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P-channel 100V 0.265 TO-257AA Rad-hard gate charge STripFETPower MOSFE
Top Searches for this datasheetSTRH12P10ESY3 P-channel 100V 0.265 TO-257AA Rad-hard gate charge STripFETPower MOSFET Type STRH12P10ESY3 VDSS 100V RDS(on) Fast switching Single event effect (SEE) hardned total gate charge Light weight 100% avalanche tested Application oriented characterization Hermetically sealed Heavy 100kRad SEGR with ions TO-257AA Internal schematic diagram Description This Power MOSFET series realized with STMicroelectronics unique STripFET process specifically been designed sustain high provide immunity heavy effects. therefore suitable power switch mainly highefficiency DC-DC converters. also intended application with gate charge drive requirements. Application Satellite High reliability Order codes Part number STRH12P10ESY1 STRH12P10ESY3 temp range Space flights parts (full flow screening) Marking RH12P10ESY1 RH12P10ESY3 Package TO-257AA TO-257AA Packaging Individual strip pack Individual strip pack March 2007 1/12 www.st.com Contents STRH12P10ESY3 Contents Electrical ratings Electrical characteristics Pre-irradiation Post-irradiation Electrical characteristics (curves) Test circuit Package mechanical data Revision history 2/12 STRH12P10ESY3 Electrical ratings Electrical ratings Table Symbol Absolute maximum ratings (pre-irradiation) Parameter Drain-source voltage (VGS Gate-source voltage Drain current (continuous) 25°C Drain current (continuous) 100°C Drain current (pulsed) Total dissipation 25°C Value Unit V/ns PTOT dv/dt Peak diode recovery voltage slope Tstg Storage temperature Max. operating junction temperature Rated according Rthj-case Rthc-s Pulse width limited safe operating area 12A, di/dt 36A/µs, 80%V(BR)DSS Table Symbol Thermal data Parameter Value 1.47 62.5 Unit °C/W °C/W °C/W Rthj-case Thermal resistance junction-case Rthc-s Case-to-sink Rthj-amb Thermal resistance junction -amb Table Symbol Avalanche characteristics Parameter Avalanche current, repetitive not-repetitive (pulse width limited Max) Single pulse avalanche energy (starting Tj=25°C, ID=IAR, VDD=50V) Repetitive avalanche Value Unit Note: P-channel MOSFET actual polarity voltages current reversed 3/12 Electrical characteristics STRH12P10ESY3 Electrical characteristics (TCASE 25°C unless otherwise specified) Pre-irradiation Table Symbol IDSS IGSS V(BR)DSS VGS(th) RDS(on) On/off states Parameter Zero gate voltage drain current (VGS Gate body leakage current (VDS Drain-source breakdown voltage Gate threshold voltage Static drain-source resistance Test conditions BVDss ±18V 250µA, =VGS, 12V, 0.265 Min. Typ. ±100 Unit Table Symbol Ciss Coss Crss Dynamic Parameter Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-source charge Gate-drain charge Test conditions 25V, f=1MHz, VGS=0V 50V, VGS=12V f=1MHz Gate Bias=0 Test signal level=20mV open drain Min. Typ. 1303 65.6 Unit Gate input resistance Table Symbol td(on) td(off) Switching times Parameter Turn-on delay time Rise time Turn-off-delay time Fall time Test conditions Min. Typ. Unit 80V, 12A, 4.7, 4/12 STRH12P10ESY3 Electrical characteristics Table Symbol ISDM IRRM IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current 12A, 12A, di/dt 100A/µs VDD= 25°C 12A, di/dt 100A/µs VDD= 150°C Test conditions Min. Typ. Unit Pulse width limited safe operating area Pulsed: pulse duration 300µs, duty cycle 1.5% Post-irradiation Rad-Hard Power MOSFETs tested verify radiation capability. technology extremely resistant assurance well functioning device inside radiation environments. Every manufacturing tested total ionizing dose. (@Tj=25°C 100Krad (a)) Table Symbol IDSS IGSS V(BR)DSS VGS(th) RDS(on) On/off states Parameter Zero gate voltage drain current (VGS Gate body leakage current (VDS Drain-source breakdown voltage Gate threshold voltage Static drain-source resistance Test conditions BVDss ±18V 250µA, =VGS, 12V, 0.265 Min. Typ. ±100 Unit According ESCC 22900 specification, Co60 gamma rays, dose rate:0.1rad/sec. 5/12 Electrical characteristics STRH12P10ESY3 Table Single event effect, SOA(1) (Mev/(mg/cm2)) 55.9 Energy (MeV) Range (µm) @VGS0V Rad-Hard Power MOSFETs have been characterized heavy environment single event effect (SEE). Single event effect characterization illustrated Table Symbol ISDM IRRM IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current 12A, 12A, di/dt 100A/µs VDD= 25°C 12A, di/dt 100A/µs VDD= 150°C Test conditions Min. Typ. Unit Pulse width limited safe operating area Pulsed: pulse duration 300µs, duty cycle 1.5% 6/12 STRH12P10ESY3 Electrical characteristics Figure Electrical characteristics (curves) Safe operating area Figure Thermal impedance Figure Output characteristics Figure Transfer characteristics Figure Gate charge gate-source voltage Figure Capacitance variations 7/12 Electrical characteristics Figure Normalized BVDSS temperature Figure STRH12P10ESY3 Static drain-source resistance Figure Normalized gate threshold voltage temperature Figure Normalized resistance temperature Figure Source drain-diode forward characteristics 8/12 STRH12P10ESY3 Test circuit Test circuit Figure Switching times test circuit resistive load driver slope 1V/ns DUT) 9/12 Package mechanical data STRH12P10ESY3 Package mechanical data TO-257AA MECHANICAL DATA DIM. 1.65 15.2 2.29 0.71 0.065 3.56 1.02 3.68 13.51 5.26 0.76 3.05 2.54 16.5 0.598 0.090 0.028 3.81 0.140 MIN. 10.54 10.54 16.64 5.33 0.185 0.40 0.145 0.532 0.207 0.030 0.120 0.100 0.650 0.150 MAX. MIN. inch TYP. 0.415 0.415 0.655 0.210 MAX. 0117268C 10/12 STRH12P10ESY3 Revision history Revision history Table Date 20-Dec-2006 19-Mar-2007 Revision history Revision First release Complete version Changes 11/12 STRH12P10ESY3 Please Read Carefully: Information this document provided solely connection with products. STMicroelectronics subsidiaries ("ST") reserve right make changes, corrections, modifications improvements, this document, products services described herein time, without notice. products sold pursuant ST's terms conditions sale. 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