBA products listed this document intended usage general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products neither intended warranted usage equipment that requires extraordinarily high quality and/or reliability malfunction failure which cause loss human life bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, types safety devices, etc. Unintended Usage TOSHIBA products listed this document shall made customer's risk. products described this document subject foreign exchange foreign trade laws. TOSHIBA products should embedded downstream products which prohibited produced sold, under regulations.
2006-9-14
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