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N-channel 250V 0.95 TO-257AA Rad-hard gate charge STripFETPower MOSFET
Top Searches for this datasheetSTRH10N25ESY3 N-channel 250V 0.95 TO-257AA Rad-hard gate charge STripFETPower MOSFET Type STRH10N25ESY3 VDSS 250V RDS(on) Fast switching Single event effect (SEE) hardned total gate charge Light weight 100% avalanche tested Application oriented characterization Hermetically sealed Heavy 100kRad SEGR with ions TO-257AA Internal schematic diagram Description This Power MOSFET series realized with STMicroelectronics unique STripFET process specifically been designed sustain high provide immunity heavy effects. therefore suitable power switch mainly highefficiency DC-DC converters. also intended application with gate charge drive requirements. Applications Satellite High reliability applications Order codes Part number STRH10N25ESY1 STRH10N25ESY3 temp range Space flights parts (full flow screening) Marking RH10N25ESY1 RH10N25ESY3 Package TO-257AA TO-257AA Packaging Tube Tube March 2007 1/12 www.st.com Contents STRH10N25ESY3 Contents Electrical ratings Electrical characteristics Pre-irradiation Radiation characteristics Electrical characteristics (curves) Test circuit Package mechanical data Revision history 2/12 STRH10N25ESY3 Electrical ratings Electrical ratings Table Symbol Absolute maximum ratings (pre-irradiation) Parameter Drain-source voltage (VGS Gate-source voltage Drain current (continuous) 25°C Drain current (continuous) 100°C Drain current (pulsed) Total dissipation 25°C Peak diode recovery voltage slope Storage temperature Max. operating junction temperature Value Unit V/ns PTOT dv/dt Tstg Rated according Rthj-case Pulse width limited safe operating area 12A, di/dt 300A/µs, 80%V(BR)DSS Table Symbol Thermal data Parameter Value 1.47 62.5 Unit °C/W °C/W °C/W Rthj-case Thermal resistance junction-case Rthc-s Case-to-sink Rthj-amb Thermal resistance junction -amb Table Symbol Avalanche characteristics Parameter Avalanche current, repetitive not-repetitive (pulse width limited Max) Single pulse avalanche energy (starting Tj=25°C, Id=Iar, Vdd=50V) Repetitive avalanche Value Unit 3/12 Electrical characteristics STRH10N25ESY3 Electrical characteristics (TCASE 25°C unless otherwise specified) Pre-irradiation Table Symbol IDSS IGSS BVDSS VGS(th) RDS(on) On/off states Parameter Zero gate voltage drain current (VGS Gate body leakage current (VDS Drain-to-source breakdown voltage Gate threshold voltage Static drain-source resistance Test conditions BVDss ±16V 1mA, =VGS, 12V, 0.95 Min. Typ. Max. ±100 Unit Table Symbol Ciss Coss Crss Dynamic Parameter Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-to-source charge Gate-to-drain ("Miller") charge Gate input resistance Test conditions f=1MHz, VGS=12V Min. Typ. Max. Unit 200V, VGS=12V f=1MHz Gate Bias=0 Test signal level=20mV open drain 4/12 STRH10N25ESY3 Electrical characteristics Table Symbol td(on) td(off) Switching times Parameter Turn-on delay time Rise time Turn-off-delay time Fall time Test conditions Min. Typ. Unit 125V, 10A, 4.7, Table Symbol ISDM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current 10A, 12A, di/dt 100A/µs VDD= 62V, 25°C 12A, di/dt 100A/µs VDD= 62V, 150°C 19.5 Test conditions Min. Typ. Unit IRRM IRRM Pulse width limited safe operating area Pulsed: pulse duration 300µs, duty cycle 1.5% Radiation characteristics Rad-Hard Power MOSFETs tested verify radiation capability. technology extremely resistant assurance well functioning device inside radiation environments. Every manufacturing tested total ionizing dose. (@Tj=25°C 100Krad (a)) Table Symbol IDSS IGSS BVDSS VGS(th) RDS(on) On/off states Parameter Zero gate voltage drain current (VGS Gate body leakage current (VDS Drain-to-source breakdown voltage Gate threshold voltage Static drain-source resistance Test conditions BVDss ±16V 1mA, =VGS, 12V, 0.95 Min. Typ. Max. ±100 Unit According ESCC 22900 specification, Co60 gamma rays, dose rags:0.01rad/sec. 5/12 Electrical characteristics STRH10N25ESY3 Table Single event effect, SOA(1) (Mev/(mg/cm2)) 55.9 Energy (MeV) Range (µm) @VGS0V Rad-Hard Power MOSFETs have been characterized heavy environment single event effect (SEE). Single event effect characterization illustrate Table Symbol ISDM IRRM IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current 10A, 12A, di/dt 100A/µs VDD= 62V, 25°C 12A, di/dt 100A/µs VDD= 62V, 150°C 19.5 Test conditions Min. Typ. Unit Pulse width limited safe operating area Pulsed: pulse duration 300µs, duty cycle 1.5% 6/12 STRH10N25ESY3 Electrical characteristics Figure Electrical characteristics (curves) Safe operating area Figure Thermal impedance Figure Output characteristics Figure Transfer characteristics Figure Gate charge gate-source voltage Figure Capacitance variations 7/12 Electrical characteristics Figure Normalized BVDSS temperature Figure STRH10N25ESY3 Static drain-source resistance Figure Normalized gate threshold voltage temperature Figure Normalized resistance temperature Figure Source drain-diode forward characteristics 8/12 STRH10N25ESY3 Test circuit Test circuit Figure Switching times test circuit resistive load driver slope 1V/ns DUT) 9/12 Package mechanical data STRH10N25ESY3 Package mechanical data TO-257AA MECHANICAL DATA DIM. 1.65 15.2 2.29 0.71 0.065 3.56 1.02 3.68 13.51 5.26 0.76 3.05 2.54 16.5 0.598 0.090 0.028 3.81 0.140 MIN. 10.54 10.54 16.64 5.33 0.185 0.40 0.145 0.532 0.207 0.030 0.120 0.100 0.650 0.150 MAX. MIN. inch TYP. 0.415 0.415 0.655 0.210 MAX. 0117268C 10/12 STRH10N25ESY3 Revision history Revision history Table Date 18-Dec-2006 26-Mar-2007 Revision history Revision First release Complete version Changes 11/12 STRH10N25ESY3 Please Read Carefully: Information this document provided solely connection with products. STMicroelectronics subsidiaries ("ST") reserve right make changes, corrections, modifications improvements, this document, products services described herein time, without notice. products sold pursuant ST's terms conditions sale. 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