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SMP80MC

TRISIL for telecom equipment protection

SMP80MC
TRISIL for telecom equipment protection
Features
Main applications
Any sensitive equipment requiring protection against lightning strikes and power crossing:
Order codes
Part Number SMP80MC-120 SMP80MC-140 SMP80MC-160 SMP80MC-200 SMP80MC-230 Marking TP12 TP14 TP16 TP20 TP23 TP27 TP32
Terminals (phone, fax, modem..) and central office equipment
Description
The SMP80MC is a series of micro capacitance transient surge arrestors designed for the protection of high debit rate communication equipment on CPE side. Its micro capacitance avoids any distortion of the signal and is compatible with digital transmission like ADSL2 and ADSL2+.
SMP80MC-270 SMP80MC-320
Schematic diagram
Benefits
Trisils are not subject to ageing and provide a fail safe mode in short circuit for a better protection. They are used to help equipment to meet main standards such as UL1950, IEC950 / CSA C22.2 and UL1459. They have UL94 V0 approved resin. SMB package is JEDEC registered (DO-214AA). Trisils comply with the following standards GR1089 Core, ITU-T-K20 / K21, VDE0433, VDE0878, IEC61000-4-5 and FCC part 68.
TM: TRISIL is a trademark of STMicroelectronics.
January 2007
www.st.com 10
Characteristics
SMP80MC
Characteristics
Table 1. Complies with the following standards
Peak Surge Voltage (V) 2500 1000 5000 1500 6000 1500 8000 15000 4000 2000 4000 2000 4000 4000 1500 800 1000 Required Waveform peak current Voltage (A) 2 / 10 µs 10 / 1000 µs 2 / 10 µs 2 / 10 µs 10 / 700 µs 1 / 60 ns 10 / 700 µs 1.2 / 50 µs 10 / 700 µs 1.2 / 50 µs 10 / 160 µs 10 / 560 µs 9 / 720 µs 500 100 500 100 150 37.5 Minimum serial Current resistor to meet waveform standard () 2 / 10 µs 10 / 1000 µs 2 / 10 µs 2 / 10 µs 5 / 310 µs 5 2.5 10 0 10 0 0 0 0 0 0 0 0 0 2.5 0 0
STANDARD GR-1089 Core First level GR-1089 Core Second level GR-1089 Core Intra-building ITU-T-K20 / K21 ITU-T-K20 (IEC61000-4-2) VDE0433 VDE0878 IEC61000-4-5 FCC Part 68, lightning surge type A FCC Part 68, lightning surge type B
ESD contact discharge ESD air discharge 100 50 100 50 100 100 200 100 25 5 / 310 µs 1 / 20 µs 5 / 310 µs 8 / 20 µs 10 / 160 µs 10 / 560 µs 5 / 320 µs
Table 2.
Symbol
Parameter
Conditions
Value 80 200 100 120 150 200 250 5 14 8 6.5 2 7.5 7.8
-55 to 150 150
Repetitive peak pulse current (see Figure 1)
IFS ITSM I2t Tstg Tj TL
Fail-safe mode : maximum current (1) Non repetitive surge peak on-state current (sinusoidal) I2t value for fusing
Storage temperature range Maximum junction temperature Maximum lead temperature for soldering during 10 s.
1. in fail safe mode, the device acts as a short circuit
SMP80MC Table 3.
Symbol Rth(j-a) Rth(j-l)
Characteristics Thermal resistances
Parameter Junction to ambient (with recommended footprint) Junction to leads Value 100 20 Unit ° C / W ° C / W
Table 4.
Symbol VRM VBR VBO IRM IPP IBO IH VR IR C
Parameter Stand-off voltage Breakdown voltage Breakover voltage Leakage current Peak pulse current Breakover current Holding current Continuous reverse voltage Leakage current at VR Capacitance Dynamic Static VBO(2) VBO @ IBO(3) max. V 120 140 160 5 200 230 270 320 V 155 180 205 255 295 345 400 max. V 155 180 205 255 295 345 400 800 150 12 25 max. mA
IRM @ VRM Types max. µA SMP80MC-120 SMP80MC-140 SMP80MC-160 SMP80MC-200 SMP80MC-230 SMP80MC-270 SMP80MC-320 2 V 108 126 144 180 207 243 290
IR @ VR(1) max. µA
IH(4) min. mA
C(5) typ. pF
C(6) typ. pF
Characteristics
SMP80MC
Figure 1.
Pulse waveform
Figure 2.
ITSM(A)
Non repetitive surge peak on-state current versus overload duration
Figure 3.
0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
On-state voltage versus on-state current (typical values)
Figure 4.
Relative variation of holding current versus junction temperature
IT(A)
VT(V)
Tj(°C)
Figure 5.
Relative variation of breakover voltage versus junction temperature
Figure 6.
Relative variation of leakage current versus junction temperature (typical values)
1.08 1.07 1.06 1.05 1.04 1.03 1.02 1.01 1.00 0.99 0.98 0.97 0.96 0.95 0.94 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 1.E+01 1.E+02 1.E+03
Tj(°C)
1.E+00 25 50
Tj(°C)
SMP80MC
Characteristics
Figure 7.
Relative variation of junction capacitance versus reverse voltage applied (typical values)
Zth(j-a) / Rth(j-a)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
tp(s)
VR(V)
Figure 9.
Test circuit 1 for dynamic IBO and VBO parameters
83 0.36 nF
Characteristics Figure 10. Test circuit 2 for IBO and VBO parameters
SMP80MC
1 / 4 IBO measurement
TEST PROCEDURE
Figure 11. Test circuit 3 for dynamic IH parameter
Surge generator
D.U.T
This is a GO-NOGO test which allows to confirm the holding current (IH) level in a functional test circuit.
TEST PROCEDURE
SMP80MC
Ordering Information Scheme
Package information
SMP80MC
Package information
Epoxy meets UL94, V0 SMB dimensions
Dimensions Ref.
Table 5.
Millimeters Min. Max. 2.45 0.20 2.20 0.40 5.60 4.60 3.95 1.50
Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.059
Figure 12. Footprint (dimensions in mm)
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
SMP80MC
Ordering information
Part Number SMP80MC-120 SMP80MC-140 SMP80MC-160 SMP80MC-200 SMP80MC-230 SMP80MC-270 SMP80MC-320 Marking TP12 TP14 TP16 TP20 TP23 TP27 TP32 SMB 0.11 g 2500 Tape and reel Package Weight Base qty Delivery mode
Revision history
Date September-2001 11-May-2005 20-Jun-2005 18-Jan-2007 Revision 1 2 3 4 First issue. New types introduction. Qualification of new types Reformatted to current standards. Added product SMP80MC-320 Description of Changes
SMP80MC
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