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Single-Phase Full-Wave Motor Driver Silent Motor Single Phase Ful
Top Searches for this datasheetAPX9266 Single-Phase Full-Wave Motor Driver Silent Motor Single Phase Full Wave Driver Silent Driver Supply Current Standby Current (PWM=0), Supply current less than 200µA Speed controllable input signal Built-in Quick Start Function Lock Protection Auto Restart Function Built-in Output Built-in Hall Bias Circuit Built-in Thermal Protection Circuit Lead Free Available (RoHS Compliant) General Description APX9266 single-phase full-wave motor driver motor, speed controlled input signal. output signal this amplified hall input signal. suitable both game machine cooler that need silent drivers. device lock protection function lock-restart timing tunable capacitor. device also with thermal shutdown function. normal operation, supply current less than 3mA, PWM=0 standby mode, just around 130µA, moreover, this feature will shutdown Amplifier APX9266 available MSOP-10 package. Configuration OUT2 MSOP-10 OUT1 Applications Motor Drivers Silent Motors Ordering Marking Information APX9266 Lead Free Code Handling Code Temperature Range Package Code A9266 Package Code MSOP Operating Ambient Temperature Range Handling Code Tape Reel Tube Lead Free Code Lead Free Device XXXXX Date Code APX9266 Note: ANPEC lead-free products contain molding compounds/die attach materials 100% matte plate termination finish; which fully compliant with RoHS compatible with both SnPb lead-free soldering operations. ANPEC lead-free products meet exceed leadfree requirements IPC/JEDEC STD-020C classification lead-free peak reflow temperature. Absolute Maximum Ratings Symbol IOUT VOUT Supply Voltage Output Output Current Output Output Voltage Output Current Parameter Rating Unit ANPEC reserves right make changes improve reliability manufacturability without notice, advise customers obtain latest version relevant information verify before placing orders. Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX9266 Absolute Maximum Ratings (Cont.) Symbol RTH, TSTG TSDR Output Voltage Sink Current Thermal Resistance-Junction Ambient MSOP10 Power Dissipation (Note2) Junction Temperature Storage Temperature Lead Temperature (Soldering, second) Parameter Rating Unit °C/W Note Stresses above those listed "Absolute Maximum Ratings" cause permanent damage device. Note Mounted board (48x38x1.6t Glass epoxy). Recommended Operating Conditions Symbol VHall Supply Voltage Hall Input Voltage Range Ambient Temperature Parameter Ratings Vcc-1.1 Unit Electrical Characteristics Symbol Supply Current THBR ICC1 ICC2 VCTH VCTL ICT1 ICT2 VPWMH VPWML FPWM Input High Level Voltage Input Level Voltage Input Frequency High Level Voltage Level Voltage Charge Current Discharge Current Charge/Discharge Current Ratio Hall Bias Voltage Supply Current Recovery Time Operating Current Standby Supply Current Parameter (VCC TA=-25°C, unless otherwise specified) APX9266 Min. Typ. Max. Test Conditions Unit IHB=5mA Lock Protect TOFF PWM=0 None Capacitor Rotation Mode PWM=0 µSec CCT=0.47µF CCT=0.47µF VCT=0V VCT=2V RCT=ICT1/ICT2 0.25 0.75 0.13 0.325 0.95 0.16 1.15 0.19 0.02 VCC+0.5 Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX9266 Electrical Characteristics (Cont.) Symbol Output Gain VHOFS Input Offset Voltage Input Output Gain VO/(IN+ IN-) (ratio) Output Lower Side Saturation Output Upper Side Saturation Voltage Leak Current IO=250mA IO=250mA IFG=3mA VFG=5V 0.15 0.15 0.22 0.22 Parameter (VCC TA=-25°C, unless otherwise specified) APX9266 Min. Typ. Max. Test Conditions Unit Thermal Shutdown Over Temperature Shutdown Quick Start Quick Start Enable Time 66.5 mSec Over Temperature Shutdown Hysteresis Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX9266 Typical Operating Characteristics Supply Current VCCSupply Voltage Operation Mode Supply Current Supply Voltage Standby Mode Supply Current (mA) Supply Current (µA) Supply Voltage Supply Voltage Current Voltage Offset Voltage Ambient Temperature Offset Voltage (mV) Current (mA) Voltage Ambient Temperature (°C) Saturation Voltage Output Current Voltage Supply Voltage High Voltage Saturation Voltage Upper Side MOSFET Voltage Voltage Side MOSFET Output Current (mA) Copyright ANPEC Electronics Corp. Rev. Sept., 2007 Supply Voltage(V) www.anpec.com.tw APX9266 Typical Operating Characteristics (Cont.) Charge/Discharge Current Supply Voltage Charge Current Voltage Supply Voltage Charge/Discharge Current (uA) Discharge Current IHB=5mA Voltage Supply Voltage Supply Voltage Maximum Power Dissipation Ambient Temperature Maximum Power Dissipation 100105 Ambient Temperature (°C) Operating Waveforms Rotation Waveform Mode Rotation Waveform Full Speed IN+(50mV/div) IN-(50mV/div) IN+(50mV/div) IN-(50mV/div) OUT1(2V/div) OUT2(2V/div) OUT1(2V/div) OUT2(2V/div) Time (0.2ms/div) Copyright ANPEC Electronics Corp. Rev. Sept., 2007 Time (0.2ms/div) www.anpec.com.tw APX9266 Operating Waveforms (Cont.) Rotation Waveform Full Speed (200mA/div) (200mA/div) Rotation Waveform Mode OUT2(2V/div) OUT2(2V/div) OUT1(2V/div) OUT1(2V/div) FG(5V/div) FG(5V/div) Time (0.2ms/div) Time (0.2ms/div) Lock Protection Waveform OUT1(5V/div) Lock Protection Waveform OUT1(5V/div) OUT2(5V/div) OUT2(5V/div) CT(0.5V/div) CT(0.5V/div) FG(5V/div) FG(5V/div),always High Time (1s/div) Time (1s/div) Description Name OUT2 INFG OUT1 H-bridge Output Connection. output stage H-bridge formed four transistors four-protection diode switching applications. Shutdown Time Restart Time Setting. Hall Input Hall Bias. Hall Input Rotation Speed Output. Signal Input Terminal. Supply Voltage Input Pin. H-bridge Output Connection. output stage H-bridge formed four transistors four-protection diode switching applications. Power Ground. Description Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX9266 Block Diagram Discharge Circuit 150k OUT1 100k Hall Bias Control OUT2 150k Typical Application Circuit OUT2 0.47µF OUT1 Zener control signal Hall output Pull High Voltage Note plug application, necessary protect against plug input voltage overshoot. input zener diode, between GND, clamp overshoot. normal operation, zener diode isn' stressed because output current doesn' reverse VCC. Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX9266 Functional Descriptions Lockup Protection Automatic Restart APX9266 provides lockup protection automatic restart functions preventing coil burnout locked fan. Connecting capacitor from determines shutdown time restart time. locked charge/discharge circuit, charging capacitor 1.3V 0.95µA source current locked detection time then switches capacitor discharge. During this discharge interval output drivers switched until voltage discharged 0.325V 0.16µA sink current switches capacitor charge. During this charging interval enters restart time; output high another low, which makes torque rotation until voltage charged 1.3V 0.95µA source current. locked condition removed, charge/discharge process will recurred until locked condition released (see Fig1. Lockup Protection Automatic Restart waveform). ININ+ OUT1 Lock protect function does work input frequency slower than 15Hz (typ.). Therefore, input frequency must more than 20Hz. 66.5ms (typ.) Lock protect enable (internal) enable disable enable recovery time (typ.=5us) OUT1 Fig2. Quick Start waveform TOFF TOFF Frequency Generator Function OUT2 open collector output, connecting pull resistor high level voltage frequency generator function. During Lock Mode, will always high (switch off). (see Truth Table) Open terminal use. Thermal Protection APX9266 thermal protection, when internal Lock Lock Detection Release junction temperature reaches 170°C, output devices will switched off. When junction temperature cools 35°C, thermal sensor will turn output devices again, resulting pulsed output during continuous thermal protection. Fig1. Lockup Protection Automatic Restart waveform Quick Start This disables lock protection function, when input keeps level more than 66.5ms (typ.) (see Fig2. Quick Start waveform). Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX9266 Truth Table Input OUT1 Output OUT2 Lock Mode Standby Mode Operation Mode Mode Application Information Input Protection Diode Capacitor should added protection diode (D1) protect damage from power reverse connection. However, protection diode will cause voltage drop supply voltage. current rating diode must larger than maximum output current. Connect capacitor (C1) between GND, noise reduction purpose Application Circuit). Hall input 1.3V reference hall element bias. case influences hall signal board wiring pattern, please connect 0.1uF capacitor between GND. supply current just around 130µA PWM=0 standby mode. This feature will shutdown Amplifier output signal this amplified hall input signal, therefore, output signal depends hall input. When hall input small, output signal becomes gentle. Oppositely, input signal large, output becomes steep (see Fig3. Different output signal depending shape Hall input signal).The input/ output gain 48dB (typ.). please adjust amplitude hall input meet adequate output voltage. case long board wiring pattern from hall element hall signal input terminal, please connect capacitor between IN-. OUT1 (IN+)-(IN-) OUT1 (IN+)-(IN-) Fig3. Different output signal depending shape Hall input signal input possible change rotation speed motor switching high side output transistor. on-duty switching depends input signal terminal. (see Fig4. input waveform) Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX9266 Application Information (Cont.) input (Cont.) input level terminal High side output transistor High side output transistor (see Truth Table). When terminal open, equal high Where: capacitor example: CCT= 0.47µF Restart Time=0.52s, Shutdown Time=3.13s value charge capacitor range 0.47µF recommended Resistor value resistor could decided following equation: example: VCC= I=3mA, VFG= 0.2V, RFG= 1.6k value resistor range recommended. Thermal Considerations Refer "Maximum Power Dissipation Ambient Temperature", safe operate below curve OUT1 OUT2 will eable thermal protection operating area above line. example, 75°C, maximum power dissipation about 0.48w. power dissipation calculated following equation: Fig4.PWM input waveform VOUT1- VOUT IOUT example: Capacitor capacitor that connected from determines shutdown time restart time. (VCTH VCTL ICT1 (VCTH VCTL VCC=5V, ICC=4mA, IOUT=300mA, VOUT1=4.81V, VOUT2=0.17V, then PD=0.128W provides electrical connection ground channeling heat away. printed circuit board (PCB) forms heat sink dissipates most heat into ambient air. Restart Time Shutdown Time Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX9266 Packaging Information MSOP-10 VIEW 0.25 GAUGE PLANE SEATING PLANE VIEW MSOP-10 INCHES MIN. MAX. 0.043 0.000 0.030 0.007 0.003 0.118 0.193 0.118 0.020 0.80 0.016 0.031 0.006 0.037 0.013 0.009 MAX. 1.10 0.15 0.95 0.33 0.23 MILLIMETERS MIN. 0.00 0.75 0.17 0.08 3.00 4.90 3.00 0.50 0.40 Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX9266 Carrier Tape Reel Dimensions SECTION SECTION Application 5.5± 0.10 330.0± 2.00 MIN. MSOP-10 12.4+2.00 13.0+0.50 0.30 1.75± 0.10 MIN. 20.2 MIN. 12.0± -0.00 -0.20 1.5+0.10 -0.00 MIN. 4.00± 0.10 8.00± 0.10 2.00± 0.10 0.6+0.00 6.70± 0.20 3.30± 0.20 1.40± 0.20 -0.40 (mm) Devices Unit Package Type MSOP- Unit Tape Reel Quantity 3000 Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX9266 Reflow Condition (IR/Convection Reflow) Critical Zone Ramp-up Temperature Tsmax Tsmin Ramp-down Preheat 25°C Peak Reliability Test Program Test item SOLDERABILITY HOLT Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B,A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD Time Description 245°C, 1000 Bias @125°C Hrs, 100%RH, 121°C -65°C~150°C, Cycles VHBM 2KV, 200V 10ms, 100mA Classification Reflow Profiles Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Time maintained above: Temperature (TL) Time (tL) Peak/Classification Temperature (Tp) Time within actual Peak Temperature (tp) Ramp-down Rate Time 25°C Peak Temperature Sn-Pb Eutectic Assembly 3°C/second max. 100°C 150°C 60-120 seconds 183°C 60-150 seconds table 10-30 seconds 6°C/second max. minutes max. Pb-Free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds table 20-40 seconds 6°C/second max. minutes max. Notes: temperatures refer topside package. Measured body surface. Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX9266 Classification Reflow Profiles (Cont.) Table SnPb Eutectic Process Package Peak Reflow Temperatures Package Thickness <2.5 Volume <350 +0/-5°C +0/-5°C Volume +0/-5°C +0/-5°C Table Pb-free Process Package Classification Reflow Temperatures Volume Volume Volume <350 350-2000 >2000 <1.6 +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* Tolerance: device manufacturer/supplier shall assure process compatibility including stated classification temperature (this means Peak reflow temperature +0°C. example 260°C+0°C) rated level. Package Thickness Customer Service Anpec Electronics Corp. Head Office No.6, Dusing Road, SBIP, Hsin-Chu, Taiwan, R.O.C. 886-3-5642000 886-3-5642050 Taipei Branch Lane 218, Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan 886-2-2910-3838 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. 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