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OPERATING TEMP. -5585 BKP1005 Except BKP1005 value brings ab


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MULTILAYER FERRITE CHIP BEADS (FOR POWER SUPPLY LINES) SERIES TYPE
OPERATING TEMP. -5585
BKP1005 Except BKP1005
value brings about power dissipation extending life batteries. That stands high advanced green sheet printing technologies. need grounding provides greater circuit design.
APPLICATIONS
USBIEEE1394 PDCPHSPDA High frequency noise debug power supply line personal computers other information system products. Noise suppression IEEE1394 interface. Prevents interference between circuits mobile systems(PDC, PHS, PDA)
ORDERING CODE
1005(0402) 1608(0603) 2125(0805)
Type
Multilayer Ferrite Chip Beads (For Power Supply Lines)
Material
broadband applications
Impedance
example
Characteristics
Standard Products
Internal code
Standard Products Blank Space
External Dimensions
1005(0402) 1608(0603) 2125(0805)
Packaging
Tape Reel
EXTERNAL DIMENSIONS
Type BKP1005 1.00±0.05 0.50±0.05 0.50±0.05 0.25±0.10 04020.039±0.002 0.020±0.002 0.020±0.002 0.010±0.004 BKP1608 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 06030.063±0.006 0.031±0.006 0.031±0.006 0.012±0.008 BKP2125 1.25±0.2 0.85±0.2 0.5±0.3 0805 0.079 0.012 0.033±0.008 0.020±0.012 0.004 0.049±0.008 Unitmm inch
AVAILABLE MATERIALS
BKP1005
type
FERRITE PRODUCTS
HS121
max=1A
BKP1608
type
HS391 HS271 HS181 HS121 HS101 HS600 HS330
max=13A
BKP2125
type
HS221 HS101 HS600 HS330
max=24A
Selection Guide
Part Numbers
Electrical Characteristics
Packaging
Reliability Data
Precautions
P.12
P.242
P.243
P.252
P.254
P.262
PART NUMBERS
BKP1005
Ordering code BKP10 Environmental Hazardous Substances RoHS Impedance Measuring frequency resistance max. Rated current max. Thickness inch 0.50±0.05 0.02±0.002
BKP1608
Ordering code BKP16 BKP16 BKP16 BKP16 BKP16 BKP16 BKP16 Environmental Hazardous Substances RoHS RoHS RoHS RoHS RoHS RoHS RoHS Impedance Measuring frequency resistance max. Rated current max. Thickness inch
0.80±0.15 0.031±0.006
BKP2125
Ordering code BKP21 BKP21 BKP21 BKP21 Environmental Hazardous Substances RoHS RoHS RoHS RoHS Impedance Measuring frequency resistance max. Rated current max. Thickness inch 0.85±0.2 0.033±0.008
ELECTRICAL CHARACTERISTICS
BKP1005
BKP1005 HS121
1000
FERRITE PRODUCTS
BKP1608
BKP1608 HS330
BKP1608 HS600 BKP1608 HS101
1000
1000
1000
BKP1608 HS121
BKP1608 HS181
BKP1608 HS271
1000
1000
1000
BKP1608 HS391
1000
ELECTRICAL CHARACTERISTICS
BKP2125
BKP2125 HS330 BKP2125 HS600 BKP2125 HS101
1000
1000
1000
BKP2125 HS221
1000
PACKAGING
Minimum Quantity Tape Reel Packaging Type CK1608 0603 Thickness inch 0.031 0.85 CK2125 0805 0.033 1.25 0.049 CKP3216 1206 CKP2520 1008 LK1005 0402 LK1608 0603 0.031 0.85 0.033 0.020 0.031 0.85 LK2125 0805 0.033 1.25 0.049 HKQ0603 0201 HK0603 0201 HK1005 0402 HK1608 0603 0.012 0.012 0.020 0.031 0.85 0.033 0.039 AQ105 0402 BK0603 0201 BK1005 0402 BK1608 0603 0.020 0.012 0.020 0.031 0.85 BK2125 0805 0.033 1.25 0.049 BK2010 0804 BK3216 1206 BKP1005 0402 BKP1608 0603 BKP2125 0805 0.45 0.018 0.031 0.020 0.031 0.85 0.033 Standard Quantity Paper Tape 4000 4000 10000 4000 4000 15000 15000 10000 4000 10000 15000 10000 4000 4000 4000 10000 4000 4000 Embossed Tape 2000 4000 3000 2000 4000 3000 2000 4000
Taping material
HK2125 0805
2125 3216 2520 2125 2125 2125 3216
PACKAGING
Taping Dimensions Paper tape 0.315 inches wide
Type CK2125 0805
Thickness 1.25
Chip cavity 1.5±0.2 2.3±0.2
max. Insertion Pitch 4.0±0.1 Tape Thickness
0.049 0.059±0.008 0.091±0.008 0.157±0.004 0.0790.012
1.9±0.1 3.5±0.1 4.0±0.1 CKP32161206 0.031 0.075±0.004 0.138±0.004 0.157±0.004 0.0550.012 0.85 2.15±0.1 2.7±0.1 4.0±0.1 CKP25201008 0.033 0.085±0.004 0.107±0.004 0.157±0.004 0.0590.012 LK21250805 1.25 0.85 Unit inch Type CK1608 0603 CK2125 0805 LK1005 0402 LK1608 0603 LK2125 0805 HKQ0603 0201 HK0603 0201 HK1005 0402 HK1608 0603 AQ105 0402 BK0603 0201 BK1005 0402 BK1608 0603 BK2125 0805 BK2010 0804 BKP1005 0402 BKP1608 0603 BKP2125 0805 Thickness 0.85 0.85 0.85 0.45 0.85 Chip cavity 1.0±0.2 1.5±0.2 0.65±0.1 1.0±0.2 1.5±0.2 1.8±0.2 2.3±0.2 Insertion Pitch Tape Thickness 4.0±0.1 4.0±0.1 1.1max 1.1max 0.8max 1.1max 1.1max 0.45max 0.45max 0.8max 1.1max 0.8max 0.45max 0.8max 1.1max 1.1max 0.80max 0.8max 1.1max 1.1max tape strength 0.10.7N tape requires peel-off force 0.10.7N direction arrow illustrated below. Reel Size
2.0±0.5 0.079±0.031 13.0±0.2 0.512±0.020
1.5±0.2
2.3±0.2
4.0±0.1
FERRITE PRODUCTS
0.049 0.059±0.008 0.091±0.008 0.157±0.004 0.0790.012 0.033 0.039 1.25 1.5±0.2 2.3±0.2 4.0±0.1 0.059 0.012 0.079 1.5±0.2 1.9±0.1 2.3±0.2 3.5±0.1 4.0±0.1 4.0±0.1
HK21250805
0.059±0.008 0.091±0.008 0.157±0.004
BK21250805 BK32161206
0.049 0.059±0.008 0.091±0.008 0.157±0.004 0.0790.012 0.031 0.075±0.004 0.138±0.004 0.157±0.004 0.0550.012
0.031 0.039±0.0080.071±0.008 0.157±0.004 0.043max 0.033 0.059±0.0080.091±0.008 0.157±0.004 0.043max 1.15±0.1 2.0±0.05 1.8±0.2 2.3±0.2 4.0±0.1 4.0±0.1 0.020 0.026±0.0040.045±0.004 0.079±0.002 0.031max 0.031 0.039±0.0080.071±0.008 0.157±0.0040.043max 0.033 0.059±0.0080.091±0.008 0.157±0.0040.043max 0.40±0.06 0.70±0.06 2.0±0.05 0.40±0.06 0.70±0.06 2.0±0.05 0.65±0.1 1.0±0.2 0.75±0.1 1.15±0.1 2.0±0.05 1.8±0.2 4.0±0.1 0.012 0.016±0.0020.028±0.002 0.079±0.002 0.018max 0.012 0.016±0.0020.028±0.002 0.079±0.002 0.018max 0.020 0.026±0.0040.045±0.004 0.079±0.002 0.031max 0.031 0.039±0.0080.071±0.008 0.157±0.004 0.043max 1.15±0.1 2.0±0.05 0.020 0.030±0.0040.045±0.004 0.079±0.002 0.031max 0.40±0.06 0.70±0.06 2.0±0.05 0.65±0.1 1.0±0.2 1.5±0.2 1.2±0.1 0.65±0.1 1.0±0.2 1.5±0.2 1.15±0.1 2.0±0.05 1.8±0.2 2.3±0.2 2.17±0.1 4.0±0.1 4.0±0.1 4.0±0.1 0.012 0.016±0.0020.028±0.002 0.079±0.002 0.018max 0.020 0.026±0.0040.045±0.004 0.079±0.002 0.031max 0.031 0.033 0.018 0.047±0.004 0.085±0.004 0.157±0.0040.031max 1.15±0.1 2.0±0.05 1.8±0.2 2.3±0.2 4.0±0.1 4.0±0.1 0.020 0.026±0.0040.045±0.004 0.079±0.002 0.031max 0.031 0.039±0.008 0.071±0.008 0.157±0.0040.043max 0.033 0.059±0.008 0.091±0.008 0.157±0.0040.043max
LEADER BLANK PORTION
160mm 6.3inches more
Direction tape feed
100mm 3.94inches more
400mm 15.7inches more
0.312 inches wide Embossed Tape
Unit inch
RELIABILITY DATA
Multilayer chip inductors beads
Specified Value Item ARRAY BK0603 BK1005 BK1608 BK2125 BK2010 BK3216 1.Operating Range 2.Storage Temperature Range 3.Rated Current 4.Impedance 100mA 1.0A 3.0A 4.0A 60mA 1.2A 25mA 50mA 500mA 1000mA 1500mA 1200mA 200mA -55125 -5585 -4085 -55125 -4085 300mA 510mA BK0603 Series: Measuring frequency: 100±1MHz Measuring equipment: HP4291A Measuring jig: 16193A BK1005 Series: BKP1005 Series: Measuring frequency: 100±1MHz Measuring equipment: HP4291A Measuring jig: 16192A, 16193A BK1608, 2125 Series: BKP1608, 2125 Series: Measuring frequency: 100±1MHz Measuring equipment: HP4291A, HP4195A Measuring jig: 16092A 16192A BK2010, 3216 Series: Measuring frequency: 100±1MHz Measuring equipment: HP4291A, HP4195A Measuring jig: 16192A 5.Inductance 0.12 0.047 0.047 1.06.2nH 1.06.2nH 1.05.6nH 1.05.6nH 1.06.2nH Series: ±0.3nH 33.0H 33.0H ±0.3nH ±0.3nH ±0.3nH ±0.3nH 1.8H min. 2.5H min. 0.10 0.10 12.0H 12.0H Series: Measuring frequency: 25MHz LK1005 LK1608 Measuring frequency: 50MHz Measuring frequency: 50MHz LK2125 Measuring equipment, jig: equivalent HP419416085B16092A HP41954195116092A equivalent HP429416192A HP4291A16193A LK1005 HP4285A42841A42842C 42851-61100 CKP3216 CKP2520 Measuring current: 0.047 4.7H 0.1mA Series: Measuring frequency: 100MHz HK0603, HK1005,AQ105 Measuring frequency: HK1608, HK2125 50/100MHz Measuring equipment, jig: HK0603 AQ105 HP4291A16197A HK1005 HP4291A16193A equivalent 16092A HP4291A in-house made HK1608, 2125 200mA 200mA CK1608 Measuring frequency: 4MHz CK2125 Measuring frequency: 25MHz Measuring frequency: 1MHz CKP3216 CKP2520 10.0H 10.0H 4.7H 4.7H 2.2H -55125 -5585 -4085 -55125 -4085 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 CKP2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 AQ105 Test Methods Remarks
FERRITE PRODUCTS
500mA 1.1A
300mA 250mA 300mA 300mA
1000 2500 2500
1000
6.8100nH 6.8270nH 6.8470nH 6.8470nH 6.815nH
Definition rated current Series, rated current value current which temperature element increased within Series type Series type, rated current value current which temperature element increased within LK,HK,and Series, rated current either value which internal value decreased within with application bias, value current which temperature element increased within
RELIABILITY DATA
Multilayer chip inductors beads
Specified Item ARRAY BK0603 BK1005 BK1608 BK2125 BK2010 BK3216 min.
Value Test Methods Remarks
BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 CKP2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 AQ105 1520 min. 1020 1035 1550 min. min. min. min. 8min. 1018 8min. min. min. Series: Measuring frequency: CK1608 Measuring frequency: CK2125 Series: Measuring frequency: LK1005 Measuring frequency: LK1608 Measuring frequency: 50MHz LK2125 Measuring equipment, jig: HP4194A 16085B 16092Aor equivalent HP4195A 41951 16092Aor equivalent HP4294A 16192A HP4291A 16193ALK1005 Measuring current: 0.047 4.7H 0.1mA Series: Measuring frequency: 100MHz HK0603, HK1005,AQ105 Measuring frequency: HK1608,2125 100MHz Measuring equipment, jig: HK0603,AQ105 HP4291A 16197A HP4291A 16193A HK1005 HP4195A 16092A in-house made
FERRITE PRODUCTS
HK1608, 2125
7.DC Resistance 0.075 0.05 0.05 0.05 0.10 0.15 0.140 0.025 0.020 0.45 0.16 0.11 0.09 1.50 0.80 1.10 0.75 0.90 0.80 max. max. max. max. max. max. max. max. max. max. max. max. max. max. 0.20 0.14 0.08 0.05 0.10 0.07 max. max. max. 0.45 max. Measuring equipment: VOAC7412 made Iwasaki Tsushinki VOAC7512 made Iwasaki Tsushinki 8.Self Resonance Frequency min. min. min. min. min. min. min. min. min. 2300 min. Series: Measuring jig: 41951 16092A equivalent Series: Measuring equipment: HP8719C HP8753D HK2125 9.Temperature Characteristic Inductance change: Within±10% Series: Temperature range: Reference temperature: Warp: Testing board: glass epoxy-resin substrate Thickness: 0.8mm 25MHz 235MHz 180MHz 260MHz 320MHz 10000MHz 10000MHz 10000MHz 4000MHz 10000MHz Measuring equipment: HP4195A max. max.
0.140 0.050 0.85 0.65 0.20 0.15 1.70 2.95 1.25
Resistance Flexure Substrate
mechanical damage.
RELIABILITY DATA
Multilayer chip inductors beads
Specified Value Item ARRAY BK0603 BK1005 BK1608 BK2125 BK2010 BK3216 11.Solderability least terminal electrode covered solder. least terminal electrode covered solder. Solder temperature: 230±5 Duration: sec. BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 CKP2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 AQ105 Test Methods Remarks
12.Resistance Soldering
Appearance: significant abnormality Impedance change: Within±30%
mechanical damage. Remaining terminal electrode: min. Inductance change R104R7: Within±10% 6R8100: Within±15% CKP3216 CKP2520: Within±30%
mechanical mechanical damage. Remaining terminal electrode: min. Inductance change: Within±5%
Solder temperature: 260±5 Duration: 10±0.5 sec. Preheating temperature: Preheating time: min. Flux: Immersion into methanol solution with colophony sec. Recovery: recovery under standard condition after test. Note
mechanical damage. damage. Remaining Remaining terminal terminal electrode: electrode: min. min. Inductance Inductance change: change Within ±15% 47N4R7: Within±10% 5R6330: Within±15%
FERRITE PRODUCTS
13.Thermal Shock
Appearance: significant abnormality Impedance change: Within ±30%
mechanical damage. Inductance change: Within ±20% Qchange: Within ±30%
mechanical damage. Inductance change: Within ±30%
mechanical damage. Within±10% Qchange: Within±30%
mechanical damage. Inductance change: Within±10%
Conditions cycle step Minimum operating temperature 30±3 min. step Room temperature 3min. step Minimum operating temperature 30±3 min. step Room temperature 3min. Number cycles: Recovery: recovery under standard condition after test. Note
Inductance change: Qchange: Within±20%
(Note When there questions concerning mesurement resultmeasurement shall made after recovery under standard condition.
RELIABILITY DATA
Multilayer chip inductors beads
Specified Value Item ARRAY Test Methods Remarks
BK0603 BK1005 BK1608 BK2125 BK2010 BK3216
Appearance: significant abnormality Impedance change: Within ±30%
BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKP3216 CKP2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 AQ105
mechanica damage. Inductance change: Within ±20% change: Within ±30% mechanica damage. Inductance change: Within ±30% mechanica damage. mechanica damage. mechanica Inductance change: damage. Within±10% Series: Temperature: 40±2 Humidity: 95%RH
Duration:
Damp Heat fSteady stateg
Inductance change: Within±10% Inductance change: Within±20% change: change: Within Within±30% ±10% change: Within ±30%
Recovery: recovery under standard condition after removal Note1 from test chamber. Series: Temperature: 40±2 Series 60±2 Series Humidity: 95%RH Duration: 500±12 hours Recovery: recovery under standard condition after removal from test chamber.See Note1
FERRITE PRODUCTS
15.Loading under Damp Heat
mechanical damage, Inductance change within±30
mechanica damage. Inductance change: Within ±20% change: Within ±30%
mechanica damage. Inductance change: Within ±30%
mechanica damage. mechanica mechanica mechanica Inductance change: damage. damage. damage. Within±10% Inductance Inductance Inductance change: Within±20% change: change: change: Within 0.047 Within ±10% 12.0H: ±10% Within change: ±10% change: Within 15.0 Within ±30% 33.0H: ±30% Within ±15% change: Within ±30%
Series: Series Temperature: 40±2 Humidity: 95%RH
Duration: 5000
Applied current: Rated current Recovery: recovery under standard condition after removal Note1 from test chamber. Series: Temperature: 40±2 Series 60±2 Series Humidity: 95%RH Duration: 500±12 Applied current: Rated current Recovery: recovery under standard condition after removal from test chamber.See Note1
16.Loading High Temperature
Appearance: significant abnormality Impedance change: Within ±30%
mechanica damage. Inductance change: Within ±20% change: Within ±30%
mechanica damage. Inductance change: Within ±30%
mechanica damage. mechanica mechanica mechanica Inductance change: damage. damage. damage. Within±10% Inductance Inductance Inductance change: Within±20% change: change: change: Within 0.047 Within ±10% 12.0H: ±10% Within change: ±10% change: Within 15.0 Within ±30% 33.0H: ±30% Within ±15% change: Within ±30%
Series: Temperature: 125±3 Applied current: Rated current
Duration:
Recovery: recovery under standard condition after removal from test chamber. Note1
Series, Series type: Temperature: 85±2 Series 85±3 Series type 85±2 1608, 2125 85±2HK 1005 AQ105 operating temperature range 125±2 0603, HK1005,AQ105 operating temperature range Applied current: Rated current Duration: 500±12 Recovery: recovery under standard condition after removal from test chamber.See Note1
Note standard condition: "standard condition" referred herein defined follows: temperature, relative humidity, 106kPa pressure. When there questions concerning measurement results: order provide correlation data, test shall conducted under condition temperature, relative humidity, 106kPa pressure. Unless otherwise specified, tests conducted under "standard condition."
(Note measurement shall made after recovery under standard condition.
PRECAUTIONS
Precautions Multilayer chip Inductors, Multilayer chip inductors high frequency, Multilayer ferrite chip beads
Stages Circuit Design Precautions Verification operating environment, electrical rating performance malfunction medical equipment, spacecraft, nuclear reactors, etc. cause serious harm human life have severe social ramifications. such, inductors used such equipment require higher safety and/or reliability considerations should clearly differentiated from components used general purpose applications. Operating Current Verification Rated current operating current inductors must always lower than their rated values. apply current excess rated value because inductance reduced magnetic saturation effect. Technical considerations
FERRITE PRODUCTS
Design
Pattern configurations Design Land-patterns When inductors mounted PCB, size land patterns amount solder usedsize filletcan directly affect inductor performance. Therefore, following items must carefully considered design solder land patterns: 1The amount solder applied affect ability chips withstand mechanical stresses which lead breaking cracking. Therefore, when designing land-patterns necessary consider appropriate size configuration solder pads which turn determines amount solder necessary form fillets. 2When more than part jointly soldered onto same land pad, must designed that each component's soldering point separated solder-resist. 3The larger size land patterns amount solder, smaller value after mounting PCB. makes higher value design land patterns smaller than terminal electrode chips.
following diagrams tables show some examples recommended patterns prevent excessive solder amountslarger fillets which extend above component terminations Examples improper pattern designs also shown. 1Recommended land dimensions typical chip inductor land patterns PCBs
Recommended land dimensions wave-soldering unit: Type Size Type
Size
1608 0.81.0 0.50.8 0.60.8
2125 1.25 1.01.4 0.81.5 0.91.2
3216 1.82.5 0.81.7 1.21.6
Recommended land dimensions reflow-soldering unit: 0603 1005 1608 0.60.8 0.60.8 0.60.8 2125 1.25 0.81.2 0.81.2 0.91.6 3216 1.82.5 0.61.5 1.22.0 2520 1.01.4 0.61.0 1.82.2
0.200.30 0.450.55 0.500.55 0.200.30 0.400.50 0.300.40 0.250.40 0.450.55 0.600.70
Excess solder affect ability chips withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns. Recommended land dimension Reflow-soldering unit: 3216 0.70.9 0.81.0 0.40.5 Size 2010 0.50.6 0.50.6 0.20.3
PRECAUTIONS
Precautions Multilayer chip Inductors, Multilayer chip inductors high frequency, Multilayer ferrite chip beads
Stages 2.PCB Design Precautions Technical considerations Examples good solder application recommended
Mixed mounting leaded components Component placement close chassis
Recommended
FERRITE PRODUCTS
Hand-soldering leaded components near mounted components Horizontal component placement
Pattern configurations Inductor layout panelized breakaway boards After inductors have been mounted boards, chips subjected mechanical stresses subsequent manufacturing processes cutting, board inspection, mounting additional parts, assembly into chassis, wave soldering reflow soldered boards etc. this reason, planning pattern configurations position inductors should carefully performed minimize stress.
1-1. following examples good inductor layout; inductors should located minimize possible mechanical stresses from board warp deflection.
Item
recommended
Recommended
Deflection board
1-2. layout inductors breakaway board, should noted that amount mechanical stresses given will vary depending inductor layout. example below should counted better design.
1-3. When breaking boards along their perforations, amount mechanical stress inductors vary according method used. following methods listed order from least stressful most stressful: push-back, slit, V-grooving, perforation. Thus, ideal inductor layout must also consider splitting procedure.
PRECAUTIONS
Precautions Multilayer chip Inductors, Multilayer chip inductors high frequency, Multilayer ferrite chip beads
Stages 3.Considerations automatic placement Precautions Adjustment mounting machine Excessive impact load should imposed inductors when mounting onto boards. maintenance inspection mounter should conducted periodically. Technical considerations
lower limit pick-up nozzle low, much force imposed inductors, causing damage. avoid this, following points should considered before lowering pick-up nozzle: lower limit pick-up nozzle should adjusted surface level board after correcting deflection board. pick-up pressure should adjusted between static loads. reduce amount deflection board caused impact pick-up nozzle, supporting pins back-up pins should used under board. following diagrams show some typical examples good pick-up nozzle placement:
FERRITE PRODUCTS
Improper method
Proper method
Single-sided mounting
Double-sided mounting
alignment wears out, adjustment nozzle height cause chipping cracking inductors because mechanical impact inductors. avoid this, monitoring width between alignment stopped position, maintenance, inspection replacement should conducted periodically.
Selection Adhesives Mounting inductors with adhesives preliminary assembly, before soldering stage, lead degraded inductor characteristics unless following factors appropriately checked; size land patterns, type adhesive, amount applied, hardening temperature hardening period. Therefore, imperative consult manufacturer adhesives proper usage amounts adhesive use.
Some adhesives cause reduced insulation resistance. difference between shrinkage percentage adhesive that inductors result stresses inductors lead cracking. Moreover, little much adhesive applied board adversely affect component placement, following precautions should noted application adhesives. Required adhesive characteristics adhesive should strong enough hold parts board during mounting solder process. adhesive should have sufficient strength high temperatures. adhesive should have good coating thickness consistency. adhesive should used during prescribed shelf life. adhesive should harden rapidly adhesive must contaminated. adhesive should have excellent insulation characteristics. adhesive should toxic have emission toxic gasses.
PRECAUTIONS
Precautions Multilayer chip Inductors, Multilayer chip inductors high frequency, Multilayer ferrite chip beads
Stages 3.Considerations automatic placement Precaution Technical considerations
When using adhesives mount inductors PCB, inappropriate amounts adhesive board adversely affect component placement. little adhesive cause inductors fall board during solder process. much adhesive cause defective soldering excessive flow adhesive land solder pad. Recommended conditions Figure 0805 case sizes examples 0.3mm Area with adhesive
FERRITE PRODUCTS
4.Soldering
Selection Flux Since flux have significant effect performance inductors, necessary verify following conditions prior use; Flux used should with less than equal wt%Chlorine conversion methodof halogenated content. Flux having strong acidity content should applied. When soldering inductors board, amount flux applied should controlled optimum level. When using water-soluble flux, special care should taken properly clean boards.
1-1. When much halogenated substanceChlorine, etc.content used activate flux, highly acidic flux used, excessive amount residue after soldering lead corrosion terminal electrodes degradation insulation resistance surface Inductor. 1-2. Flux used increase solderability flow soldering, much applied, large amount flux emitted detrimentally affect solderability. minimize amount flux applied, recommended flux-bubbling system. 1-3. Since residue water-soluble flux easily dissolved water content air, residue surface Inductor high humidity conditions cause degradation insulation resistance therefore affect reliability components. cleaning methods capability machines used should also considered carefully when selecting watersoluble flux.
Soldering Temperature, time, amount solder, etc. specified accordance with following recommended conditions.
1-1. Preheating when soldering Heating: Chip inductor components should preheated within soldering. Cooling: temperature difference between components cleaning process should greater than Chip inductors susceptible thermal shock when exposed rapid concentrated heating rapid cooling. Therefore, soldering process must conducted with great care prevent malfunction components excessive thermal shock.
PRECAUTIONS
Precautions Multilayer chip Inductors, Multilayer chip inductors high frequency, Multilayer ferrite chip beads
Stages 4.Soldering Precautions please contact about peak temperature when lead-free paste.
Technical considerations Recommended conditions soldering Reflow soldering Temperature profile
Temperature
free soldering
Peak
Gradually cooling Preheating
Heating above
Ceramic chip components should preheated within soldering. Assured reflow soldering times.
FERRITE PRODUCTS
Caution
1.260 condition have solder filletcontrolled ideal mass Peak thickness inductor, shown below:
Temperature
free soldering
Preheating
Gradually cooling
Temperature
free soldering
soldering duration should
Ceramic chip components should preheated
Peak
Preheating Except reflow soldering type.
within soldering. Gradually cooling Assured wave soldering time.
Because excessive dwell times detrimentally affect solderability, Heating above
possible.
kept close recommended preheated Ceramic chip components should times
within soldering. Assured reflow soldering times. Gradually cooling
Temperature free soldering
Wave soldering
Temperature profile
Temperature
free soldering
3216 3225 20W1
3225 3216TypePb, free soldering TemperatureT190 Gradually Preheating Type ming cooling
less. soldering iron should directly touch components. Peak recommended soldering iron
Peak
cooling Preheating Ceramic chip profiles should preheated Note: abovecomponentsthe maximum allowable Except reflow soldering type.40
Gradually Assured soldering iron time.
within condition, therefore these profiles soldering soldering. Heating above Assuredalwayswave soldering time. recommended.
Caution
Make sure inductors preheated sufficiently.
Temperature reflow solderingfree soldering times. Assured
cooling
Ceramic chip components should preheated within soldering.
temperature difference betweenTemperature free soldering inductor melted solder should Gradually
greater
than
Peak
Cooling after soldering should gradual possible.
Wave soldering must applied 3216 3225
20W1 flow soldering only.
cooling inductors designated
Preheating
Gradually
T190 3216Type 3225
Hand soldering
Type ming recommended soldering iron less. soldering iron should should touch Ceramic chip componentsnot directly preheated components. soldering. within Assured soldering iron time. Assured wave soldering time.
Temperature profile
Temperature
Except reflow soldering type. Note: above profiles maximum allowable soldering condition, therefore these profiles always recommended.
free soldering
Gradually cooling
T190 3216Type 3225 Type ming recommended soldering iron less. soldering iron should directly touch components. Assured soldering iron time. Note: above profiles maximum allowable soldering condition, therefore these profiles always recommended.
3216 3225 20W1
Caution soldering iron with maximum diameter soldering iron should directly touch inductor. 5.Cleaning Cleaning conditions When cleaning board after Inductors mounted, select appropriate cleaning solution according type flux used purpose cleaninge.g. remove soldering flux other materials from production process. inappropriate solutions cause foreign substances such flux residue adhere inductor, resulting degradation inductor's electrical properties especially insulation resistance
PRECAUTIONS
Precautions Multilayer chip Inductors, Multilayer chip inductors high frequency, Multilayer ferrite chip beads
Stages 5.Cleaning Precautions Cleaning conditions should determined after verifying, through test run, that cleaning process does affect inductor's characteristics. Technical considerations
Inappropriate cleaning conditions insufficient excessive cleaning detrimentally affect performance inductors. Excessive cleaning case ultrasonic cleaning, much power output cause excessive vibration board which lead cracking inductor soldered portion, decrease terminal electrodes' strength. Thus following conditions should carefully checked; Ultrasonic output Below Ultrasonic frequency Below Ultrasonic washing period min. less
FERRITE PRODUCTS
Post cleaning processes
Application resin coatings, moldings, etc. components. With some type resins decomposition chemical reaction vapor remain inside resin during hardening period while left under normal storage conditions resulting deterioration inductor's performance. When resin's hardening temperature higher than inductor's operating temperature, stresses generated excess heat lead inductor damage destruction. Stress caused resin' temperature generated expansion contraction damage inductors. such resins, molding materials etc. recommended.
Handling
Breakaway boards splitting along perforations When splitting board after mounting inductors other components, care required give stresses deflection twisting board. Board separation should done manually, using appropriate devices. General handling precautions Always wear static control bands protect against ESD. Keep inductors away from magnets magnetic objects. non-magnetic tweezers when handling inductors. devices used with inductorssoldering irons, measuring instruments should properly grounded. Keep bare hands metal products i.e., metal desk away from chip electrodes conductive areas that lead chip electrodes. Keep inductors away from items that generate magnetic fields such speakers coils.
Mechanical considerations careful subject inductors excessive mechanical shocks. inductors dropped floor hard surface they should used. When handling mounted boards, careful that mounted components come contact with bump against other boards components.
PRECAUTIONS
Precautions Multilayer chip Inductors, Multilayer chip inductors high frequency, Multilayer ferrite chip beads
Stages Storage conditions Precautions Storage maintain solderability terminal electrodes keep packaging material good condition, care must taken control temperature humidity storage area. Humidity should especially kept possible. Recommended conditions Ambient temperature Humidity Technical considerations
parts stocked high temperature humidity environment, problems such reduced solderability caused oxidation terminal electrodes deterioration taping/packaging materials take place. this reason, components should used within months from time delivery. exceeding above period, please check solderability before using inductors
Below Below
FERRITE PRODUCTS
ambient temperature must kept below Even under ideal storage conditions inductor electrode solderability decreases time passes, inductors should used within months from time delivery. *The packaging material should kept where chlorine sulfur exists air.

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