| The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers. |
Single-Phase Full-Wave Motor Driver Silent Motor Features Single
Top Searches for this datasheetAPX7343 Single-Phase Full-Wave Motor Driver Silent Motor Features Single Phase Full Wave Driver Silent Driver Supply Current Standby Current (Lock mode TOFF Supply current less than 220µA Lock Protection Auto Restart Function Built-in Output Built-in Thermal Protection Circuit Lead Free Available (RoHS Compliant) General Description APX7343 single-phase full-wave motor driver motor. output signal this amplified hall input signal. suitable both game machine cooler that need silent drivers. device equipped with built-in lock protection. When locked, device will enter lockup protection mode. also with thermal protection function. normal operation, supply current less than 5mA, lock mode, just around 150µA, moreover, this feature will shutdown amplifier APX7343 available MSOP-10 package. Configuration Applications Motor Drivers Silent Motors OUTB OUTA MSOP-10 Ordering Marking Information APX7343 Lead Free Code Handling Code Temperature Range Package Code A7343 Package Code MSOP Operating Ambient Temperature Range Handling Code Tape Reel Lead Free Code Lead Free Device XXXXX Date Code APX7343 Note: ANPEC lead-free products contain molding compounds/die attach materials 100% matte plate termination finish; which fully compliant with RoHS compatible with both SnPb lead-free soldering operations. ANPEC lead-free products meet exceed leadfree requirements IPC/JEDEC STD-020C classification lead-free peak reflow temperature. Absolute Maximum Ratings Symbol IOUT VOUTA/VOUTB Supply Voltage OUTA/OUTB Output Current OUTA/OUTB Output Voltage Output Voltage Sink Current Parameter Rating -0.3 -0.3 VCC+0.3 -0.3 VCC+0.3 Unit ANPEC reserves right make changes improve reliability manufacturability without notice, advise customers obtain latest version relevant information verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.1- Sept., 2007 www.anpec.com.tw APX7343 Absolute Maximum Ratings (Cont.) Symbol TSTG TSDR Power Dissipation Maximum Junction Temperature Storage Temperature Range Maximum Lead Soldering Temperature Parameter Rating 260, seconds Unit Note Absolute Maximum Ratings those values beyond which life device Impaired. Thermal Characteristics Symbol RTH, Parameter Thermal Resistance-Junction Ambient MSOP-10 Value Unit °C/W Recommended Operating Conditions Symbol VHall Supply Voltage Hall Input Voltage Range Ambient Temperature Parameter Rating Vcc-1.1 Unit Electrical Characteristics Symbol ICC1 ICC2 VHOFS Parameter Operating Current Standby Supply Current Input Offset Voltage Input-Output Gain Output Lower Side Saturation Output Upper Side Saturation Voltage IFGL IIN+/IINTON TOFF Leak Current (VCC=5V, 25°C, unless otherwise specified) Test Conditions Rotation Mode, Loading=0 Lock Mode APX7343 Min. Ratio (VOUTA-VOUTB) (VIN+-VIN-) IOUT=250mA IOUT=250mA IFG=5mA VFG=5V 0.35 Typ. 0.15 0.15 Max. 0.22 0.22 0.65 Unit Hall Signal Input Leak Current VIN+=VIN-=1.3V Lock Protection Time Lock Protection Time Thermal Protection Temperature Thermal Protection Hysteresis Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX7343 Typical Operating Characteristics Supply Current Supply Voltage Rotation Mode (Loading=0) Supply Current Supply Voltage Lock Mode Supply Current (mA) Supply Current (µA) Supply Voltage Supply Voltage Current Voltage Saturation Voltage Output Current Saturation Voltage Current (mA) Side MOSFET Upper Side MOSFET Voltage Output Current (mA) Maximum Power Dissipation Ambient Temperature Maximum Power Dissipation Ambient Temperature (°C) Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw Supply Voltage(V) APX7343 Operating Waveforms Rotation Waveform VIN+(50mV/div) VIN-(50mV/div) Rotation Waveform IIN(100mA/div) OUTA(5V/div) OUTB (2V/div) OUTA(2V/div) VOUTB (5V/div) VFG(5V/div) Time (0.2ms/div) Time (2ms/div) Lock Protection Waveform Lock Protection Waveform IOUT(200mA/div) OUTA(5V/div) OUTB(5V/div) IOUT(200mA/div) VOUTA (5V/div) OUTB (5V/div) VFG(5V/div) VFG(5V/div) Time (2s/div) Time (2s/div) Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX7343 Descriptions Description Name OUTB OUTA ININ+ Connection. Rotation Speed Output. This open-drain output. Connection. H-bridge Output Connection. output stage H-bridge formed four transistors four-protection diode switching applications. Ground. Ground. H-bridge Output Connection. output stage H-bridge formed four transistors four-protection diode switching applications. Supply Voltage Input Pin. Hall Input Connect hall element negative output. Hall Input Connect hall element positive output. Block Diagram 150K 150K Oscillator OUTB Lock Protection Control Thermal Protection OUTA Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX7343 Typical Application Circuit Zener (6V) Hall element INOUTA OUTB Pull High Voltage output Note plug application, necessary protect against plug input voltage overshoot. input zener diode, between GND, clamp overshoot. normal operation, zener diode isn' stressed because output current doesn' reverse VCC. Functional Descriptions Lockup Protection Automatic Restart This detects rotation motor hall signal, adjusts lock detection time (TON) lock detection time (TOFF) internal counter. These times (TNO, TOFF) showed below. Frequency Generator Function open-drain output, connecting pull resistor high level voltage frequency generator function. During lock mode, will always high (switch off). (see Truth Table) Open terminal when using. Thermal Protection APX7343 equipped with thermal protection. When internal junction temperature reaches 170C, output devices will switched off. contrary, when junction temperature cools 35C, thermal sens will turn output devices again, resulting pulsed output during continuous thermal protection. OUTA TOFF TOFF OUTB Lock Lock Detection Release Reset Lock Protection Automatic Restart Waveform Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX7343 Truth Table Input OUTA Output Mode OUTB Rotation Mode Lock Mode Application Information Input Protection Diode Capacitor necessary protection diode (D1) protect damage from power reverse connection. However, protection diode will cause voltage drop supply voltage. current rating diode must larger than maximum output current. noise reduction purpose, capacitor (C1) connected between (see Typical Application Circuit). Hall input Please adjust hall input voltage value resistance that hall signal contains amplitude input within range GND~VCC-1.1V. output signal this amplified hall input signal, therefore, output signal depends hall input. When hall input small, output signal becomes gentle. Oppositely, input signal large, output becomes steep (see Fig2. Different output signal depending shape hall input signal). input/ output gain 48dB (typ.). Thus, please adjust amplitude hall input meet adequate output voltage. (VIN+)-(VIN-) VOUTB (VIN+)-(VIN-) VOUTB Different Output Signal Depending Shape Hall Input Signal Resistor value resistor could decided following equation: example: VCC=5V, IFG=3mA, VFG=0.2V, RFG=1.6K value resistor range recommended. Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX7343 Application Information (Cont.) Thermal Considerations Refre "Maximum Power Dissipation Ambient Temperature", safe operate below curve will cause thermal protection operating area above line. example, 75°C, maximum power dissipation about 0.47W. power dissipation calculated following equation: VOUTA VOUTB IOUT example: 4mA, IOUT 270mA, VOUTA 4.83V, VOUTB 0.17V, then 0.111w provides electrical connection ground channeling heat away. printed circuit board (PCB) forms heat sink dissipates most heat into ambient air. Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX7343 Package Information MSOP-10 VIEW 0.25 GAUGE PLANE SEATING PLANE VIEW MSOP-10 INCHES MIN. MAX. 0.043 0.000 0.030 0.007 0.003 0.118 0.193 0.118 0.020 0.80 0.016 0.031 0.006 0.037 0.013 0.009 MAX. 1.10 0.15 0.95 0.33 0.23 MILLIMETERS MIN. 0.00 0.75 0.17 0.08 3.00 4.90 3.00 0.50 0.40 Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX7343 Carrier Tape Reel Dimensions SECTION SECTION Application 5.5± 0.10 330.0± 2.00 MIN. MSOP-10 12.4+2.00 13.0+0.50 0.30 1.75± 0.10 MIN. 20.2 MIN. 12.0± -0.00 -0.20 1.5+0.10 -0.00 MIN. 4.00± 0.10 8.00± 0.10 2.00± 0.10 0.6+0.00 6.70± 0.20 3.30± 0.20 1.40± 0.20 -0.40 (mm) Devices Unit Package Type MSOP- Unit Tape Reel Quantity 3000 Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX7343 Reflow Condition (IR/Convection Reflow) Critical Zone Ramp-up Temperature Tsmax Tsmin Ramp-down Preheat 25°C Peak Reliability Test Program Test item SOLDERABILITY HOLT Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B,A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD Time Description 245°C, 1000 Bias @125°C Hrs, 100%RH, 121°C -65°C~150°C, Cycles VHBM 2KV, 200V 10ms, 100mA Classification Reflow Profiles Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Time maintained above: Temperature (TL) Time (tL) Peak/Classification Temperature (Tp) Time within actual Peak Temperature (tp) Ramp-down Rate Time 25°C Peak Temperature Sn-Pb Eutectic Assembly 3°C/second max. 100°C 150°C 60-120 seconds 183°C 60-150 seconds table 10-30 seconds 6°C/second max. minutes max. Pb-Free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds table 20-40 seconds 6°C/second max. minutes max. Notes: temperatures refer topside package. Measured body surface. Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw APX7343 Classification Reflow Profiles (Cont.) Table SnPb Eutectic Process Package Peak Reflow Temperatures Package Thickness <2.5 Volume <350 +0/-5°C +0/-5°C Volume +0/-5°C +0/-5°C Table Pb-free Process Package Classification Reflow Temperatures Volume Volume Volume <350 350-2000 >2000 <1.6 +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* Tolerance: device manufacturer/supplier shall assure process compatibility including stated classification temperature (this means Peak reflow temperature +0°C. example 260°C+0°C) rated level. Package Thickness Customer Service Anpec Electronics Corp. Head Office No.6, Dusing Road, SBIP, Hsin-Chu, Taiwan, R.O.C. 886-3-5642000 886-3-5642050 Taipei Branch Lane 218, Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan 886-2-2910-3838 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. Sept., 2007 www.anpec.com.tw Other recent searchesXLUR11D - XLUR11D XLUR11D Datasheet RFSP5910 - RFSP5910 RFSP5910 Datasheet NTE159 - NTE159 NTE159 Datasheet NTE123AP - NTE123AP NTE123AP Datasheet NTE159MCP - NTE159MCP NTE159MCP Datasheet IDT72V2101 - IDT72V2101 IDT72V2101 Datasheet IDT72V2111 - IDT72V2111 IDT72V2111 Datasheet IDT7290820 - IDT7290820 IDT7290820 Datasheet FSAV330 - FSAV330 FSAV330 Datasheet
Privacy Policy | Disclaimer |