| The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers. |
P-channel 100V 0.060 TO-254AA Rad-hard gate charge STripFETPower MOSFE
Top Searches for this datasheetSTRH40P10FSY3 P-channel 100V 0.060 TO-254AA Rad-hard gate charge STripFETPower MOSFET Type STRH40P10FSY3 VDSS 100V RDS(on) Fast switching Single event effect (SEE) hardned total gate charge Light weight 100% avalanche tested Application oriented characterization Hermetically sealed Heavy 100kRad SEGR with ions TO-254AA Internal schematic diagram Description This Power MOSFET series realized with STMicroelectronics unique STripFET process specifically been designed sustain high provide immunity heavy effects. therefore suitable power switch mainly highefficiency DC-DC converters. also intended application with gate charge drive requirements. Application Satellite High reliability Order codes Part number STRH40P10FSY1 STRH40P10FSY3 temp range Space flights parts (full flow screening) Marking RH40P10FSY1 RH40P10FSY3 Package TO-254AA TO-254AA Packaging Individual strip pack Individual strip pack March 2007 1/12 www.st.com Contents STRH40P10FSY3 Contents Electrical ratings Electrical characteristics Pre-irradiation Post-irradiation Electrical characteristics (curves) Test circuit Package mechanical data Revision history 2/12 STRH40P10FSY3 Electrical ratings Electrical ratings Table Symbol Absolute maximum ratings (pre-irradiation) Parameter Drain-source voltage (VGS Gate-source voltage Drain current (continuous) 25°C Drain current (continuous) 100°C Drain current (pulsed) Total dissipation 25°C Value 19.5 Unit V/ns PTOT dv/dt Peak diode recovery voltage slope Tstg Storage temperature Max. operating junction temperature Rated according Rthj-case Rthc-s Pulse width limited safe operating area 40A, di/dt 1060A/µs, 80%V(BR)DSS Table Symbol Thermal data Parameter Value 0.21 Unit °C/W °C/W °C/W Rthj-case Thermal resistance junction-case Rthc-s Case-to-sink Rthj-amb Thermal resistance junction -amb Table Symbol Avalanche characteristics Parameter Avalanche current, repetitive not-repetitive (pulse width limited Max) Single pulse avalanche energy (starting Tj=25°C, ID=IAR, VDD=50V) Repetitive avalanche Value 1310 Unit Note: P-channel MOSFET actual polarity voltages current reversed 3/12 Electrical characteristics STRH40P10FSY3 Electrical characteristics (TCASE 25°C unless otherwise specified) Pre-irradiation Table Symbol IDSS IGSS V(BR)DSS VGS(th) RDS(on) On/off states Parameter Zero gate voltage drain current (VGS Gate body leakage current (VDS Drain-source breakdown voltage Gate threshold voltage Static drain-source resistance Test conditions BVDss ±18V 250µA, =VGS, 12V, 0.060 0.067 Min. Typ. ±100 Unit Table Symbol Ciss Coss Crss Dynamic Parameter Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-source charge Gate-drain charge Test conditions 25V, f=1MHz, VGS=0V 50V, 20A, VGS=12V f=1MHz Gate Bias=0 Test signal level=20mV open drain Min. Typ. 5500 Unit Gate input resistance Table Symbol td(on) td(off) Switching times Parameter Turn-on delay time Rise time Turn-off-delay time Fall time Test conditions Min. Typ. Unit 50V, 20A, 4.7, 4/12 STRH40P10FSY3 Electrical characteristics Table Symbol ISDM IRRM IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current 40A, 40A, di/dt 100A/µs VDD= 45V, 25°C 40A, di/dt 100A/µs VDD= 45V, 150°C 3.45 5.90 Test conditions Min. Typ. Unit Pulse width limited safe operating area Pulsed: pulse duration 300µs, duty cycle 1.5% Post-irradiation Rad-Hard Power MOSFETs tested verify radiation capability. technology extremely resistant assurance well functioning device inside radiation environments. Every manufacturing tested total ionizing dose. (@Tj=25°C 100Krad (a)) Table Symbol IDSS IGSS V(BR)DSS VGS(th) RDS(on) On/off states Parameter Test conditions Min. Typ. ±100 Unit Zero gate voltage drain current BVDss (VGS Gate body leakage current (VDS Drain-source breakdown voltage Gate threshold voltage Static drain-source resistance ±18V 250µA, =VGS, 12V, 0.060 0.067 According ESCC 22900 specification, Co60 gamma rays, dose rate:0.1rad/sec. 5/12 Electrical characteristics STRH40P10FSY3 Table Single event effect, SOA(1) (Mev/(mg/cm2)) 55.9 Energy (MeV) Range (µm) @VGS0V Rad-Hard Power MOSFETs have been characterized heavy environment single event effect (SEE). Single event effect characterization illustrated Table Symbol ISDM IRRM IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current 40A, 40A, di/dt 100A/µs VDD= 45V, 25°C 40A, di/dt 100A/µs VDD= 45V, 150°C 3.45 5.90 Test conditions Min. Typ. Unit Pulse width limited safe operating area Pulsed: pulse duration 300µs, duty cycle 1.5% 6/12 STRH40P10FSY3 Electrical characteristics Figure Electrical characteristics (curves) Safe operating area Figure Thermal impedance Figure Output characteristics Figure Transfer characteristics Figure Gate charge gate-source voltage Figure Capacitance variations 7/12 Electrical characteristics Figure Normalized BVDSS temperature Figure STRH40P10FSY3 Static drain-source resistance Figure Normalized gate threshold voltage temperature Figure Normalized resistance temperature Figure Source drain-diode forward characteristics 8/12 STRH40P10FSY3 Test circuit Test circuit Figure Switching times test circuit resistive load driver slope 1V/ns DUT) 9/12 Package mechanical data STRH40P10FSY3 Package mechanical data TO-254AA MECHANICAL DATA MIN. 13.59 13.59 20.07 6.32 1.02 3.53 16.89 6.86 0.89 3.81 3.81 12.95 3.05 0.71 1.65 0.065 14.50 0.510 0.120 0.025 0.040 1.14 0.035 0.150 0.150 0.570 MAX. 13.84 13.84 20.32 6.60 1.27 3.78 17.40 MIN. 0.535 0.535 0.790 0.249 0.040 0.139 0.665 0.270 0.045 inch TYP. MAX. 0.545 0.545 0.80 0.260 0.050 0.149 0.685 DIM. 10/12 STRH40P10FSY3 Revision history Revision history Table Date 05-Jul-2006 18-Dec-2006 28-Dec-2006 17-Jan-2007 19-Mar-2007 Revision history Revision First release Figure been updated Text typo description Figure been updated Complete version Changes 11/12 STRH40P10FSY3 Please Read Carefully: Information this document provided solely connection with products. STMicroelectronics subsidiaries ("ST") reserve right make changes, corrections, modifications improvements, this document, products services described herein time, without notice. products sold pursuant ST's terms conditions sale. Purchasers solely responsible choice, selection products services described herein, assumes liability whatsoever relating choice, selection products services described herein. license, express implied, estoppel otherwise, intellectual property rights granted under this document. part this document refers third party products services shall deemed license grant such third party products services, intellectual property contained therein considered warranty covering manner whatsoever such third party products services intellectual property contained therein. UNLESS OTHERWISE FORTH ST'S TERMS CONDITIONS SALE DISCLAIMS EXPRESS IMPLIED WARRANTY WITH RESPECT AND/OR SALE PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES MERCHANTABILITY, FITNESS PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER LAWS JURISDICTION), INFRINGEMENT PATENT, COPYRIGHT OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED WRITING AUTHORIZED REPRESENTATIVE, PRODUCTS RECOMMENDED, AUTHORIZED WARRANTED MILITARY, CRAFT, SPACE, LIFE SAVING, LIFE SUSTAINING APPLICATIONS, PRODUCTS SYSTEMS WHERE FAILURE MALFUNCTION RESULT PERSONAL INJURY, DEATH, SEVERE PROPERTY ENVIRONMENTAL DAMAGE. PRODUCTS WHICH SPECIFIED "AUTOMOTIVE GRADE" ONLY USED AUTOMOTIVE APPLICATIONS USER'S RISK. Resale products with provisions different from statements and/or technical features forth this document shall immediately void warranty granted product service described herein shall create extend manner whatsoever, liability logo trademarks registered trademarks various countries. Information this document supersedes replaces information previously supplied. logo registered trademark STMicroelectronics. other names property their respective owners. 2007 STMicroelectronics rights reserved STMicroelectronics group companies Australia Belgium Brazil Canada China Czech Republic Finland France Germany Hong Kong India Israel Italy Japan Malaysia Malta Morocco Singapore Spain Sweden Switzerland United Kingdom United States America www.st.com 12/12 Other recent searchesXRT6164 - XRT6164 XRT6164 Datasheet T-51866D121J-FW-A-AA - T-51866D121J-FW-A-AA T-51866D121J-FW-A-AA Datasheet LITPD193 - LITPD193 LITPD193 Datasheet D01EVR - D01EVR D01EVR Datasheet AN2512 - AN2512 AN2512 Datasheet
Privacy Policy | Disclaimer |