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N-channel 0.011 TO-254AA Rad-hard gate charge STripFETPower MOSFET
Top Searches for this datasheetSTRH100N6FSY3 N-channel 0.011 TO-254AA Rad-hard gate charge STripFETPower MOSFET Type STRH100N6FSY3 VDSS RDS(on) Fast switching Single event effect (SEE) hardned total gate charge Light weight 100% avalanche tested Application oriented characterization Hermetically sealed Heavy 100kRad SEGR with ions TO-254AA Internal schematic diagram Description This Power MOSFET series realized with STMicroelectronics unique STripFET process specifically been designed sustain high provide immunity heavy effects. therefore suitable power switch mainly highefficiency DC-DC converters. also intended application with gate charge drive requirements. Applications Satellite High reliability Order codes Part number STRH100N6FSY1 STRH100N6FSY3 temp range Space flights parts (full flow screening) Marking RH100N6FSY1 RH100N6FSY3 Package TO-254AA TO-254AA Packaging Individual strip pack Individual strip pack March 2007 1/12 www.st.com Contents STRH100N6FSY3 Contents Electrical ratings Electrical characteristics Pre-irradiation Post-irradiation Electrical characteristics (curves) Test circuit Package mechanical data Revision history 2/12 STRH100N6FSY3 Electrical ratings Electrical ratings Table Symbol Absolute maximum ratings (pre-irradiation) Parameter Drain-source voltage (VGS Gate-source voltage Drain current (continuous) 25°C Drain current (continuous) 100°C Drain current (pulsed) Total dissipation 25°C Peak diode recovery voltage slope Storage temperature Max. operating junction temperature Value Unit V/ns PTOT dv/dt Tstg This value limited package Pulse width limited safe operating area This value rated according Rthj-case Rthc-s 80A, di/dt 600A/µs, 80%V(BR)DSS Table Symbol Thermal data Parameter Value 0.52 0.21 Unit °C/W °C/W °C/W Rthj-case Thermal resistance junction-case Rthc-s Case-to-sink Rthj-amb Thermal resistance junction-amb Table Symbol Avalanche characteristics Parameter Avalanche current, repetitive not-repetitive (pulse width limited max) Single pulse avalanche energy (starting Tj=25°C, Id=Iar, Vdd=32V) Repetitive avalanche Value 1374 Unit 3/12 Electrical characteristics STRH100N6FSY3 Electrical characteristics (TCASE 25°C unless otherwise specified) Pre-irradiation Table Symbol IDSS IGSS BVDSS VGS(th) RDS(on) On/off states Parameter Zero gate voltage drain current (VGS Gate body leakage current (VDS Drain-to-source breakdown voltage Gate threshold voltage Static drain-source resistance Test conditions BVDss ±14V =VGS, 0.011 0.012 Min. Typ. Max. ±100 Unit Table Symbol Ciss Coss Crss Dynamic Parameter Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-to-source charge Gate-to-drain ("Miller") charge Gate input resistance Test conditions Min. Typ. 6800 1128 178.5 32.6 Max. Unit 25V, f=1MHz 30V, 40A, VGS=12V f=1MHz Gate Bias=0 Test signal level=20mV open drain Table Symbol td(on) td(off) Switching times Parameter Turn-on delay time Rise time Turn-off-delay time Fall time Test conditions Min. Typ. Unit 30V, 40A, 4.7, 4/12 STRH100N6FSY3 Electrical characteristics Table Symbol ISDM IRRM IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current 80A, 80A, di/dt 100A/µs VDD= 30V, 25°C 80A, di/dt 100A/µs VDD= 30V, 150°C 30.8 Test conditions Min. Typ. Unit This value limited package Pulse width limited safe operating area Pulsed: pulse duration 300µs, duty cycle 1.5% Post-irradiation Rad-Hard Power MOSFETs tested verify radiation capability. technology extremely resistant assurance well functioning device inside radiation environments. Every manufacturing tested total ionizing dose. (@Tj=25°C 100Krad (a)) Table Symbol IDSS IGSS BVDSS VGS(th) RDS(on) On/off states Parameter Test conditions Min. Typ. Max. Unit ±100 Zero gate voltage drain current BVDss (VGS Gate body leakage current (VDS Drain-to-source breakdown voltage Gate threshold voltage Static drain-source resistance ±14V =VGS, 0.011 0.012 According ESCC 22900 specification, Co60 gamma rays, dose rags:0.1rad/sec. 5/12 Electrical characteristics STRH100N6FSY3 Table Single event effect, SOA(1) (Mev/(mg/cm2)) 55.9 Energy (MeV) Range (µm) @VGS0V Rad-Hard Power MOSFETs have been characterized heavy environment single event effect (SEE). Single event effect characterization illustrated Table Symbol ISDM IRRM IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current 80A, 80A, di/dt 100A/µs VDD= 30V, 25°C 80A, di/dt 100A/µs VDD= 30V, 150°C 30.8 Test conditions Min. Typ. Unit This value limited package Pulse width limited safe operating area Pulsed: pulse duration 300µs, duty cycle 1.5% 6/12 STRH100N6FSY3 Electrical characteristics Figure Electrical characteristics (curves) Safe operating area Figure Thermal impedance Figure Output characteristics Figure Transfer characteristics Figure Gate charge gate-source voltage Figure Capacitance variations 7/12 Electrical characteristics Figure Normalized BVDSS temperature Figure STRH100N6FSY3 Static drain-source resistance Figure Normalized gate threshold voltage temperature Figure Normalized resistance temperature Figure Source drain-diode forward characteristics 8/12 STRH100N6FSY3 Test circuit Test circuit Figure Switching times test circuit resistive load driver slope 1V/ns DUT) 9/12 Package mechanical data STRH100N6FSY3 Package mechanical data TO-254AA MECHANICAL DATA MIN. 13.59 13.59 20.07 6.32 1.02 3.53 16.89 6.86 0.89 3.81 3.81 12.95 3.05 0.71 1.65 0.065 14.50 0.510 0.120 0.025 0.040 1.14 0.035 0.150 0.150 0.570 MAX. 13.84 13.84 20.32 6.60 1.27 3.78 17.40 MIN. 0.535 0.535 0.790 0.249 0.040 0.139 0.665 0.270 0.045 inch TYP. MAX. 0.545 0.545 0.80 0.260 0.050 0.149 0.685 DIM. 10/12 STRH100N6FSY3 Revision history Revision history Table Date 03-Jul-2006 18-Dec-2006 15-Mar-2007 Revision history Revision First release Figure been updated Complete version Changes 11/12 STRH100N6FSY3 Please Read Carefully: Information this document provided solely connection with products. STMicroelectronics subsidiaries ("ST") reserve right make changes, corrections, modifications improvements, this document, products services described herein time, without notice. products sold pursuant ST's terms conditions sale. 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